Dry power supply assembly for immersion-cooled information handling systems
Systems and methods for a dry power supply for immersion-cooled Information Handling Systems (IHSs) are described. In some embodiments, an IHS may include: a chassis configured to be at least partially disposed under a surface of a dielectric liquid coolant, where the chassis includes one or more components configured to be cooled by the dielectric liquid coolant during operation of the IHS; and a power supply coupled to the chassis and configured to provide power to the one or more components via an adaptor configured to maintain the power supply above the surface of the dielectric liquid coolant during operation of the IHS, where the power supply comprises a fan configured to blow air.
1. An Information Handling System (IHS), comprising:
a chassis configured to be at least partially disposed under a surface of a dielectric liquid coolant within a tank, wherein the chassis includes one or more components configured to be cooled by the dielectric liquid coolant during operation of the IHS;
a power supply coupled to a rear end of the chassis, wherein the power supply is configured to provide power to the one or more components, wherein the rear end of the chassis is oriented upwards when the IHS is placed in the tank, and wherein the power supply comprises a fan configured to blow air; and
an electrical adaptor configured to couple the power supply to the chassis while physically supporting the fan of the power supply above the surface of the dielectric liquid coolant during operation of the power supply, wherein the electrical adaptor includes a first electrical connector configured to be coupled to the one or more components of the IHS and a second electrical connector configured to be coupled to the power supply, wherein the first and second electrical connectors are coupled to each other via a printed circuit board (PCB), and wherein the second electrical connector is disposed on an opposite end of the PCB from the first electrical connector.
2. The IHS of claim 1 , wherein the IHS is a server.
3. The IHS of claim 1 , wherein the chassis is unsealed against the dielectric liquid coolant.
4. The IHS of claim 1 , wherein the dielectric liquid coolant comprises oil.
5. The IHS of claim 1 , wherein the tank comprises a rack and an open top configured to be covered by a lid, and the chassis is mountable on the rack such that the IHS is removable from the tank through the open top while another IHS remains in operation, the another IHS at least partially disposed under the surface of the dielectric liquid coolant.
6. The IHS of claim 1 , wherein the one or more components comprises a processor.
7. The IHS of claim 1 , wherein the power supply is an off-the-shelf power supply.
8. The IHS of claim 1 , wherein the electrical adaptor includes a bay coupled to the PCB and configured to receive the power supply, the bay configured to allow a power supply connector of the power supply to be coupled to the second electrical connector.
9. The IHS of claim 8 , wherein the bay is configured to hold the power supply above the surface of the dielectric liquid coolant while a portion of the PCB remains under the surface of the dielectric liquid coolant.
10. The IHS of claim 9 , wherein the power supply includes a handle portion configured to allow a user to slide the power supply in and out of the bay coupling and decoupling the power supply to and from the chassis, respectively.