IP Library › Granted Patent US 9,800,350
Granted Patent B2
US 9,800,350 · App. 13/730,728 · Granted Oct 24, 2017

Increased density SFP connector

Inventors: Jamyuen Ko (San Jose, CA); Qi Qi (Campbell, CA)
Assignee: Intel Corporation
H04B10/69H01R13/518H04B10/60
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Quick Facts
Patent No.
US 9,800,350
App. No.
13/730,728
Granted
Oct 24, 2017
Kind
B2
Abstract

A connector device includes a pluggable interface and a corresponding connector. The pluggable interface includes multiple rows of pads. Similarly, the connector includes multiple rows of contacts to contact the multiple rows of pads. The multiple rows of pads can further be subdivided where at least certain pad locations are subdivided into two smaller pads. At least certain pads can be disposed at angles other than right angles. The connector can include a cover with a mechanism to depress the second row of contacts. The depression mechanism is engaged via side wings on the cover engage with legacy plugs and avoid contact between the second row of contacts and the pads of the legacy plug.

Claims (11)

1. A connector device comprising:

a housing comprising a first surface and a second surface;

a first set of rows of electrical contacts on the first surface to connect to corresponding pads of a pluggable device, the first set of rows of the electrical contacts substantially perpendicular to a direction of insertion of the pluggable device;

a second set of rows of electrical contacts on the second surface substantially parallel to the first set of rows to connect to corresponding pads of the pluggable device, the second set of rows substantially perpendicular to the direction of insertion of the pluggable device; and

a cover over the housing, the cover including a side wing to engage with a legacy pluggable device, wherein at least one row of the first set of rows or the second set of rows is depressed using the side wing when the legacy pluggable device is engaged.

2. The connector device of claim 1 , wherein the first surface is a top surface facing away from a substrate on which the connector device is mounted.

3. The connector device of claim 1 , wherein the second surface is a bottom surface facing toward a substrate on which the connector device is mounted.

4. The connector device of claim 1 , wherein the second set of rows comprises at least three rows of electrical contacts.

5. The connector device of claim 1 , wherein the connector device comprises a connector for a small form factor pluggable (SFP) device.

6. The connector device of claim 1 , further comprising:

a spring mechanism in the cover to release depressing of the at least one row of the first set of rows or the second set of rows when the legacy pluggable device does not engage with the side wing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2013
From: KO, JAMYUEN; QI, QI
To: INTEL CORPORATION
Reel/Frame 029616/0773 →
Continuity (3)
Provisional Application 61589717 · Jan 23, 2012
Provisional Application 61590172 · Jan 24, 2012
Related Publication 20130189856A1 · Jul 25, 2013