IP Library Granted Patent US 9,793,300
Granted Patent B2
US 9,793,300 · App. 14/900,960 · Granted Oct 17, 2017

Thin film transistor and circuit structure

Inventors: Xiaolin Wang (Beijing, CN); Xing Yao (Beijing, CN); Yoonsung Um (Beijing, CN); Seungwoo Han (Beijing, CN); Yunsik Im (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H01L27/124H01L27/0207H01L27/1255H01L29/41733H01L29/42384H01L29/786H01L29/78606
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Quick Facts
Patent No.
US 9,793,300
App. No.
14/900,960
Granted
Oct 17, 2017
Kind
B2
Abstract

The present disclosure provides a TFT and a circuit structure to improve the characteristics of the threshold voltage drift of the TFT. The TFT includes a gate electrode, a semiconductor layer, an etch stop layer, and a source electrode and a drain electrode connected to the semiconductor layer. The TFT further includes a stopping structure arranged over the etch stop layer. The stopping structure is electrically isolated from the source electrode and the drain electrode, and an orthogonal projection of the stopping structure onto the etch stop layer at least partially overlaps an orthogonal projection of the semiconductor layer onto the etch stop layer. The present disclosure improves the characteristics of the threshold voltage drift of the TFT.

Claims (27)

1. A circuit structure, comprising a thin film transistor (TFT), the TFT comprising a gate electrode, a semiconductor layer, an etch stop layer, and a source electrode and a drain electrode connected to the semiconductor layer;

wherein the TFT further comprises a stopping structure arranged over the etch stop layer; the stopping structure is electrically isolated from the source electrode and the drain electrode; and an orthogonal projection of the stopping structure onto the etch stop layer at least partially overlaps an orthogonal projection of the semiconductor layer onto the etch stop layer;

wherein the stopping structure is made of conductive metal;

the stopping structure is located within an area between the source electrode and the drain electrode; and

the stopping structure is spaced from both of the source electrode and the drain electrode;

wherein the circuit structure further comprises a capacitor structure comprising a first polar plate and a second polar plate which is formed by the gate electrode of the TFT, and the first polar plate is arranged at a layer identical to the source electrode and the drain electrode of the TFT and connected to the drain electrode of the TFT;

wherein the circuit structure is a shift register unit;

the source electrode and the drain electrode of the TFT are connected to a signal input node and a signal output node, respectively;

the gate electrode of the TFT is connected to a pull-up node; and

one end of the capacitor structure is connected to the pull-up node, and the other end of the capacitor structure is connected to the signal output node.

2. The circuit structure according to claim 1 , wherein the orthogonal projection of the stopping structure onto the etch stop layer is located within a region where the orthogonal projection of the semiconductor layer onto the etch stop layer is located.

3. The circuit structure according to claim 1 , wherein the stopping structure, the source electrode and the drain electrode are formed by a single etching process.

4. The circuit structure according to claim 1 , wherein a length of a perpendicular line between parallel facing sides of the source electrode and the drain electrode is D; a width of the stopping structure in a direction parallel to the perpendicular line is W, and W/D is in a range of from 1/20 to 18/20.

5. The circuit structure according to claim 1 , wherein the source electrode and the drain electrode are of comb-like structures arranged opposite to each other in an interdigitated manner; teeth of the comb-like structures arranged opposite to each other in an interdigitated manner are divided into a plurality of tooth groups; a spacing distance between the adjacent tooth groups is greater than a distance between the adjacent teeth in the tooth group; the stopping structure is arranged between two adjacent teeth, one of which serves as the source electrode and the other one of which serves as the drain electrode; and the teeth adjacent to each other but belonging to different tooth groups serve as the drain electrode simultaneously or the source electrode simultaneously.

6. The circuit structure according to claim 1 , wherein the source electrode and the drain electrode are of comb-like structures arranged opposite to each other in an interdigitated manner; two teeth serving as the drain electrode are arranged between at least one pair of adjacent teeth serving as the source electrode; and the stopping structure is arranged between the adjacent teeth, one of which serves as the source electrode and the other one of which serves as the drain electrode.

7. The circuit structure according to claim 1 , wherein the drain electrode comprises:

a first comb handle electrically connected to the first polar plate; and

a first teeth row and a second teeth row arranged at two sides of the first comb handle, respectively, and electrically connected to the first comb handle, and

the source electrode comprises:

a second comb handle;

a third teeth row arranged at a side of the second comb handle, electrically connected to the second comb handle and arranged opposite to the first teeth row in an interdigitated manner;

a third comb handle electrically connected to the second comb handle; and

a fourth teeth row arranged at a side of the third comb handle, electrically connected to the third comb handle and arranged opposite to the second teeth row in an interdigitated manner;

wherein the stopping structure is arranged between the adjacent teeth, one of which serves as the source electrode and the other one of which serves as the drain electrode.

8. The circuit structure according to claim 7 , wherein the teeth arranged at at least one side of the first comb handle and arranged opposite to each other in an interdigitated manner are divided into a plurality of tooth groups; a spacing distance between the adjacent tooth groups is greater than a distance between the adjacent teeth in the tooth group; and the teeth adjacent to each other but belonging to different tooth groups serve as the drain electrode simultaneously or the source electrode simultaneously.

9. The circuit structure according to claim 8 , wherein an active layer under the first comb handle is removed.

10. The circuit according to claim 9 , wherein an extension part is further arranged on the first comb handle and extends into a gap between the adjacent tooth groups, and the active layer under the extension part is removed.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2015
From: WANG, XIAOLIN; YAO, XING; UM, YOONSUNG; HAN, SEUNGWOO; IM, YUNSIK
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 037371/0606 →
Priority Claims (1)
CN 2014 1 0855068 · Dec 31, 2014 · national
Continuity (1)
Related Publication 20160372487A1 · Dec 22, 2016