Formation method of semiconductor device structure
One or more formation methods of a semiconductor device structure are provided. The method includes forming a dummy gate stack over a semiconductor substrate and forming spacer elements over sidewalls of the dummy gate stack. The method also includes removing the dummy gate stack to form a recess between the spacer elements. The method further includes partially removing the spacer elements such that an upper portion of the recess becomes wider. In addition, the method includes forming a metal gate stack in the recess and forming a protection element over the metal gate stack to fill the recess.
1. A method for forming a semiconductor device structure, comprising:
forming a dummy gate stack over a semiconductor substrate;
forming spacer elements over sidewalls of the dummy gate stack;
removing the dummy gate stack to form a recess between the spacer elements;
partially removing the spacer elements such that an upper portion of the recess becomes wider;
forming a metal gate stack in the recess;
forming a protection element over the metal gate stack to fill the recess; and
forming a conductive contact to electrically connect to a conductive feature over the semiconductor substrate such that the conductive contact is in direct contact with the spacer element.
2. The method for forming a semiconductor device structure as claimed in claim 1 , further comprising etching back the metal gate stack before the protection element is formed.
3. The method for forming a semiconductor device structure as claimed in claim 1 , wherein the conductive contact is in direct contact with the protection element.
4. The method for forming a semiconductor device structure as claimed in claim 1 , wherein the formation of the protection element comprises:
forming a protection material layer over the metal gate stack to fill the recess; and
removing the protection material layer outside of the recess such that a remaining portion of the protection material layer forms the protection element.
5. The method for forming a semiconductor device structure as claimed in claim 1 , further comprising forming a dielectric layer over the semiconductor substrate to surround the dummy gate stack and the spacer elements.
6. The method for forming a semiconductor device structure as claimed in claim 5 , wherein the formation of the protection element comprises:
forming a protection material layer over the metal gate stack to fill the recess; and
planarizing the protection material layer to forms the protection element such that top surfaces of the protection element and the dielectric layer are substantially coplanar with each other.
7. The method for forming a semiconductor device structure as claimed in claim 1 , wherein the partial removal of the spacer elements is performed using an etching process.
8. The method for forming a semiconductor device structure as claimed in claim 7 , wherein a reaction gas used in the etching process comprises CF 4 , O 2 , CHF 3 , N 2 , Ar, NF 3 , He, HBr, Cl 2 , SF 6 , CH 4 , or a combination thereof.
9. The method for forming a semiconductor device structure as claimed in claim 8 , wherein the composition of the reaction gas is varied during the etching process.
10. A method for forming a semiconductor device structure, comprising:
forming a dummy gate stack over a semiconductor substrate;
forming a spacer element over a sidewall of the dummy gate stack;
forming a dielectric layer over the semiconductor substrate to surround the spacer element and the dummy gate stack;
removing the dummy gate stack to form a recess surrounded by the dielectric layer;
partially removing an upper portion of the spacer element to enlarge the recess;
forming a metal gate stack in the recess;
forming a protection element over the metal gate stack to fill the recess; and
forming a conductive contact to electrically connect to a conductive feature over the semiconductor substrate such that the conductive contact is directly above the spacer element.
11. The method for forming a semiconductor device structure as claimed in claim 10 , further comprising etching back the metal gate stack before the protection element is formed.
12. The method for forming a semiconductor device structure as claimed in claim 11 , wherein the formation of the protection element comprises:
forming a protection material layer over the metal gate stack to fill the recess after the etching back of the metal gate stack; and
removing the protection material layer outside of the recess such that a remaining portion of the protection material layer forms the protection element.
13. The method for forming a semiconductor device structure as claimed in claim 10 , wherein the conductive contact is in direct contact with the spacer element.
14. The method for forming a semiconductor device structure, as claimed in claim 10 , wherein the conductive contact is in direct contact with the spacer element and the protection element.
15. A method for forming a semiconductor device structure, comprising:
forming a dummy gate stack over a semiconductor substrate;
forming a spacer element over a sidewall of the dummy gate stack;
forming a dielectric layer over the semiconductor substrate to surround the spacer element and the dummy gate stack;
removing the dummy gate stack to form a recess surrounded by the dielectric layer;
partially etching an upper portion of the spacer element, wherein a reaction gas used in the partially etching of the upper portion of the spacer element comprises CF 4 , O 2 , CHF 3 , N 2 , Ar, NF 3 , He, HBr, Cl 2 , SF 6 , CH 4 , or a combination thereof;
forming a metal gate stack in the recess after partially etching the upper portion of the spacer element; and
forming a protection element over the metal gate stack to fill the recess.
16. The method for forming a semiconductor device structure as claimed in claim 15 , further comprising etching back the metal gate stack before the protection element is formed.
17. The method for forming a semiconductor device structure as claimed in claim 16 , wherein the formation of the protection element comprises:
forming a protection material layer over the metal gate stack to fill the recess after the etching back of the metal gate stack; and
planarizing the protection material layer to form the protection element.
18. The method for forming a semiconductor device structure as claimed in claim 15 , further comprising forming a conductive contact in the dielectric layer such that the conductive contact is in direct contact with the spacer element.
19. The method for forming a semiconductor device structure as claimed in claim 15 , further comprising forming a conductive contact in the dielectric layer such that the conductive contact is in direct contact with the spacer element and the protection element.
20. The method for forming a semiconductor device structure as claimed in claim 15 , wherein the composition of the reaction gas is varied during the partially etching of the upper portion of the spacer element.