Wafer swapper
The present disclosure generally relates to semiconductor process equipment used to transfer semiconductor substrates between process chambers. More specifically, embodiments described herein are related to systems and methods used to transfer, or swap, semiconductor substrates between process chambers using a transport device that employs at least two blades for the concurrent transfer of substrates between processing chambers.
1. A system for processing a substrate, comprising:
at least two processing chambers each having a slit valve and a substrate support configured to receive a substrate; and
a transfer chamber operatively connecting the at least two processing chambers and having a maximum width less than a surface dimension of the substrate support, the transfer chamber comprising:
an upper region;
a lower region;
a first slide assembly disposed within the upper region of the transfer chamber;
a second slide assembly disposed within the lower region of the transfer chamber;
a stepper motor operatively connected with each slide assembly; and
two two-movement robot blades coupled to each slide assembly, wherein each two-movement robot blade has a linear movement and a rotational movement along a separate plane between the upper region and the lower region.
2. The system of claim 1 , wherein each processing chamber contains a two-movement robot blade.
3. The system of claim 1 , wherein the transfer chamber contains two two-movement robot blades.
4. The system of claim 3 , wherein one two-movement robot blade is disposed above the other two-movement robot blade.
5. The system of claim 1 , wherein the stepper motor divides a full rotation of the two-movement robot blade into a number of equal steps.
6. The system of claim 5 , wherein the full rotation is 90 degrees.
7. The system of claim 5 , wherein the number of equal steps is 5.