Interconnect devices having a biplanar connection
An interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.
1. An interconnect device for an electronic device, the interconnect device comprising:
a printed circuit board comprising:
a tongue portion supporting a plurality of electrical contacts;
a pin portion spaced apart from the tongue portion and including a plurality of pin contact locations; and
a plurality of electrical traces extending between the tongue portion and the pin portion, wherein individual electrical traces in of the plurality of electrical traces electrically connect individual electrical contacts in the plurality of electrical contacts to individual contact locations in the plurality of pin contact locations;
a pin support structure attached to the printed circuit board and disposed adjacent to the pin portion, the pin support structure comprising an electrically nonconductive material having a plurality of pin openings formed therethrough;
a plurality of elongated pins electrically coupled to the printed circuit board at the plurality of pin contact locations, each of the plurality of elongated pins extending through a pin opening in the plurality of pin openings in the pin support structure; and
a grounding shield attached to the printed circuit board and extending around the pin support structure.
2. The interconnect device of claim 1 , wherein the tongue portion is a first tongue portion and the electrical contacts are first electrical contacts, the printed circuit board further comprising a second tongue portion supporting second electrical contacts, the electrical traces extending between the second tongue portion and the pin portion and electrically connecting the second electrical contacts to the pin contact locations.
3. The interconnect device of claim 1 , further comprising a gasket disposed about the tongue portion and configured to extend away from the tongue portion and contact a housing of the electronic device when the interconnect device is mounted in the housing.
4. The interconnect device of claim 1 , wherein the tongue portion and the plurality of electrical contacts of the tongue portion are dimensioned to correspond to a Uniform Serial Bus (USB) Type-C specification.
5. The interconnect device of claim 1 , wherein the plurality of electrical contacts comprise first electrical contacts disposed on a first side of the tongue portion and second electrical contacts disposed on a second side of the tongue portion.
6. The interconnect device of claim 1 , wherein the plurality of elongated pins are configured to couple with corresponding conductive holes of a main logic board to form a coupled structure between the printed circuit board and the main logic board.
7. The interconnect device of claim 6 , wherein:
the coupled structure functions to position the tongue portion in a port hole opening of a housing of the electronic device; and
the main logic board and at least a portion of the interconnect device are disposed within the housing.
8. The interconnect device of claim 1 , wherein the electronic device comprises a main logic board aligned in a second plane spaced apart from a first plane aligned with the printed circuit board, the main logic board comprising conductive holes, wherein at least some of the conductive holes align with and are electrically coupled to the plurality of elongated pins.
9. The interconnect device of claim 1 , wherein the printed circuit board comprises a rigid-flex structure including a rigid tongue portion and a rigid pin portion coupled together with a flexible intermediate portion that supports the plurality of electrical traces extending between the tongue portion and the pin portion.
10. The interconnect device of claim 9 , wherein the flexible intermediate portion enables the tongue portion and the pin portion to be positioned in different planes.
11. The interconnect device of claim 9 , further comprising a gasket disposed on the tongue portion and configured to extend away from the tongue portion and contact a housing of the electronic device when the interconnect device is mounted in the housing.
12. An electronic device, comprising:
a printed circuit board aligned in a first plane, the printed circuit board comprising:
a tongue portion comprising electrical contacts;
a pin portion spaced apart from the tongue portion and comprising pin contact locations; and
electrical traces extending between the tongue portion and the pin portion, wherein individual electrical traces in the electrical traces electrically connect individual electrical contacts in the electrical contacts to individual pin contact locations;
a pin support structure attached to the printed circuit board and disposed adjacent to the pin portion, the pin support structure comprising an electrically nonconductive material having pin openings formed therethrough;
elongated pins electrically coupled to the printed circuit board at the pin contact locations, individual elongated pins of the elongated pins extending through the pin openings in the pin support structure; and
a main logic board aligned in a second plane spaced apart from the first plane, the main logic board comprising conductive holes, wherein at least some of the conductive holes align with and are electrically coupled to the elongated pins.
13. The electronic device of claim 12 , further comprising a housing, and wherein at least a portion of the printed circuit board is disposed within the housing.
14. The electronic device of claim 13 , wherein:
the conductive holes structurally couple with the elongated pins to form a coupled structure between the printed circuit board and the main logic board; and
the coupled structure positions the tongue portion in a port hole opening of the housing.
15. The electronic device of claim 13 , further comprising a grounding system disposed within one or more channels of the housing of the electronic device, at least a portion of the grounding system extending into a port hole opening of the housing via one or more channel openings.
16. The electronic device of claim 15 , wherein the grounding system comprises one or more springs configured to engage with a connector plug of an accessory device at one or more contact locations on an exterior surface of the connector plug when the connector plug is connected to the tongue portion.
17. The electronic device of claim 15 , wherein the grounding system comprises one or more telescoping contacts configured to engage with a connector plug of an accessory device at one or more contact locations on an exterior surface of the connector plug when the connector plug is connected to the tongue portion.
18. The electronic device of claim 12 , further comprising a grounding shield attached to the printed circuit board and extending around the pin support structure.
19. The electronic device of claim 12 , wherein the printed circuit board comprises a rigid-flex structure including a rigid tongue portion and a rigid pin portion coupled together with a flexible intermediate portion that supports the electrical traces extending between the tongue portion and the pin portion.
20. The electronic device of claim 19 , wherein the flexible intermediate portion enables the tongue portion and the pin portion to be positioned in different planes.
21. The electronic device of claim 19 , further comprising a gasket disposed on the tongue portion and configured to extend away from the tongue portion and contact a housing of the electronic device when the interconnect device is mounted in the housing.