IP Library › Granted Patent US 9,843,751
Granted Patent B2
US 9,843,751 · App. 15/232,481 · Granted Dec 12, 2017

Solid-state image sensor and camera system

Inventor: Kazuyoshi Yamashita (Kanagawa, JP)
Assignee: SONY CORPORATION
H04N5/3696H01L27/14607H01L27/14609H01L27/14614H01L27/14641H01L27/14643H04N5/23212H04N5/374H04N5/37457H04N9/045
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Quick Facts
Patent No.
US 9,843,751
App. No.
15/232,481
Granted
Dec 12, 2017
Kind
B2
Abstract

A solid-state image sensor including a pixel array portion formed from a two-dimensional array of ordinary imaging pixels each having a photoelectric conversion unit and configured to output an electric signal obtained through photoelectric conversion as a pixel signal, and focus detection pixels for detecting focus. The focus detection pixels include at least a first focus detection pixel and a second focus detection pixel each having a photoelectric conversion unit and configured to transfer and output an electric signal obtained through photoelectric conversion to an output node. The first focus detection pixel and the second focus detection pixel share the output node. The first focus detection pixel includes a first photoelectric conversion unit, and a first transfer gate for reading out an electron generated through photoelectric conversion in the first photoelectric conversion unit to the shared output node.

Claims (14)

1. An image sensor comprising a plurality of focus detection pixels for detecting focus, at least one of the focus detection pixels including:

a floating diffusion region formed in a substrate;

a first photoelectric conversion region;

a first transfer transistor disposed between the first photoelectric conversion region and the floating diffusion region;

a second photoelectric conversion region; and

a second transfer transistor disposed between the second photoelectric conversion region and the floating diffusion region,

wherein,

a gate of the first transfer transistor and a gate of the second transfer transistor are electrically connected to a control line through a connection wiring having “]” shape in a plan view,

the connection wiring is formed in a first metal layer,

the control line is formed in a second metal layer, and

the first metal layer is disposed between the second metal layer and the substrate.

2. The image sensor according to claim 1 , wherein a part of the first photoelectric conversion region and the second photoelectric conversion region is shielded from incident light.

3. The image sensor according to claim 1 , wherein the focus detection pixels include a pixel for which a color filter is not provided.

4. A camera system comprising the image sensor according to claim 1 .

Priority Claims (1)
JP 2012-018383 · Jan 31, 2012 · national
Continuity (3)
Continuation 14579378 · Dec 22, 2014
Continuation 13747183 · Jan 22, 2013
Related Publication 20160353040A1 · Dec 1, 2016