Light emitting device package
A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.
1. A light emitting device package comprising:
a package body has a cavity;
a lead frame disposed in the cavity;
a heat radiating member disposed under the cavity;
a light emitting device disposed on the heat radiating member;
a bonding member disposed between the light emitting device and the heat radiating member; and
a bonding member fixing part disposed in the cavity and covering a side surface of the bonding member and a side surface of the light emitting device,
wherein the bonding member fixing part forms the bottom of the cavity,
wherein the heat radiating member has an extension part and the extension part vertically overlaps with the lead frame.
2. The light emitting device package according to claim 1 , further comprising a first electrode and a second electrode disposed under the package body.
3. The light emitting device package according to claim 2 , wherein the first electrode and the second electrode vertically overlap with the lead frame and the extension part of the heat radiating member.
4. The light emitting device package according to claim 1 , wherein a first portion of the lead frame is disposed in the package body.
5. The light emitting device package according to claim 4 , wherein a second portion of the lead frame is exposed from the package body and a width of the second portion of the lead frame is wider than a width of the first portion of the lead frame.
6. The light emitting device package according to claim 1 , wherein a top surface of the lead frame is higher than a top surface of the bonding member fixing part and is lower than a top surface of the light emitting device.
7. The light emitting device package according to claim 1 , wherein the cavity has at least one stepped portion.
8. The light emitting device package according to claim 2 , wherein at least one portion of the package body is disposed between the heat radiating member and the first electrode.
9. The light emitting device package according to claim 1 , wherein the lead frame comprises a first part and a second part, and each of the first part and the second part has a bending structure.
10. The light emitting device package according to claim 1 , wherein a zener diode is disposed on the package body.
11. The light emitting device package according to claim 1 , wherein a thickness of the bonding member fixing part is greater than a thickness of the bonding member and is smaller than a sum of the thickness of the bonding member and the height of the light emitting device.
12. The light emitting device package according to claim 1 , wherein the extension part of the heat radiating member is extended from a bottom surface of the heat radiating member.
13. The light emitting device package according to claim 2 , wherein a vertical distance between the lead frame and the extension part is longer than a vertical distance between the extension part and the first electrode.
14. The light emitting device package according to claim 1 , wherein a width of the heat radiating member is greater than a width of the light emitting device and the heat radiating member vertically overlaps with the light emitting device.
15. The light emitting device package according to claim 1 , wherein the bonding member fixing part contacts a top surface of the heat radiating member.