IP Library › Granted Patent US 9,831,310
Granted Patent B2
US 9,831,310 · App. 13/900,617 · Granted Nov 28, 2017

Compound semiconductor device, method for producing the same, power-supply unit, and high-frequency amplifier

Inventors: Junji Kotani (Isehara, JP); Norikazu Nakamura (Sagamihara, JP)
Assignee: FUJITSU LIMITED
H01L29/2003H01L21/0254H01L21/0262H01L21/02458H01L21/02505H01L21/02579H01L29/1075H01L29/36H01L29/66462H01L29/7787H02M3/335H03F1/3247H03F3/16H02M3/28
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Quick Facts
Patent No.
US 9,831,310
App. No.
13/900,617
Granted
Nov 28, 2017
Kind
B2
Abstract

A compound semiconductor device includes: a compound semiconductor multilayer structure including a first buffer layer composed of AlN; and a second buffer layer composed of AlGaN and formed above the first buffer layer, wherein the second buffer layer contains carbon, and wherein the concentration of carbon in the second buffer layer increases with increasing distance from a lower surface of the second buffer layer toward an upper surface of the second buffer layer.

Claims (34)

1. A compound semiconductor device comprising:

a compound semiconductor multilayer structure including

a first buffer layer composed of AlN and formed on a substrate, wherein the first buffer layer contains carbon;

a second buffer layer composed of AlGaN and formed over the first buffer layer, wherein the second buffer layer contains carbon; and

an electron transit layer formed over the second buffer layer, wherein the electron transit layer includes a lower layer region and a higher layer region that is formed over the lower layer region,

wherein a concentration of carbon of the second buffer layer increases with increasing distance from a lower surface toward an upper surface of the second buffer layer,

wherein the second buffer layer has a first sublayer over the first buffer layer having a first concentration of carbon, and has a second sublayer over the first sublayer having a second concentration of carbon higher than the first concentration of carbon,

wherein the lower layer region of the electron transit layer contains carbon and has a third concentration of carbon higher than the second concentration of carbon, and

wherein the higher layer region of the electron transit layer contains carbon and has a fourth concentration of carbon lower than a concentration of carbon of the first buffer layer.

2. The compound semiconductor device according to claim 1 ,

wherein an Al composition of the second buffer layer decreases with increasing distance from the lower surface toward the upper surface.

3. The compound semiconductor device according to claim 1 ,

wherein the first buffer layer has a lower concentration of carbon than the lower surface of the second buffer layer.

4. The compound semiconductor device according to claim 1 ,

wherein the second buffer layer has three sublayers, and

wherein the concentration of carbon in the second buffer layer increases with increasing distance from the lower surface toward the upper surface.

5. The compound semiconductor device according to claim 1 ,

wherein the concentration of carbon in the second buffer layer increases gradually with increasing distance from the lower surface toward the upper surface.

6. The compound semiconductor device according to claim 1 ,

wherein the first buffer layer has a concentration of carbon lower than the first sublayer of the second buffer layer.

7. A method for producing a compound semiconductor device, comprising:

forming a first buffer layer composed of AlN including carbon over a substrate;

forming a second buffer layer composed of AlGaN over the first buffer layer so that an upper surface of the second buffer layer includes carbon more than a lower surface of the second buffer layer;

forming a lower layer region of an electron transit layer over the second buffer layer so that the lower layer region includes carbon more than the upper surface of the second buffer layer, and

forming a higher layer region of the electron transit layer over the lower layer region so that the higher layer region includes carbon less than the first buffer layer.

8. The method according to claim 7 ,

wherein an Al composition of the second buffer layer decreases with increasing distance from the lower surface toward the upper surface.

9. The method according to claim 7 ,

wherein the first buffer layer has a lower concentration of carbon than the lower surface of the second buffer layer.

10. The method according to claim 7 ,

wherein the second buffer layer has three sublayers, and

wherein the concentration of carbon in the second buffer layer increases with increasing distance from the lower surface toward the upper surface.

11. The method according to claim 7 ,

wherein the concentration of carbon in the second buffer layer increases gradually with increasing distance from the lower surface toward the upper surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2013
From: KOTANI, JUNJI; NAKAMURA, NORIKAZU
To: FUJITSU LIMITED
Reel/Frame 030559/0793 →
Priority Claims (1)
JP 2012-155083 · Jul 10, 2012 · national
Continuity (1)
Related Publication 20140015608A1 · Jan 16, 2014