IP Library Granted Patent US 9,882,435
Granted Patent B2
US 9,882,435 · App. 15/027,154 · Granted Jan 30, 2018

Resonant type high frequency power supply device and switching circuit for resonant type high frequency power supply device

Inventors: Yoshiyuki Akuzawa (Chiyoda-ku, JP); Kiyohide Sakai (Chiyoda-ku, JP); Toshihiro Ezoe (Chiyoda-ku, JP); Yuki Ito (Chiyoda-ku, JP)
Assignee: Mitsubishi Electric Engineering Company, Limited
H02J50/12H02J50/20H02M7/48H02J50/05H02M2007/4815H02M2007/4818Y02B70/1441
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Quick Facts
Patent No.
US 9,882,435
App. No.
15/027,154
Granted
Jan 30, 2018
Kind
B2
Abstract

A resonant type high frequency power supply device provided with a power semiconductor element that performs a switching operation, the power supply device including a second power semiconductor element at least one or more connected in parallel to the power semiconductor element to achieve optimization of parasitic capacitances of the power semiconductor element and the second power semiconductor element itself, and a high frequency pulse drive circuit that transmits a pulse-shaped voltage signal having a high frequency exceeding 2 MHz to the power semiconductor element and the second power semiconductor element to drive the power semiconductor element and the second power semiconductor element.

Claims (34)

1. A resonant type high frequency power supply device comprising:

a first power semiconductor element that performs a switching operation to convert a direct voltage to a high frequency alternating voltage;

a second power semiconductor element connected in parallel to said first power semiconductor element, said second power element having a parasitic capacitance; and

a high frequency pulse drive circuit that drives said first power semiconductor element and said second power semiconductor element by applying a pulse-shaped voltage,

wherein a peak value of a resonant voltage at a drain terminal of said first power semiconductor element is 3 to 5 times a value of said direct voltage due to said parasitic capacitance of said second power semiconductor element.

2. The resonant type high frequency power supply device according to claim 1 , further comprising at least one diode or more connected in parallel to said first power semiconductor element.

3. The resonant type high frequency power supply device according to claim 1 , wherein said first power semiconductor element is a Si-MOSFET, a SiC-MOSFET or a GaN-FET.

4. The resonant type high frequency power supply device according to claim 1 , wherein said first and second power semiconductor elements have a push-pull type configuration or a single type configuration.

5. The resonant type high frequency power supply device according to claim 1 , further comprising a variable impedance matching circuit that includes a variable capacitor and a variable inductor.

6. A switching circuit for a resonant type high frequency power supply device, said switching circuit comprising:

a first power semiconductor element that performs a switching operation to convert a direct voltage to a high frequency alternating voltage;

a second power semiconductor element connected in parallel to said first power semiconductor element, said second power semiconductor element having a parasitic capacitance; and

a high frequency pulse drive circuit that drives said first power semiconductor element and said second power semiconductor element by applying a pulse-shaped voltage,

wherein a peak value of a resonant voltage at a drain terminal of said first power semiconductor element is 3 to 5 times a value of said direct voltage due to said parasitic capacitance of said second power semiconductor element.

7. The switching circuit according to claim 6 , further comprising:

a signal line connecting said high frequency drive circuit to a gate terminal of said first power semiconductor element, and

said peak value of said resonant voltage at said drain terminal of said first power semiconductor element is 3 to 5 times said value of said direct voltage further due to an impedance of said signal line.

8. The switching circuit device according to claim 6 , wherein said peak value of said resonant voltage at said drain terminal of said first power semiconductor element is 3 to 5 times said value of said direct voltage due to parasitic capacitance of said first power semiconductor element that includes a gate to drain parasitic capacitance.

9. The switching circuit according to claim 8 , wherein said peak value of said resonant voltage at said drain terminal of said first power semiconductor element is 3 to 5 times said value of said direct voltage due to said parasitic capacitance of said first power semiconductor element that further includes a drain to source parasitic capacitance.

10. A resonant type high frequency power supply device comprising:

a first power semiconductor element that performs a switching operation to convert a direct voltage to a high frequency alternating voltage;

a second power semiconductor element connected in parallel to said first power semiconductor element, said second power semiconductor element having a parasitic capacitance; and

a high frequency drive circuit that drives said first power semiconductor element and said second power semiconductor element by applying a voltage,

wherein a peak value of a resonant voltage at a drain terminal of said first power semiconductor element is 3 to 5 times a value of said direct voltage due to said parasitic capacitance of said second power semiconductor element.

11. The resonant type high frequency power supply device according to claim 10 , further comprising:

a signal line connecting said high frequency drive circuit to a gate terminal of said first power semiconductor element, and

said peak value of said resonant voltage at said drain terminal of said first power semiconductor element is 3 to 5 times said value of said direct voltage further due to an impedance of said signal line.

12. The resonant type high frequency power supply device according to claim 10 , wherein said peak value of said resonant voltage at said drain terminal of said first power semiconductor element is 3 to 5 times said value of said direct voltage due to parasitic capacitance of said first power semiconductor element that includes a gate to drain parasitic capacitance.

13. The resonant type high frequency power supply device according to claim 12 , wherein said peak value of said resonant voltage at said drain terminal of said first power semiconductor element is 3 to 5 times said value of said direct voltage due to said parasitic capacitance of said first power semiconductor element that further includes a drain to source parasitic capacitance.

14. The resonant type high frequency power supply device according to claim 1 , further comprising:

a signal line connecting said high frequency pulse drive circuit to a gate terminal of said first power semiconductor element, and

said peak value of said resonant voltage at said drain terminal of said first power semiconductor element is 3 to 5 times said value of said direct voltage further due to an impedance of said signal line.

15. The resonant type high frequency power supply device according to claim 1 , wherein said peak value of said resonant voltage at said drain terminal of said first power semiconductor element is 3 to 5 times said value of said direct voltage due to parasitic capacitance of said first power semiconductor element that includes a gate to drain parasitic capacitance.

16. The resonant type high frequency power supply device according to claim 15 , wherein said peak value of said resonant voltage at said drain terminal of said first power semiconductor element is 3 to 5 times said value of said direct voltage due to said parasitic capacitance of said first power semiconductor element that further includes a drain to source parasitic capacitance.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2016
From: AKUZAWA, YOSHIYUKI; SAKAI, KIYOHIDE; EZOE, TOSHIHIRO; ITO, YUKI
To: MITSUBISHI ELECTRIC ENGINEERING COMPANY, LIMITED
Reel/Frame 038185/0838 →
Continuity (1)
Related Publication 20160254700A1 · Sep 1, 2016