Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting structure
A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.
1. A semiconductor device, comprising:
a die pad section;
a semiconductor chip joined to the die pad section;
a heat radiation plate spaced apart from the die pad section; and
an encapsulating resin portion configured to cover at least semiconductor-chip-side regions of the die pad section, the semiconductor chip and the heat radiation plate,
the encapsulating resin portion including an intermediate section existing between the heat radiation plate and the die pad section, the intermediate section being in direct contact with the heat radiation plate and the die pad section,
wherein the die pad section has a major surface and a rear surface, the semiconductor chip is joined to the major surface of the die pad section,
wherein the heat radiation plate has a major surface and a side surface, the major surface of the heat radiation plate directly facing the rear surface of the die pad section and the side surface of the heat radiation plate being perpendicular to the major surface of the heat radiation plate in direct contact with the encapsulating resin portion,
wherein the heat radiation plate includes a dropout prevention portion protruding from the side surface of the heat radiation plate, the dropout prevention portion has a major surface, and the major surface of the dropout prevention portion is integrally formed with the major surface of the heat radiation plate, and
wherein a concave-convex portion is formed integrally on the major surface of the dropout prevention portion and the major surface of the heat radiation plate.
2. The semiconductor device of claim 1 , wherein the heat radiation plate has a rear surface on an opposite side of the major surface of the heat radiation plate, the rear surface of the heat radiation plate exposed from the encapsulating resin portion.
3. The semiconductor device of claim 2 , wherein the encapsulating resin portion has a bottom surface, the bottom surface of the encapsulating resin portion faces toward a same direction as a facing direction of the rear surface of the heat radiation plate, the heat radiation plate having a section protruding toward the facing direction of the rear surface of the heat radiation plate beyond the bottom surface of the encapsulating resin portion.
4. The semiconductor device of claim 1 , wherein the heat radiation plate is made of an electrically conductive material.
5. The semiconductor device of claim 4 , wherein the electrically conductive material comprises aluminum, copper, copper alloy or iron.
6. The semiconductor device of claim 4 , further comprising: a spacer existing between the die pad section and the heat radiation plate, the spacer being made of an insulating material.
7. The semiconductor device of claim 1 , wherein the heat radiation plate is made of an insulating material.
8. The semiconductor device of claim 7 , wherein the insulating material comprises ceramic.
9. The semiconductor device of claim 8 , wherein the ceramic comprises alumina, aluminum nitride or silicon nitride.
10. The semiconductor device of claim 1 , further comprising: a joining layer existing between the semiconductor chip and the die pad section to join the semiconductor chip and the die pad section together.
11. A semiconductor device mounting structure, comprising:
the semiconductor device of claim 1 ;
a substrate to which the semiconductor device is mounted; and
a radiator member fixed with respect to the substrate and configured to directly face the heat radiation plate.
12. The semiconductor device of claim 1 , wherein the semiconductor chip is a power chip, and further comprising an LSI chip configured to control the power chip,
wherein the heat radiation plate is arranged at a rear surface side of the die pad section to which the power chip is mounted, and
wherein the semiconductor device is an IPM semiconductor device.
13. A semiconductor device, comprising:
a die pad section;
a semiconductor chip joined to the die pad section;
a heat radiation plate in direct contact with the die pad section; and
an encapsulating resin portion configured to cover at least semiconductor-chip-side regions of the die pad section, the semiconductor chip and the heat radiation plate,
wherein the die pad section has a major surface and a rear surface, the semiconductor chip is joined to the major surface of the die pad section,
wherein the heat radiation plate has a major surface and a side surface, the major surface of the heat radiation plate directly facing the rear surface of the die pad section and the side surface of the heat radiation plate being perpendicular to the major surface of the heat radiation plate in direct contact with the encapsulating resin portion,
wherein the heat radiation plate includes a dropout prevention portion protruding from the side surface of the heat radiation plate, the dropout prevention portion has a major surface, and the major surface of the dropout prevention portion is integrally formed with the major surface of the heat radiation plate, and
wherein a concave-convex portion is formed integrally on the major surface of the dropout prevention portion and the major surface of the heat radiation plate.