Methods for removing contamination from surfaces in substrate processing systems
Methods for removing contamination from a surface disposed in a substrate processing system are provided herein. In some embodiments, a method for removing contaminants from a surface includes: providing a first process gas comprising a chlorine containing gas, a hydrogen containing gas, and an inert gas to a process chamber having the surface disposed within the process chamber; igniting the first process gas to form a plasma from the first process gas; and exposing the surface to the plasma to remove contaminants from the surface. In some embodiments, the surface is an exposed surface of a process chamber component. In some embodiments, the surface is a surface of a first layer disposed atop a substrate, such as a semiconductor wafer.
1. A method of removing contaminants from a surface of a first layer disposed atop a substrate, comprising:
providing a first process gas to a process chamber comprising a chlorine containing gas, a hydrogen containing gas, and an inert gas;
forming a plasma from the first process gas;
exposing the surface of the first layer disposed atop the substrate to the plasma, wherein the substrate is a semiconductor wafer; and
exposing the surface of the first layer to a second process gas comprising hydrogen (H 2 ) and tert-butyl-alcohol (TBA) at a temperature of about 600 degrees Celsius to about 650 degrees Celsius.
2. The method of claim 1 , further comprising:
exposing the surface of the first layer to a process gas comprising a Group III element and a Group V element to deposit a layer atop the first layer.
3. The method of claim 1 , wherein the first layer comprises one or more Group III-V materials.
4. The method of claim 1 , further comprising:
forming the plasma from the first process gas using an RF power source providing about 150 watts to about 300 watts of power at a frequency of about 13.56 MHz; and
applying a bias power to the substrate while exposing the surface of the first layer to the plasma, wherein the bias power is provided from an RF power source providing about 10 watts to about 50 watts of power.
5. The method of claim 4 , further comprising igniting the first process gas at a pressure of about 10 mTorr to about 30 mTorr.
6. The method of claim 4 , further comprising exposing the substrate to the second process gas at a pressure of about 10 Torr to about 80 Torr.
7. The method of claim 4 , further comprising exposing the substrate to the plasma for about 5 seconds to about 30 seconds and exposing the substrate to the second process gas for less than about 60 seconds.
8. A method for removing contaminants from a surface of a first layer disposed atop a semiconductor wafer disposed in a substrate processing system, comprising:
providing a first process gas comprising a chlorine containing gas, a hydrogen containing gas, and an inert gas to a process chamber having the surface disposed within the process chamber;
igniting the first process gas to form a plasma from the first process gas using an RF power source providing about 150 watts to about 300 watts of power at a frequency of about 13.56 MHz;
exposing the surface to the plasma to remove contaminants from the surface;
applying a bias power to the semiconductor wafer while exposing the surface of the first layer to the plasma, wherein the bias power is provided from an RF power source providing about 10 watts to about 50 watts of power; and
exposing the semiconductor wafer to a second process gas comprising hydrogen (H 2 ) and tert-butyl-alcohol (TBA) at a temperature of about 600 degrees Celsius to about 650 degrees Celsius.