IP Library Granted Patent US 9,829,627
Granted Patent B2
US 9,829,627 · App. 15/201,479 · Granted Nov 28, 2017

Semiconductor device and method for manufacturing same

Inventor: Tatsuya Usami (Ibaraki, JP)
Assignee: Renesas Electronics Corporation
G02B6/122G02B6/13G02F1/025G02B2006/12061G02F2202/104
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Quick Facts
Patent No.
US 9,829,627
App. No.
15/201,479
Granted
Nov 28, 2017
Kind
B2
Abstract

Good optical properties can be achieved in an optical waveguide made of polycrystalline silicon. A semiconductor layer that constitutes each of a first optical signal line, a second optical signal line, a grating coupler, an optical modulator, and a p-type layer of a germanium optical receiver is formed by a polycrystalline silicon film. Crystal grains of polycrystalline silicon exposed on an upper surface of the semiconductor layer include crystal grains having flat surfaces parallel to a first main surface of a semiconductor substrate, and crystal grains of polycrystalline silicon exposed on side surfaces (including side surfaces of a protrusion of a protruding portion) of the semiconductor layer include crystal grains having flat surfaces perpendicular to the first main surface of the semiconductor substrate.

Claims (18)

1. A semiconductor device comprising:

a semiconductor substrate;

a first insulating film formed on a main surface of the semiconductor substrate;

a first optical waveguide formed on an upper surface of the first insulating film;

a second insulating film formed on the upper surface of the first insulating film so as to cover the first optical waveguide;

a second optical waveguide formed on an upper surface of the second insulating film; and

a third insulating film formed on the upper surface of the second insulating film so as to cover the second optical waveguide,

wherein the second optical waveguide is made of first polycrystalline silicon,

crystal grains of the first polycrystalline silicon exposed on an upper surface of the second optical waveguide include crystal grains having flat surfaces parallel to the main surface of the semiconductor substrate, and

crystal grains of the first polycrystalline silicon exposed on side surfaces of the second optical waveguide include crystal grains having flat surfaces perpendicular to the main surface of the semiconductor substrate.

2. The semiconductor device according to claim 1 ,

wherein the first optical waveguide is made of monocrystalline silicon.

3. The semiconductor device according to

claim 1 , wherein the first optical waveguide is made of second polycrystalline silicon,

crystal grains of the second polycrystalline silicon exposed on an upper surface of the first optical waveguide include crystal grains having flat surfaces parallel to the main surface of the semiconductor substrate, and

crystal grains of the second polycrystalline silicon exposed on side surfaces of the first optical waveguide include crystal grains having flat surfaces perpendicular to the main surface of the semiconductor substrate.

4. The semiconductor device according to claim 3 ,

wherein a diameter of the crystal grains of the first polycrystalline silicon and a diameter of the crystal grains of the second polycrystalline silicon are different from each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2016
From: USAMI, TATSUYA
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 039090/0558 →
Priority Claims (1)
JP 2015-158187 · Aug 10, 2015 · national
Continuity (1)
Related Publication 20170045683A1 · Feb 16, 2017