IP Library › Granted Patent US 9,818,671
Granted Patent B2
US 9,818,671 · App. 14/618,753 · Granted Nov 14, 2017

Liquid-cooled heat sink for electronic devices

Inventor: Tai-Chi Huang (Union City, CA)
Assignee: Dynatron Corporation
H01L23/427G06F1/20H01L23/467H01L21/4882H01L23/367
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Quick Facts
Patent No.
US 9,818,671
App. No.
14/618,753
Granted
Nov 14, 2017
Kind
B2
Abstract

A heat sink includes a heat absorption module, a liquid transport module and a heat exchange module. The transport module includes one inlet and outlet tubes, each having a first end connected spatially with the heat absorption module. The heat exchange module includes a fin assembly, one fan unit and several connection passages extending through the fin assembly. One end portion of the fin assembly defines a liquid storage chamber, which is divided into several first chambers therein such that first ends of the connection passages extend respectively into the first chambers. The other end portion of the fin assembly defines two second chambers such that second ends of the connection passages extend respectively into the second chambers while a second end of each inlet and outlet tubes is connected spatially with a first and second pump units, which are in spatially communicated with the first chambers.

Claims (17)

1. A liquid-cooled heat sink including

a heat absorption module,

a liquid transport module and

a heat exchange module,

the liquid transport module including

at least one inlet tube and

an outlet tube, the at least one inlet tube has a first end and a second end, the outlet tube has a first end and a second end,

while each of the inlet and outlet tubes having a first end connected with the heat absorption module,

the heat exchange module including

a fin assembly with a first end portion and a second end portion,

at least one fan unit and

a plurality of connection passages extending through two opposite end portions of the fin assembly, each connection passage has a first end and a second end,

the liquid-cooled heat sink being characterized in that:

the first end portion of the fin assembly defining a liquid storage chamber, which is further divided into a plurality of first chambers therein such that first ends of the connection passages extend into the first chambers and the second end portion of the fin assembly defining a plurality of second chambers such that the second ends of the connection passages extend into the second chambers, a pump seat for enclosing a first pump unit and a second pump unit is attached to the liquid storage chamber and the second ends of both the at least one inlet tube and outlet tube are connected respectively with the first pump unit and the second pump unit.

2. The liquid-cooled heat sink according to claim 1 , where in the heat absorption module further comprises

a liquid storage container connected to the at least one inlet tube and the outlet tube; and

a mounting plate for connecting to a heat generating device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2015
From: HUANG, TAI-CHI
To: DYNATRON CORPORATION
Reel/Frame 034932/0225 →
Continuity (1)
Related Publication 20160234968A1 · Aug 11, 2016