Capacitor structure

1. A capacitor structure comprising:

a silicon substrate with a first side and an opposite second side parallel to the first side,

a trench etched in the semiconductor substrate from the first side,

a double Metal Insulator Metal trench capacitor including along at least one stacking direction which is parallel to both the first side and the opposite second side of the silicon substrate:

a basis electrode forming a first conductive layer sunk in the trench and coupled to the substrate,

a first insulator layer stacked on the basis electrode in the trench,

a second conductive layer stacked on the first insulator layer in the trench,

a second insulator layer stacked on the second conductive layer in the trench, and

a third conductive layer stacked on the second insulator layer in the trench and coupled to the basis electrode,

wherein a second pad and a fourth pad are coupled to the basis electrode, wherein the second pad is located on the first side of the silicon substrate and the fourth pad is located on the opposite second side of the silicon substrate, and

in that a first pad and a third pad are coupled together and insulated from the silicon substrate and from the second pad and the fourth pad, the first pad being located on the first side of the silicon substrate, the third pad being located on the opposite second side of the silicon substrate, the third pad being coupled to the second conductive layer, and said second conductive layer being flush with or protruding from said opposite second side of the silicon substrate.

2. A capacitor structure according to claim 1 , wherein the second pad and the fourth pad are coupled by the silicon substrate to the basis electrode.

3. A capacitor structure according to claim 1 , wherein the first pad and the third pad are in line with each other along a direction perpendicular to both the first side and the opposite second side of the silicon substrate.

4. A capacitor structure according to claim 1 , wherein the second pad and the fourth pad are in line with each other along a direction perpendicular to both the first side and the opposite second side of the silicon substrate.

5. A capacitor structure according to claim 1 , wherein the third pad shorts the second conductive layer.

6. A capacitor structure according to claim 1 , wherein the pads are formed with copper.

7. A capacitor structure according to claim 1 , wherein the third pad covers more than 60% of the second conductive layer.

8. A capacitor structure according to claim 1 , wherein a third insulating layer is deposited on the third conductive layer and a fourth conductive layer is deposited on the third insulating layer.

9. A capacitor structure according to claim 8 , wherein the second and fourth conductive layers are coupled together, and the first and third conductive layers are coupled together.

10. A capacitor structure according to claim 1 , wherein it further comprises a bottom metal layer deposited on the opposite second side of the silicon substrate, said bottom metal layer being made of aluminium, titanium or copper, above a diffusion barrier layer, or in combination with nickel protected by thin gold, said bottom metal layer being adapted to allow deposition of a solderable layer.

11. An electronic device comprising more than one capacitor structure according to claim 1 , wherein a first pad and a second pad of a capacitor structure are soldered to a third pad and a fourth pad of a second neighbouring capacitor structure.

12. An electronic device according to claim 11 , wherein the capacitor structures are placed one above another.

13. A method for manufacturing an electronic device using two neighbouring capacitor structures each according to claim 1 , wherein it also comprises a step of:

soldering the first pad and the second pad of a first one of the capacitor structures to the third pad and the fourth pad of the second one of the capacitor structures.

14. A method for manufacturing an electronic device according to claim 13 , wherein the soldering step is a wafer bonding.

15. A method for manufacturing a capacitor structure comprising the steps of:

providing a silicon substrate having a first side and an opposite second side parallel to the first side,

forming a trench in the silicon substrate from the first side,

forming a basis electrode in the trench, and coupled to the substrate,

forming a double Metal Insulating Metal trench capacitor by stacking in the trench along at least one stacking direction which is parallel to both the first side and the opposite second side of the silicon substrate:

a first insulating layer on the basis electrode which forms a first conductive layer,

a second conductive layer on the first insulating layer,

a second insulating layer on the second conductive layer,

a third conductive layer on the second insulating layer,

etching the opposite second side of the silicon substrate until the first insulating layer,

etching the first insulating layer,

depositing a thick dielectric layer on the opposite second side,

processing a first pad in connection with the second conductive layer and a second pad in connection with the silicon substrate and the third conductive layer, the first pad and the second pad being placed on the first side, and

processing a third pad in connection with the second conductive layer and a fourth pad in connection with the silicon substrate, the third pad and the fourth pad being placed on the opposite second side.

16. A method for manufacturing a capacitor structure according to claim 15 , wherein it also comprises the steps of:

depositing a third insulator layer on the third conductive layer, and

depositing a fourth conductive layer on the third insulator layer.