Removing process-variation-related inaccuracies from scatterometry measurements
Metrology methods and respective software and module are provided, which identify and remove measurement inaccuracy which results from process variation leading to target asymmetries. The methods comprise identifying an inaccuracy contribution of process variation source(s) to a measured scatterometry signal (e.g., overlay) by measuring the signal across a range of measurement parameter(s) (e.g., wavelength, angle) and targets, and extracting a measurement variability over the range which is indicative of the inaccuracy contribution. The method may further assume certain functional dependencies of the resulting inaccuracy on the target asymmetry, estimate relative donations of different process variation sources and apply external calibration to further enhance the measurement accuracy.
1. A metrology method, comprising the steps of:
measuring, with an overlay scatterometry metrology tool, a signal from each of a plurality of targets across a range of at least one measurement parameter;
identifying, with one or more processors, an inaccuracy contribution of at least one process variation source to the measured scatterometry signal; and
extracting, with the one or more processors, a measurement variability over a range indicative of the inaccuracy contribution by modeling, with the one or more processors, a per-pixel measured overlay response to target imperfections based on per-pixel measured overlay deviations and measurement of multiple overlay targets.
2. The method of claim 1 , wherein the signal comprises:
at least one of an overlay signal, a raw reflectivity signal, or a differential measurement signal.
3. The method of claim 1 , wherein the at least one measurement parameter comprises:
at least one of wavelength or angle, described by terms with respect to pixels.
4. The method of claim 1 , further comprising:
identifying at least one process variation signature in the extracted measurement variability.
5. The method of claim 4 , further comprising:
quantifying process variations and inaccuracies of additional measurements by using the at least one process variation signature.
6. The method of claim 5 , further comprising:
monitoring process stability with respect to the process variations.
7. The method of claim 5 , further comprising:
identifying at least one of defective targets or outlying measurements.
8. The method of claim 1 , further comprising:
selecting a subset of wafer sites where measurements are acquired.
9. The method of claim 1 , further comprising:
applying a linear approximation of a dependency of the inaccuracy on a target asymmetry resulting from the process variation source.
10. The method of claim 1 , wherein the inaccuracy is caused by a plurality of process variation sources, wherein the method further comprises
estimating relative contributions of the different process variation sources by applying a statistical analysis.
11. The method of claim 1 , further comprising:
selecting a spectrum based on systematic behavior over the wafer, wherein selection of a spectrum includes selecting pixels where the per-pixel measured overlay deviation is correlated to the average measured overlay deviation over a wafer.
12. A system, comprising:
an overlay scatterometry metrology tool;
a memory element configured to store a plurality of computer-readable instructions;
a processor communicatively coupled to the overlay scatterometry metrology tool and configured to execute the plurality of computer-readable instructions to,
direct the overlay scatterometry metrology tool to measure a signal from a plurality of targets across a range of at least one measurement parameter;
identify an inaccuracy contribution of at least one process variation source to a measured scatterometry signal; and
extract a measurement variability over the range indicative of the inaccuracy contribution with a model of a per-pixel measured overlay response to target imperfections based on per-pixel measured overlay deviations and measurement of multiple overlay targets.
13. The metrology system of claim 12 , wherein the processor is configured to execute the plurality of computer-readable instructions to identify at least one process variation signature in the extracted measurement variability.
14. The system of claim 13 , wherein the processor is configured to execute the plurality of computer-readable instructions to quantify process variations and inaccuracies of additional measurements by using the at least one process variation signature.
15. The system of claim 12 , wherein the processor is configured to execute the plurality of computer-readable instructions to monitor process stability with respect to the process variations.
16. The system of claim 12 , wherein the processor is configured to execute the plurality of computer-readable instructions to identify at least one of defective targets or outlying measurements.
17. The system of claim 12 , wherein the processor is configured to execute the plurality of computer-readable instructions to select a subset of wafer sites for the measuring.
18. The system of claim 12 , wherein the processor is configured to execute the plurality of computer-readable instructions to apply a linear approximation of a dependency of the inaccuracy on a target asymmetry resulting from the process variation source.
19. The system of claim 12 , wherein the processor is configured to execute the plurality of computer-readable instructions to select a spectrum based on systematic behavior over the wafer, wherein selection of a spectrum includes selecting pixels where the per-pixel measured overlay deviation is correlated to the average measured overlay deviation over a wafer.