Electronic component, method of producing the same, and circuit substrate
An electronic component includes: a chip having first and second end surfaces oriented in a direction of a first axis, first and second main surfaces oriented in a direction of a second axis orthogonal to the first axis, first and second side surfaces oriented in a direction of a third axis orthogonal to the first and second axes, and first and second external electrodes respectively covering the first and second end surfaces and each extending to the first and second main surfaces and side surfaces; a covering portion covering the chip from the first main surface toward the second main surface; and exposed portions provided to the second main surface, including regions where the first and second external electrodes are exposed without being covered with the covering portion, and being pushed out toward the first main surface along ridges connecting the first and second end surfaces and side surfaces.
1. An electronic component, comprising:
a chip having
a first end surface and a second end surface, the first end surface and the second end surface being oriented in a direction of a first axis,
a first main surface and a second main surface, the first main surface and the second main surface being oriented in a direction of a second axis orthogonal to the first axis,
a first side surface and a second side surface, the first side surface and the second side surface being oriented in a direction of a third axis orthogonal to the first axis and the second axis, and
a first external electrode and a second external electrode, the first external electrode and the second external electrode respectively covering the first end surface and the second end surface and each extending to the first main surface, the second main surface, the first side surface, and the second side surface;
a covering portion, the covering portion covering the chip from the first main surface toward the second main surface; and
exposed portions, the exposed portions being provided to the second main surface of the chip, including regions where the first external electrode and the second external electrode are exposed without being covered with the covering portion, and being pushed out toward the first main surface at a plurality of corners connecting the first and second end surfaces to the first and second side surfaces more than they are pushed out at centers of the first and second end surfaces.
2. The electronic component according to claim 1 , wherein
the covering portion covers an entire region of the first main surface and exposes an entire region of the second main surface.
3. The electronic component according to claim 1 , wherein
the covering portion has a flat surface on the first main surface, the flat surface being perpendicular to the second axis.
4. The electronic component according to claim 1 , wherein
the chip further includes first internal electrodes and second internal electrodes, the first internal electrodes being connected to the first external electrode, the second internal electrodes being connected to the second external electrode, the first internal electrodes and the second internal electrodes being alternately disposed along the second axis.
5. The electronic component according to claim 1 , wherein
a solder does not wet up on the covering portion.
6. A circuit substrate, comprising:
a substrate having a mount surface; and
an electronic component mounted on the mount surface, the electronic component including
a chip having
a first end surface and a second end surface, the first end surface and the second end surface being oriented in a direction of a first axis,
a first main surface and a second main surface, the first main surface and the second main surface being oriented in a direction of a second axis orthogonal to the first axis,
a first side surface and a second side surface, the first side surface and the second side surface being oriented in a direction of a third axis orthogonal to the first axis and the second axis, and
a first external electrode and a second external electrode, the first external electrode and the second external electrode respectively covering the first end surface and the second end surface and each extending to the first main surface, the second main surface, the first side surface, and the second side surface,
a covering portion, the covering portion covering the chip from the first main surface toward the second main surface, and
exposed portions, the exposed portions being provided to the second main surface of the chip, including regions where the first external electrode and the second external electrode are exposed without being covered with the covering portion, and being pushed out toward the first main surface at a plurality of corners connecting the first and second end surfaces to the first and second side surfaces more than they are pushed out at centers of the first and second end surfaces,
wherein the second main surface being is disposed to face the mount surface, and the first external electrode and the second external electrode are soldered to the mount surface at the exposed portions.