System and methods for producing modular stacked integrated circuits

1. A system comprising:

a base chip including:

a plurality of attachment slots for attaching dies thereto;

a plurality of cross bar switches, each of the plurality of cross bar switches associated with respective ones of the plurality of attachment slots, wherein the plurality of cross bar switches are arranged in a matrix configuration, the plurality of cross bar switches comprising a plurality of input/output channels that form a crossed pattern of interconnecting lines between which a connection may be established by closing at least one of the plurality of cross bar switches located at an intersection of at least two of the plurality of input/output channels; and

a test and configuration block configured to receive and transmit test signals for determining electrically connected signal lines of one or more attachment slots when one or more dies are attached to the base chip and further configured to receive configuration data for programming one or more of the cross bar switches.

2. The system of claim 1 , wherein the test and configuration block comprises circuitry configured to generate the test signals for determining connectivity between metal contacts of the base chip and metal contacts of a die attached to the base chip.

3. The system of claim 1 , wherein the test and configuration block comprises circuitry configured to determine connectivity between metal contacts of the base chip and metal contacts of a die attached to the base chip, the metal contacts of the die having a different size or pitch than a size or pitch of the metal contacts of the base chip.

4. The system of claim 1 , wherein the plurality of attachment slots includes a first attachment slot and a second attachment slot, and wherein the first attachment slot comprises a first region on a surface of the base chip and the second attachment slot comprises a second region on the surface of the base chip, the first and second regions including base chip bumps.

5. The system of claim 1 , wherein the base chip comprises a plurality of metal contacts associated with each of the attachment slots, the metal contacts comprising pillars, pads, bumps or micro bumps made of conductive material.

6. The system of claim 1 , wherein the plurality of attachment slots includes a first attachment slot and a second attachment slot, and wherein the plurality of cross bar switches includes a first plurality of cross bar switches and a second plurality of cross bar switches, the base chip further comprising:

a first connection box which includes the first plurality of cross bar switches and a first memory element configured to store configuration data for programming the first plurality of cross bar switches; and

a second connection box with includes the second plurality of cross bar switches and a second memory element configured to store configuration data for programming the second plurality of cross bar switches.

7. The system of claim 1 , wherein at least one of the attachment slots includes a plurality of base chip bumps and wherein the base chip comprises circuitry configured to:

send a test signal to one of the bumps in the plurality of base chip bumps;

receive a response signal from one or more of the remaining bumps in the plurality of base chip bumps in response to the test signal; and

determine a first set of electrically connected bumps by grouping the one or more bumps from which the response signal was received with the one bump to which the test signal was sent.

8. The system of claim 1 , wherein at least one of the attachment slots includes a plurality of base chip bumps and wherein the base chip comprises circuitry configured to:

drive one of a pair of adjacent bumps in the plurality of base chip bumps by a voltage signal or a current signal, while one or more neighboring bumps including the other one of the bumps in the pair of adjacent bumps are grounded; and

measure a voltage or current change at the other one of the pair of adjacent bumps to determine a group of electrically connected bumps based on the measured voltage or current change.

9. The system of claim 1 , wherein the base chip comprises a plurality of base chip bumps, wherein the system further comprises a die attached to the base chip, the die comprising a plurality of die bumps, and wherein a number, a size, or a pitch of the base chip bumps is the same as a number, a size, or a pitch of the die bumps.

10. The system of claim 1 further comprising a die attached to the base chip, the die comprising a plurality of bumps, wherein the bumps of the die have a same size as bumps of the base chip but the die comprises a fewer number of bumps than the base chip.

11. A system comprising:

a base chip including:

a plurality of attachment slots for attaching dies thereto;

a plurality of cross bar switches, each of the plurality of cross bar switches associated with respective ones of the plurality of attachment slots;

a test and configuration block configured to receive and transmit test signals for determining electrically connected signal lines of one or more attachment slots when one or more dies are attached to the base chip and further configured to receive configuration data for programming one or more of the cross bar switches; and

a plurality of bumps, wherein the base chip is configured to:

determine a first set of electrically connected bumps and a second set of electrically connected bumps;

configure a first plurality of switches of a first cross bar switch such that individual bumps in the first set of electrically connected bumps are routed together; and

configure a second plurality of switches of the first cross bar switch such that individual bumps in the second set of electrically connected bumps are routed together.

12. The system of claim 11 further comprising a first die attached to the base chip at a first attachment slot from the plurality of attachment slots, the first attachment slot comprising the first set of electrically connected bumps, wherein the first set of electrically connected bumps is coupled to a first signal line of the first die and the second set of electrically connected bumps is coupled to a second signal line of the first die.

13. The system of claim 12 , wherein the base chip further comprises a second cross bar switch and a second die attached to the base chip at a second attachment slot from the plurality of attachment slots, the base chip further configured to couple signal lines of the first and second dies to input and output channels of the first and second cross bar switches in accordance with the configuration data received in the base chip.

14. The system of claim 12 , wherein at least one of the first and second dies includes circuitry for a sensor, an actuator, a memory, a processor, a receiver, a transmitter, or combinations thereof.

15. The system of claim 12 , wherein at least one of the first and second dies includes die bumps having at least one of:

a pitch coarser than a pitch of the bumps of the base chip; and

a size larger than a size of the bumps of the base chip.

16. A system comprising:

a base chip including:

a plurality of attachment slots for attaching dies thereto;

a plurality of cross bar switches, each of the plurality of cross bar switches associated with respective ones of the plurality of attachment slots;

a test and configuration block configured to receive and transmit test signals for determining electrically connected signal lines of one or more attachment slots when one or more dies are attached to the base chip and further configured to receive configuration data for programming one or more of the cross bar switches; and

a plurality of base chip bumps, the base chip further comprising circuitry configured to:

send a test signal to a first bump of the plurality of base chip bumps;

receive a return signal from a second bump of the plurality of base chip bumps in response to the test signal; and

if the return signal is received from the second bump, store location of the second bump for coupling a signal line of the cross bar switch to the stored location.

17. A method of providing a modular integrated circuit, the method comprising:

coupling a first die to a first attachment slot of a base chip and a second die to a second attachment slot of the base chip, the base chip comprising first and second programmable crossbar switches coupled to respective ones of the first and second attachment slots;

determining connectivity between a first array of metal contacts of the base chip and first die contacts and between a second array of metal contacts of the base chip and second die contacts to generate alignment data;

receiving, in respective memory elements of the first and second programmable cross bar switches, configuration data for the first and second programmable cross bar switches; and

programming signal channels of the first and second programmable crossbar switches based on the received configuration data and generated alignment data.

18. The method of claim 17 , wherein the first die contacts comprise a plurality of first die surface bumps and wherein the first array of metal contacts comprises a first array of base chip surface bumps having a pitch finer than a pitch of the first die surface bumps.

19. The method of claim 18 , wherein said coupling the first die to the first attachment slot comprises placing the first die onto the base chip such at least one of the first die surface bumps is in physical contact with at least two of the base chip surface bumps from the first array.

20. The method of claim 17 , wherein said determining connectivity between the first array of metal contacts of the base chip and the first die contacts comprises determining a first set of electrically connected bumps, comprising:

sending a test signal to one of the bumps in the first array of base chip surface bumps;

receiving a return signal from one or more of the remaining bumps in the first array of the base chip surface bumps in response to the test signal; and

grouping the one or more bumps from which a return signal was received into the first set of electrically connected bumps.

21. The method of claim 20 further comprising determining a second set of electrically connected bumps.

22. The method of claim 21 , wherein said programming signal channels of the first programmable cross bar switch comprises routing individual bumps in one of the first and second sets of electrically connected bumps together to a first signal line of the first die and routing individual bumps in the other one of the first and second sets of electrically connected bumps together to a second signal line of the first die.

23. The method of claim 22 , wherein said determining connectivity between the first array of metal contacts of the base chip and the first die contacts comprises determining a first set of electrically connected bumps, comprising:

identifying a pair of adjacent bumps in the first array;

driving one of the bumps in the pair by a voltage signal or a current signal, while grounding one or more neighboring bumps including the other one of the bumps in the pair; and

measuring a voltage or current change at the other one of the bumps; and

grouping the pair of bumps into the first set responsive to a determination of electrical short between the bumps in the pair based on the measured voltage or current change.

24. The method of claim 23 further comprising repeating the driving and measuring steps for remaining pairs of adjacent bumps in the array to determine one or more additional sets of electrically connected bumps.

25. The method of claim 17 , wherein the metal contacts of the base chip and the first die contacts comprise base chip surface bumps and first die surface bump, respectively, configured for one-to-one connection between individual ones first die surface bumps and respective ones of the base chip surface bumps.

26. The method of claim 25 , wherein said determining connectivity between the first array of metal contacts of the base chip and the first die contacts comprises:

sending a test signal to a first bump selected from the base chip surface bumps;

receiving a return signal at a second bump selected from the base chip surface bumps in response to the test signal; and

designating the second bump as an electrically connected bump in response to receipt of the return signal.

27. The method of claim 17 further comprising:

decoupling the first die from the first attachment slot;

coupling a third die to the first attachment slot;

determining connectivity between the first array of metal contacts and third die contacts to generate new alignment data;

receiving new configuration data for the first and second programmable cross bar switches; and

programming the signal channels of the first and second programmable crossbar switches based on the received new configuration data and generated new alignment data.