Thermosetting composition for organic light-emitting element filler and organic light-emitting element display device comprising same
The present invention relates to a thermosetting composition for an organic light-emitting element filler, which comprises (A) 100 parts by weight of an epoxy-based resin including (A1) an epoxy resin having a weight average molecular weight of around about 200 g/mol or more to less than about 1000 g/mol, (A2) an epoxy resin having a weight average molecular weight of around about 1000 g/mol or more to less than about 20000 g/mol and (A3) an epoxy resin having a weight average molecular weight of about 20000 g/mol or more to less than about 100000 g/mol, (B) about 10 parts by weight to about 40 parts by weight of a sheet-like filler and (C) about 0.1 parts by weight to about 20 parts by weight of an imidazole curing agent having a cyano group; and an organic light-emitting element display device comprising the same.
1. A thermosetting composition for organic light emitting diode fillers, comprising:
100 parts by weight of (A) an epoxy-based resin composed of (A1) an epoxy resin having a weight average molecular weight of about 200 g/mol or more to less than about 1,000 g/mol, (A2) an epoxy resin having a weight average molecular weight of about 1,000 g/mol or more to less than about 20,000 g/mol, and (A3) an epoxy resin having a weight average molecular weight of about 20,000 g/mol or more to less than about 100,000 g/mol, wherein the epoxy resin (A2) contains one epoxy group for each repeat unit of (A2) the epoxy resin;
about 10 parts by weight to about 40 parts by weight of (B) flake fillers; and
about 0.1 parts by weight to about 20 parts by weight of (C) a cyano group-containing imidazole curing agent.
2. The thermosetting composition according to claim 1 , wherein the epoxy resin (A2) includes one or more of a cresol novolac epoxy resin, a biphenyl novolac epoxy resin, or a naphthalene novolac epoxy resin, each of which is a solid at 25° C.
3. The thermosetting composition according to claim 1 , wherein the epoxy resin (A2) has a glass transition temperature of about 30° C. to 70° C.
4. The thermosetting composition according to claim 1 , wherein the epoxy resin (A2) is present in an amount of about 20 parts by weight to about 50 parts by weight based on 100 parts by weight of the epoxy resin (A1) and the epoxy resin (A3).
5. The thermosetting composition according to claim 1 , wherein the epoxy resin (A2) is present in an amount of about 10 wt % to 40 wt % in the epoxy-based resin (A).
6. The thermosetting composition according to claim 1 , wherein the epoxy resin (A2) is present in an amount of about 15 wt % to about 30 wt % in the thermosetting composition in terms of solid content.
7. The thermosetting composition according to claim 1 , wherein the epoxy resin (A1) includes one or more of a bisphenol A epoxy resin, a bisphenol F epoxy resin, a hydrogenated bisphenol epoxy resin, a cycloaliphatic an epoxy resin, a naphthalene epoxy resin, a dicyclopentadiene epoxy resin, or a biphenyl epoxy resin, each of which is a liquid at 25° C.
8. The thermosetting composition according to claim 1 , wherein the epoxy resin (A3) includes one or more of a bisphenol A epoxy resin, a bisphenol F epoxy resin, a phenoxy resin, a dicyclopentadiene epoxy resin, or a biphenyl epoxy resin, each of which is a solid at 25° C.
9. The thermosetting composition according to claim 1 , wherein the flake fillers include talc.
10. The thermosetting composition according to claim 1 , wherein the imidazole curing agent has a melting point of about 90° C. to about 250° C.
11. The thermosetting composition according to claim 1 , wherein the imidazole curing agent includes one or more of 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium-trimellitate, or 1-cyanoethyl-2-phenylimidazolium-trimellitate.
12. The thermosetting composition according to claim 1 , wherein a thermally cured product of the thermosetting composition has an adhesive strength to a glass substrate of about 65 gf/m 2 to about 100 gf/m 2 .
13. The thermosetting composition according to claim 1 , wherein the thermosetting composition has a flow beginning temperature of higher than about 25° C. and less than 50° C.
14. An organic light emitting diode display comprising a thermally cured product of a thermosetting composition for organic light emitting diode fillers including:
100 parts by weight of (A) an epoxy-based resin composed of (A1) an epoxy resin having a weight average molecular weight of about 200 g/mol or more to less than about 1,000 g/mol, (A2) an epoxy resin having a weight average molecular weight of about 1,000 g/mol or more to less than about 20,000 g/mol, and (A3) an epoxy resin having a weight average molecular weight of about 20,000 g/mol or more to less than about 100,000 g/mol;
about 10 parts by weight to about 40 parts by weight of (B) flake fillers; and
about 0.1 parts by weight to about 20 parts by weight of (C) a cyano group-containing imidazole curing agent.