Electronic component device and manufacturing method thereof
An electronic component device includes a first electronic component, a second electronic component disposed on and connected to the first electronic component, a first underfill resin filled between the first electronic component and the second electronic component, the first underfill resin having a base part arranged around the second electronic component and an alignment mark formed on an upper surface of the base part, a third electronic component disposed on and connected to the second electronic component, and a second underfill resin filled between the second electronic component and the third electronic component.
1. An electronic component device comprising:
a first electronic component;
a second electronic component disposed on and connected to the first electronic component;
a first underfill resin filled between the first electronic component and the second electronic component, the first underfill resin having a base part arranged around the second electronic component and an alignment mark formed on an up surface of the base part, wherein, except for the alignment mark, the upper surface of the base part is coplanar with an upper surface of the second electronic component;
a third electronic component disposed on and connected to the second electronic component; and
a second underfill resin filled between the second electronic component and the third electronic component, the second underfill resin directly contacting all upper and side surfaces of the alignment mark.
2. The electronic component device according to claim 1 , wherein the alignment mark includes a convex portion of the base part of the first underfill resin.
3. The electronic component device according to claim 1 , wherein the second electronic component has a rectangular shape, as seen from above, and the alignment mark is arranged at least in a region outside a pair of apexes on a diagonal line of the second electronic component.
4. The electronic component device according to claim 1 , wherein the second underfill resin covers an upper surface of the base part of the first underfill resin and a side surface of the third electronic component.
5. The electronic component device according to claim 1 , wherein a side surface of the third electronic component is arranged in a region between a side surface of the second electronic component and a side surface of the base part of the first underfill resin.
6. The electronic component device according to claim 1 , wherein the third electronic component has an area greater than an area of the second electronic component.
7. The electronic component device according to claim 1 , wherein a material of the first underfill resin is different from a material of the second underfill resin.
8. A manufacturing method of an electronic component device, comprising:
forming a first sealing resin material on a first electronic component;
flip-chip connecting an electrode of a second electronic component to the first electronic component via the first sealing resin material so that a first underfill resin is filled between the first electronic component and the second electronic component while forming a base part having an alignment mark on an upper surface thereof around the second electronic component by the first underfill resin, wherein, except for the alignment mark, the upper surface of the base part is coplanar with an upper surface of the second electronic component;
aligning a position of a third electronic component relative to the second electronic component, based on image recognition of the alignment mark; and
flip-chip connecting an electrode of the third electronic component to the second electronic component via a second sealing resin material so that a second underfill resin is filled between the second electronic component and the third electronic component and the second underfill resin directly contacts all upper and side surfaces of the alignment mark.
9. A manufacturing method of an electronic component device, comprising:
forming a sealing resin material on a first electronic component;
pushing an electrode of a second electronic component into the sealing resin material to flip-chip connect the electrode to the first electronic component so that a first underfill resin is filled between the first electronic component and the second electronic component while forming a base part having an alignment mark on an upper surface thereof around the second electronic component by the first underfill resin, wherein, except for the alignment mark, the upper surface of the base part is coplanar with an upper surface of the second electronic component;
aligning a position of a third electronic component relative to the second electronic component, based on image recognition of the alignment mark;
flip-chip connecting the third electronic component on the second electronic component in a state that the third electronic component is disposed on the second electronic component; and
filling a second underfill resin between the second electronic component and the third electronic component, with the second underfill resin directly contacting all upper and side surfaces of the alignment mark.
10. The manufacturing method of an electronic component device according to claim 8 , wherein in the forming the base part having the alignment mark on the upper surface thereof by the first underfill resin,
the second electronic component is pushed into the first sealing resin material with being sucked to a bonding tool having an area greater than the second electronic component, a peripheral edge portion of the bonding tool being formed with a concave portion or a convex portion, and
a peripheral edge portion of the first sealing resin material is pressed by the peripheral edge portion of the bonding tool, so that the base part and the alignment mark are formed.
11. The manufacturing method of an electronic component device according to claim 9 , wherein in the forming the base part having the alignment mark on the upper surface thereof by the first underfill resin,
the second electronic component is pushed into the first sealing resin material with being sucked to a bonding tool having an area greater than the second electronic component, a peripheral edge portion of the bonding tool being formed with a concave portion or a convex portion, and
a peripheral edge portion of the first sealing resin material is pressed by the peripheral edge portion of the bonding tool, so that the base part and the alignment mark are formed.
12. The manufacturing method of an electronic component device according to claim 8 , wherein in the forming the base part having the alignment mark on the upper surface thereof by the first underfill resin,
the second electronic component has a rectangular shape, as seen from above, and the alignment mark is arranged at least in a region outside a pair of apexes on a diagonal line of the second electronic component.
13. The manufacturing method of an electronic component device according to claim 9 , wherein in the forming the base part having the alignment mark on the upper surface thereof by the first underfill resin,
the second electronic component has a rectangular shape, as seen from above, and the alignment mark is arranged at least in a region outside a pair of apexes on a diagonal line of the second electronic component.
14. The manufacturing method of an electronic component device according to claim 8 , wherein an area of the third electronic component is greater than an area of the second electronic component, and
wherein in the filling the second underfill resin, the second underfill resin covers an upper surface of the base part of the first underfill resin and a side surface of the third electronic component.
15. The manufacturing method of an electronic component device according to claim 9 , wherein an area of the third electronic component is greater than an area of the second electronic component, and
wherein in the filling the second underfill resin, the second underfill resin covers an upper surface of the base part of the first underfill resin and a side surface of the third electronic component.
16. The electronic component device according to claim 1 , wherein the alignment mark includes a concave portion of the base part of the first underfill resin.
17. The electronic component device according to claim 1 , wherein the alignment mark, as seen from above, has one of a circular shape, a rectangular shape, an L-shape, and a cross shape.
18. The electronic component device according to claim 1 , wherein the first electronic component is electrically connected to the second electronic component via an electrode.
19. The electronic component device according to claim 1 , wherein the second electronic component is electrically connected to the third electronic component via an electrode.
20. The electronic component device according to claim 1 , further comprising:
a mold resin sealing the first electronic component, the second electronic component, the third electronic component, the first underfill resin, and the second underfill resin.
21. The electronic component device according to claim 1 , wherein the first electronic component is a wiring substrate, and the second electronic component and the third electronic component are each a semiconductor chip.
22. The electronic component device according to claim 1 , wherein the first electronic component and the second electronic component are each a wiring substrate, and the third electronic component is a semiconductor chip.
23. The electronic component device according to claim 1 , wherein the first electronic component, the second electronic component, and the third electronic component are each a semiconductor chip.
24. The electronic component device according to claim 1 , wherein the first electronic component, the second electronic component, and the third electronic component are each a wiring substrate.