Vertical transfer gate structure for a back-side illumination (BSI) complementary metal-oxide-semiconductor (CMOS) image sensor using global shutter capture

1. A method for manufacturing a back side illumination (BSI) image sensor, the method comprising:

forming a sacrificial dielectric layer over a semiconductor region;

performing a first etch into the sacrificial dielectric layer to form an opening exposing a photodetector in the semiconductor region;

forming a semiconductor column in the opening;

forming a floating diffusion region (FDR) covering the semiconductor column and overhanging the sacrificial dielectric layer;

performing a second etch into the sacrificial dielectric layer to remove the sacrificial dielectric layer, and to form a lateral recess between the FDR and the photodetector;

forming a gate dielectric layer lining a sidewall surface of the semiconductor column in the lateral recess; and

forming a gate filling the lateral recess and laterally spaced from the semiconductor column by the gate dielectric layer.

2. The method according to claim 1 , wherein forming the FDR comprises:

growing a FDR layer over and abutting the semiconductor column, and over the sacrificial dielectric layer; and

performing a third etch into the FDR layer to form the FDR with a sidewall surface laterally offset from a neighboring sidewall surface of the semiconductor column.

3. The method according to claim 1 , further comprising:

forming the FDR as an n-type epitaxial layer; and

forming the semiconductor column as an n- or p-type epitaxial layer.

4. The method according to claim 1 , wherein forming the gate comprises:

forming a gate liner layer confined to and lining the lateral recess; and

forming a gate filler layer filling the lateral recess.

5. The method according to claim 1 , further comprising:

forming the opening with a width that is less than or equal to about 0.2 micrometers.

6. The method according to claim 1 , further comprising:

forming an isolation region in the semiconductor region, laterally surrounding the photodetector.

7. The method according to claim 1 , further comprising:

forming a back-end-of-line (BEOL) stack over the FDR and the semiconductor region.

8. The method according to claim 7 , further comprising:

bonding the semiconductor region to a carrier substrate through the BEOL stack, such that the semiconductor region and the BEOL stack are over the carrier substrate;

forming a passivation layer over the semiconductor region, wherein the carrier substrate and the passivation layer are respectively under and over the semiconductor region;

forming a color filter over the passivation layer; and

forming a micro lens over the color filter.

9. The method according to claim 1 , further comprising:

performing the first etch into the sacrificial dielectric layer to form a second opening exposing the photodetector in the semiconductor region;

forming a second semiconductor column in the second opening;

forming a second FDR over the second semiconductor column and the sacrificial dielectric layer, wherein the second FDR is formed with a sidewall surface laterally offset from a neighboring sidewall surface of the second semiconductor column;

performing the second etch into the sacrificial dielectric layer to form a second lateral recess between the second FDR and the photodetector;

forming a second gate dielectric layer lining a sidewall surface of the second semiconductor column in the second lateral recess; and

forming a second gate filling the second lateral recess and laterally spaced from the second semiconductor column by the second gate dielectric layer.

10. The method according to claim 9 , further comprising:

forming the second opening with a width that is greater than a width of the opening.

11. A method for manufacturing a back side illumination (BSI) image sensor, the method comprising:

forming a sacrificial dielectric layer over a semiconductor region;

performing a first etch into the sacrificial dielectric layer to form an opening exposing a photodetector in the semiconductor region;

forming a semiconductor column in the opening;

growing a floating diffusion region (FDR) layer over and abutting the semiconductor column, and over the sacrificial dielectric layer;

performing a second etch into the FDR layer to form a FDR over the semiconductor column and the sacrificial dielectric layer, and with a sidewall surface laterally offset from a neighboring sidewall surface of the semiconductor column;

performing a third etch into the sacrificial dielectric layer to remove the sacrificial dielectric layer, and to form a lateral recess between the FDR and the photodetector;

forming a gate dielectric layer lining a sidewall surface of the semiconductor column in the lateral recess; and

forming a gate filling the lateral recess and laterally spaced from the semiconductor column by the gate dielectric layer.

12. The method according to claim 11 , further comprising:

forming the FDR as an n-type epitaxial layer; and

forming the semiconductor column as an n- or p-type epitaxial layer.

13. The method according to claim 11 , wherein the forming of the gate comprises:

forming a gate liner layer confined to and lining the lateral recess; and

forming a gate filler layer filling the lateral recess.

14. The method according to claim 11 , wherein the FDR is formed overhanging the sacrificial dielectric layer and with a T-shaped profile.

15. The method according to claim 11 , wherein the first etch is performed into the sacrificial dielectric layer and the semiconductor region to form the opening extending through the sacrificial dielectric layer, into the semiconductor region, and to the photodetector, wherein the semiconductor column is formed partially filling the opening, wherein the FDR is formed filling a remainder of the opening and overhanging the sacrificial dielectric layer, and wherein the FDR is doped differently than the semiconductor column.

16. The method according to claim 11 , further comprising:

forming a first etch stop layer over the semiconductor region, wherein the sacrificial dielectric layer is formed over the first etch stop layer; and

forming a second etch stop layer over the sacrificial dielectric layer, wherein the FDR overhangs the second etch stop layer, and wherein the first and second etch stop layers respectively define a bottom surface of the lateral recess and a top surface of the lateral recess.

17. The method according to claim 16 , wherein the second etch removes a portion of the second etch stop layer not covered by the FDR, without removing a portion of the second etch stop layer covered by the FDR.

18. The method according to claim 11 , wherein the forming of the gate dielectric layer comprises:

oxidizing an exposed portion of the semiconductor column in the lateral recess to form the gate dielectric layer lining the semiconductor column in the lateral recess, wherein the gate is formed in contact with the gate dielectric layer.

19. The method according to claim 11 , further comprising:

forming a second semiconductor region laterally spaced from the FDR and the semiconductor column, protruding through the sacrificial dielectric layer to the photodetector, and overhanging the sacrificial dielectric layer, wherein the second semiconductor region has a T-shaped profile, wherein the performing of the third etch forms a second lateral recess between the second semiconductor region and the photodetector, and wherein the second semiconductor region overhangs the second lateral recess; and

forming a second gate filling the second lateral recess and laterally spaced from the second semiconductor region.

20. A method for manufacturing a back side illumination (BSI) image sensor, the method comprising:

forming a sacrificial dielectric layer over a semiconductor region;

performing a first etch into the sacrificial dielectric layer to form an opening exposing a photodetector in the semiconductor region, and to further form a second opening exposing the photodetector in the semiconductor region;

forming a semiconductor column in the opening;

forming a second semiconductor column in the second opening;

forming a floating diffusion region (FDR) over the semiconductor column and the sacrificial dielectric layer, wherein the FDR is formed with a T-shaped profile;

forming a second FDR over the second semiconductor column and the sacrificial dielectric layer, wherein the second FDR is formed with a T-shaped profile;

performing a second etch into the sacrificial dielectric layer to remove the sacrificial dielectric layer, to form a lateral recess between the FDR and the photodetector, and to form a second lateral recess between the second FDR and the photodetector;

forming a gate dielectric layer lining a sidewall surface of the semiconductor column in the lateral recess;

forming a second gate dielectric layer lining a sidewall surface of the second semiconductor column in the second lateral recess;

forming a gate filling the lateral recess and laterally spaced from the semiconductor column by the gate dielectric layer; and

forming a second gate filling the second lateral recess and laterally spaced from the second semiconductor column by the second gate dielectric layer.