IP Library › Granted Patent US 9,833,978
Granted Patent B2
US 9,833,978 · App. 14/332,365 · Granted Dec 5, 2017

Monolithic fabrication of three-dimensional structures

Inventors: Pratheev Sabaratnam Sreetharan (Cambridge, MA); John Peter Whitney (Pittsburgh, PA); Robert J. Wood (Cambridge, MA)
Assignee: President and Fellows of Harvard College
B32B37/0076A63H27/001B25J7/00B32B3/266B32B37/144B32B37/18B32B38/0004B32B38/0012B32B38/14B64C33/02B81B3/0097B81B7/02H01L41/25B32B2038/0028B32B2307/20B32B2457/00G02B26/0833Y10T156/1064Y10T428/24331
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Quick Facts
Patent No.
US 9,833,978
App. No.
14/332,365
Granted
Dec 5, 2017
Kind
B2
Abstract

A multi-layer, super-planar structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations.

Claims (35)

1. A method for fabricating a three-dimensional structure comprising:

forming a stack of a plurality of patterned layers, including at least one rigid layer and at least one flexible layer with at least one interface between the rigid and flexible layers and a stacking axis extending orthogonally from the interface between the rigid and flexible layers, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer, and bonding the plurality of patterned layers at selected locations to form a laminate structure with inter-layer bonds; and

expanding the laminate structure into an expanded three-dimensional configuration by flexing the laminate structure at joints between the rigid segments, selectively distorting at least one of the layers to produce gaps that expand parallel to the stacking axis between adjacent layers while maintaining at least some of the inter-layer bonds.

2. A method for fabricating a three-dimensional structure comprising:

producing a plurality of layers with distinct patterns, wherein the layers include at least one rigid layer and at least one flexible layer, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer; then

stacking the plurality of layers with at least one interface between the rigid and flexible layers and a stacking axis extending orthogonally from the interface between the rigid and flexible layers, and bonding the plurality of layers at selected locations to form a laminate structure with inter-layer bonds; and

flexing the laminate structure at joints between the rigid segments to produce an expanded three-dimensional structure with gaps that expand parallel to the stacking axis between adjacent layers, wherein the adjacent layers are joined at the selected bonding locations and separated by the gaps at other locations.

3. A method for fabricating a three-dimensional structure comprising:

producing a plurality of layers with distinct patterns, wherein the layers include at least one rigid layer and at least one flexible layer, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer; then

stacking the plurality of layers and bonding the plurality of layers at selected locations to form a laminate structure with inter-layer bonds;

inserting at least one stimulus-responsive material between layers as the layers are stacked, wherein the stimulus-responsive material serves as an actuator for a cantilever to which the stimulus-responsive material is joined, and wherein the stimulus-responsive material is electrically coupled with a power source; and

flexing the laminate structure at joints between the rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations.

4. The method of claim 3 , wherein the stimulus-responsive material is a piezoelectric plate.

5. The method of claim 2 , wherein at least two of the layers in the expanded three-dimensional structure are separated by a distance in a range from 100 μm to 10 mm away from the inter-layer bonds.

6. The method of claim 2 , wherein at least some of the layers have a thickness in a range from 1.5 μm to 150 μm.

7. The method of claim 2 , further comprising cutting the rigid layer with a laser to form the rigid segments.

8. A method for fabricating a three-dimensional structure comprising:

producing a plurality of layers with distinct patterns, wherein the layers include at least one rigid layer and at least one flexible layer, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer; then

stacking the plurality of layers and bonding the plurality of layers at selected locations to form a laminate structure with inter-layer bonds; and

flexing the laminate structure at joints between the rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations,

wherein the rigid layer is coated with a conductive circuit.

9. A method for fabricating a three-dimensional structure comprising:

producing a plurality of layers with distinct patterns, wherein the layers include at least one rigid layer and at least one flexible layer, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer; then

stacking the plurality of layers and bonding the plurality of layers at selected locations to form a laminate structure with inter-layer bonds; and

flexing the laminate structure at joints between the rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations, and wherein the expanded three-dimensional structure comprises at least one I-beam.

10. The method of claim 9 , wherein a plurality of rigid layers are patterned, stacked and flexed.

11. The method of claim 9 , wherein a plurality of flexible layers are patterned, stacked and flexed.

12. A laminate precursor for a three-dimensional structure, comprising an aligned stack of layers including:

a plurality of rigid layers, wherein the rigid layers include cuts extending therethrough to form a plurality of rigid segments separated by the cuts; and

a plurality of flexible layers that are substantially less rigid than the rigid segments with at least one interface between the rigid and flexible layers and a stacking axis extending orthogonally from the interface between the rigid and flexible layers, wherein each flexible layer is bonded to at least one of the rigid layers such that the flexible layer is exposed at the cuts in the rigid layer to form joints for folding,

wherein at least some of the layers are bonded to adjacent layers only at selected locations forming islands of inter-layer bonds to allow expansion of the laminate into an expanded three-dimensional structure with gaps that expand parallel to the stacking axis between adjacent layers when the laminate is folded at the joints.

13. A laminate precursor for a three-dimensional structure, comprising an aligned stack of layers including:

a plurality of rigid layers, wherein the rigid layers include cuts extending therethrough to form a plurality of rigid segments separated by the cuts; and

a plurality of flexible layers that are substantially less rigid than the rigid segments, wherein each flexible layer is bonded to at least one of the rigid layers such that the flexible layer is exposed at the cuts in the rigid layer to form joints for folding,

wherein at least some of the layers are bonded to adjacent layers only at selected locations forming islands of inter-layer bonds to allow expansion of the laminate into an expanded three-dimensional structure when the laminate is folded at the joints, and wherein the layers are configured to produce a plurality of copies of the expanded three-dimensional structure for mass production when the laminate is folded at the joints.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2014
From: SREETHARAN, PRATHEEV S.; WHITNEY, JOHN PETER; WOOD, ROBERT J.
To: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
Reel/Frame 033699/0004 →
Continuity (6)
Continuation 13961510 · Aug 7, 2013
Continuation In Part 13519901
Continuation PCTUS2012024682 · Feb 10, 2012
Provisional Application 61561144 · Nov 17, 2011
Provisional Application 61467765 · Mar 25, 2011
Related Publication 20150044418A1 · Feb 12, 2015