IP Library Granted Patent US 9,831,309
Granted Patent B2
US 9,831,309 · App. 15/017,818 · Granted Nov 28, 2017

Semiconductor device and manufacturing method thereof

Inventor: Hidekazu Miyairi (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/0688H01L27/1158H01L27/11273H01L27/11553H01L27/11556H01L27/11582H01L29/4236H01L29/7869H01L29/78642
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Quick Facts
Patent No.
US 9,831,309
App. No.
15/017,818
Granted
Nov 28, 2017
Kind
B2
Abstract

A miniaturized transistor having highly stable electrical characteristics is provided. Furthermore, high performance and high reliability of a semiconductor device including the transistor is achieved. The transistor includes a first electrode, a second electrode, a third electrode, an oxide semiconductor layer, a first insulating layer, and a second insulating layer. The transistor includes a first region and a second region surrounded by the first region. In the first region, the first insulating layer, the second electrode, the oxide semiconductor layer, and the second insulating layer are stacked. In the second region, the first electrode, the oxide semiconductor layer, the second insulating layer, and the third electrode are stacked.

Claims (44)

1. A semiconductor device comprising a transistor, the transistor comprising:

a first electrode;

a second electrode comprising a first opening;

a third electrode;

an oxide semiconductor layer;

a first insulating layer comprising a second opening; and

a second insulating layer,

wherein the first opening and the second opening overlap each other,

wherein the oxide semiconductor layer is in contact with the first electrode through the first opening and the second opening,

wherein the transistor includes a first region overlapping with the second electrode and a second region overlapping with the first opening and the second opening,

wherein in the first region, the first insulating layer, the second electrode, the oxide semiconductor layer, and the second insulating layer are stacked, and

wherein in the second region, the first electrode, the oxide semiconductor layer, the second insulating layer, and the third electrode are stacked.

2. A semiconductor device comprising a transistor, the transistor comprising:

a first electrode;

a second electrode;

a third electrode;

an oxide semiconductor layer;

a first insulating layer; and

a second insulating layer,

wherein the second electrode and the first insulating layer have an opening,

wherein a side surface and a bottom surface of the third electrode are covered with the second insulating layer, and

wherein the third electrode is embedded in the opening.

3. The semiconductor device according to claim 1 , wherein the first insulating layer contains oxygen.

4. The semiconductor device according to claim 1 ,

wherein the first electrode functions as one of a source electrode and a drain electrode, and

wherein the second electrode functions as the other of the source electrode and the drain electrode.

5. An electronic device comprising the semiconductor device according to claim 1 .

6. The semiconductor device according to claim 2 , wherein the first insulating layer contains oxygen.

7. The semiconductor device according to claim 2 ,

wherein the first electrode functions as one of a source electrode and a drain electrode, and

wherein the second electrode functions as the other of the source electrode and the drain electrode.

8. An electronic device comprising the semiconductor device according to claim 2 .

9. A semiconductor device comprising a transistor, the transistor comprising:

a first electrode;

a first insulating layer over the first electrode, the first insulating layer comprising a first opening;

a second electrode over the first insulating layer, the second electrode comprising a second opening;

an oxide semiconductor layer over the second electrode and the first electrode, the oxide semiconductor layer being in contact with the first electrode through the first opening and the second opening;

a second insulating layer over the oxide semiconductor layer, the second insulating layer overlapping the first opening and the second opening; and

a third electrode over the second insulating layer, the third electrode overlapping the first opening and the second opening.

10. The semiconductor device according to claim 9 , wherein the first insulating layer contains oxygen.

11. The semiconductor device according to claim 9 ,

wherein the first electrode functions as one of a source electrode and a drain electrode, and

wherein the second electrode functions as the other of the source electrode and the drain electrode.

12. An electronic device comprising the semiconductor device according to claim 9 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2016
From: MIYAIRI, HIDEKAZU
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 037703/0061 →
Priority Claims (1)
JP 2015-024836 · Feb 11, 2015 · national
Continuity (1)
Related Publication 20160233343A1 · Aug 11, 2016