IP Library › Granted Patent US 9,873,825
Granted Patent B2
US 9,873,825 · App. 14/533,556 · Granted Jan 23, 2018

Carbon nanotube sheet, semiconductor device, method of manufacturing carbon nanotube sheet, and method of manufacturing semiconductor device

Inventor: Takuya Oda (Nagano, JP)
Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
C09K5/14H01L23/373H01L23/3737H01L23/433H01L2224/16225H01L2224/32225H01L2224/73204H01L2224/73253H01L2924/0002H01L2924/15311H01L2924/16152Y10T428/24777
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Quick Facts
Patent No.
US 9,873,825
App. No.
14/533,556
Granted
Jan 23, 2018
Kind
B2
Abstract

A carbon nanotube sheet includes a carbon nanotube aggregate in which a plurality of carbon nanotubes are arrayed, a thermoplastic resin portion formed in a center area of the carbon nanotube aggregate, and an uncured thermosetting resin portion formed in an outer periphery area of the carbon nanotube aggregate so as to surround the thermoplastic resin portion.

Claims (7)

1. A carbon nanotube sheet, comprising:

a carbon nanotube aggregate in which a plurality of carbon nanotubes is arrayed;

a plurality of thermoplastic resin portions divided into plural areas in a center area of the carbon nanotube aggregate; and

an uncured thermosetting resin portion formed from a center area of the carbon nanotube aggregate to an outer periphery area of the carbon nanotube aggregate so as to surround each of the plurality of thermoplastic resin portions,

wherein the thermoplastic resin portions and the uncured thermosetting resin portion are formed from a lower end to an upper end of the carbon nanotube aggregate so as to coat the upper end of the carbon nanotube aggregate, and

a side surface of the thermoplastic resin portions and a side surface of the uncured thermosetting resin portion contact in a region between the plurality of carbon nanotubes, and

wherein a layer formed in the carbon nanotube aggregate consists of the plurality of thermoplastic resin portions and the uncured thermosetting resin portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2014
From: ODA, TAKUYA
To: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Reel/Frame 034253/0248 →
Priority Claims (1)
JP 2014-010306 · Jan 23, 2014 · national
Continuity (1)
Related Publication 20150206822A1 · Jul 23, 2015