IP Library Granted Patent US 9,902,828
Granted Patent B2
US 9,902,828 · App. 15/111,969 · Granted Feb 27, 2018

High-density polyethylene mixed resin particles, composite resin particles, foamed particles and foamed molded body

Inventors: Hiroki Oowaki (Shiga, JP); Yuichi Gondoh (Nara, JP)
Assignee: SEKISUI PLASTICS CO., LTD.
C08J9/18C08F255/02C08F285/00C08J9/0014C08J9/0019C08J9/0023C08J9/0028C08J9/0061C08J9/141C08J9/232C08L23/06C08L25/06C08J2203/14C08J2205/052C08J2325/06C08J2423/06C08J2423/08C08J2431/02C08J2431/04C08J2433/04C08J2433/08
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Quick Facts
Patent No.
US 9,902,828
App. No.
15/111,969
Granted
Feb 27, 2018
Kind
B2
Abstract

High-density polyethylene mixed resin particles used as seed particles during seed polymerization, wherein said seed particles contain a mixed resin of 100 parts by weight of high-density polyethylene and 20 to 100 parts by weight of an ethylene copolymer; said high-density polyethylene has a density of 935 to 960 kg/m 3 and a softening temperature of 115 to 130° C.; said ethylene copolymer is a copolymer of an ester-based monomer selected from an acrylic acid alkyl ester and an aliphatic saturated monocarboxylic acid vinyl, and etylene, contains 1 to 20% by weight of an ester-based monomer-derived component, and has a softening temperature of 75 to 110° C.; said acrylic acid alkyl ester is selected from methyl acrylate and ethyl acrylate; and said aliphatic saturated monocarboxylic acid vinyl is selected from vinyl acetate and vinyl propionate.

Claims (13)

1. High-density polyethylene mixed resin particles used as seed particles during seed polymerization, wherein:

said seed particles contain a mixed resin of 100 parts by weight of high-density polyethylene and 20 to 100 parts by weight of an ethylene copolymer;

said high-density polyethylene has a density of 935 to 960 kg/m 3 and a softening temperature of 115 to 130° C.;

said ethylene copolymer is a copolymer of an ester-based monomer selected from an acrylic acid alkyl ester and an aliphatic saturated vinyl monocarboxylic acid, and ethylene, contains 1 to 20% by weight of an ester-based monomer-derived component, and has a softening temperature of 75 to 110° C.;

said acrylic acid alkyl ester is selected from methyl acrylate and ethyl acrylate; and

said aliphatic saturated monocarboxylic acid vinyl is selected from vinyl acetate and vinyl propionate.

2. The high-density polyethylene mixed resin particles according to claim 1 , wherein said ethylene copolymer has a MFR of 0.2 to 1.0 g/10 minutes and contains 3 to 15% by weight of said ester-based monomer-derived component.

3. Composite resin particles comprising a resin content containing 100 parts by weight of a high-density polyethylene mixed resin derived from said high-density polyethylene mixed resin particles according to claims 1 ; and 100 to 500 parts by weight of a styrene-based polymer obtained by impregnating and polymerizing a styrene-based monomer in said seed particles.

4. The composite resin particles according to claim 3 , wherein said composite resin particles contain 1.5 to 6.0 parts by weight of a flame retardant with respect to 100 parts by weight of said resin content.

5. The composite resin particles according to claim 4 , wherein said flame retardant is a halogen-based flame retardant.

6. The composite resin particles according to claim 4 , further comprising a flame retardant auxiliary agent, wherein said flame retardant auxiliary agent is selected from dicumyl peroxide, 2,3-dimethyl-2,3-diphenyl butane, 3,4-dimethyl-3,4-diphenyl hexane, and cumene hydroperoxide.

7. Expanded particles obtained by impregnating a blowing agent into the composite resin particles according to claim 3 , followed by expanding, the expanded particles having a bulk density of 50 to 15 kg/m 3 .

8. An expanded molded article obtained by expansion molding the expanded particles according to claim 7 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2016
From: OOWAKI, HIROKI; GONDOH, YUICHI
To: SEKISUI PLASTICS CO., LTD.
Reel/Frame 039168/0120 →
Priority Claims (1)
JP 2014-069591 · Mar 28, 2014 · national
Continuity (1)
Related Publication 20160340489A1 · Nov 24, 2016