Sensing system including a sensing membrane
In one general aspect, an apparatus can include a sensing membrane including a plurality of conductive fillers included in a matrix. The apparatus can include a plurality of electrical leads coupled to an outer portion of the sensing membrane where the conductive fillers have a volumetric percentage of less than 25% of the volume of the sensing membrane.
1. An apparatus, comprising:
a sensing structure including a plurality of conductive fillers included in a matrix; and
a plurality of electrical leads coupled to a portion of the sensing structure, the conductive fillers having a volumetric percentage of less than 25% of a volume of the sensing structure.
2. The apparatus of claim 1 , further comprising:
a substrate;
the sensing structure being coupled to the substrate such that a combination of the substrate and the sensing structure has a mechanical property that is different than a mechanical property of the sensing structure alone without modifying an electrical property of the sensing structure.
3. The apparatus of claim 1 , wherein the portion can include an outer portion of the sensing structure.
4. The apparatus of claim 1 , wherein the plurality of electrical leads includes an even number of electrical leads or an odd number of electrical leads.
5. The apparatus of claim 1 , wherein the plurality of electrical leads includes at least three electrical leads.
6. The apparatus of claim 1 , wherein the sensing structure has a piezoresistive effect.
7. The apparatus of claim 1 , further comprising:
a computing device configured to identify at least one of a value of an electrical property or a location of a deformation of the sensing structure via the plurality of electrical leads.
8. The apparatus of claim 7 , wherein the location includes a coordinate location.
9. The apparatus of claim 1 , wherein the sensing structure includes a sensing membrane.
10. The apparatus of claim 1 , wherein the conductive fillers include conductive nanoparticles, the matrix includes an insulating material.
11. An apparatus, comprising:
a sensing structure including a plurality of conductive fillers included in a matrix; and
a plurality of electrical leads coupled to a portion of the sensing structure, the sensing structure having a negative piezoresistive effect, the conductive fillers having a volumetric percentage of less than 25% of a volume of the sensing structure.
12. The apparatus of claim 11 , further comprising:
a substrate;
the sensing structure being coupled to the substrate such that a combination of the substrate and the sensing structure has a mechanical property that is different than a mechanical property of the sensing structure alone without modifying an electrical property of the sensing structure.
13. The apparatus of claim 11 , wherein the sensing structure includes a sensing membrane.
14. The apparatus of claim 11 , further comprising:
a computing device configured to identify a location of a deformation of the sensing structure via the plurality of electrical leads.
15. An apparatus, comprising:
a sensing membrane including a plurality of conductive fillers included in a matrix; and
a plurality of electrical leads coupled to a portion of the sensing membrane, the sensing membrane having a thickness less than a width of the sensing membrane, the conductive fillers having a volumetric percentage of less than 25% of a volume of the sensing membrane.
16. The apparatus of claim 15 , wherein the thickness of the sensing membrane is sufficiently thin to avoid Poisson effects.
17. The apparatus of claim 15 , wherein the portion can include an outer portion of the sensing membrane.
18. The apparatus of claim 15 , further comprising:
a computing device configured to identify at least one of a value of an electrical property or a location of a deformation of the sensing membrane via the plurality of electrical leads.