Heat conversion device
Provided is a heat conversion device including a thermoelectric element, the heat conversion device capable of implementing a heat conversion function of high efficiency in spite of low power consumption by disposing a heat absorption module and a heat emission module in a horizontal direction in a structure of a heat exchange device to which a thermoelectric module is applied, and by implementing a heat conversion effect for air while maintaining a desired air volume and air velocity without flow path resistance.
1. A heat conversion device, comprising:
a first module including a first heat conversion member;
a second module including a second heat conversion member that introduces air passing through the first module to perform heat conversion; and
a thermoelectric module that comes into contact with the first module and the second module to control a heat conversion function,
wherein the first module and the second module are arranged in one side direction based on the thermoelectric module,
wherein the one side direction is defined as any one direction of an upper direction and a lower direction of the thermoelectric module,
wherein at least one of the first heat conversion member and the second heat conversion member includes: a substrate having a first plane in surface contact with air and a second plane opposite the first plane; and at least one flow path pattern that forms an air flow path in the substrate in an air flow direction,
wherein the first module and the second module arranged in the one side direction are arranged in a horizontal direction to a longitudinal direction formed by a first substrate and a second substrate of the thermoelectric module, and
wherein the thermoelectric module has a thermoelectric semiconductor that is electrically connected between the first substrate and the second substrate.
2. The heat conversion device of claim 1 , wherein the first module includes a first heat conversion member receiving unit including a third substrate extending to come into contact with the first substrate of the thermoelectric module.
3. The heat conversion device of claim 2 , wherein the third substrate is integrally formed with the first substrate.
4. The heat conversion device of claim 1 , wherein the second module includes a second heat conversion member receiving unit including a fourth substrate in contact with the second substrate of the thermoelectric module.
5. The heat conversion device of claim 4 , wherein an air discharging surface of the first module and an air inlet surface of the second module are separated from each other.
6. The heat conversion device of claim 5 , wherein a separation distance between the air discharging surface and the air inlet surface ranges from 0.01 to 50.0 mm.
7. The heat conversion device of claim 4 , wherein a volume of the first module has the same as that of the second module.
8. The heat conversion device of claim 4 , wherein a volume of the first module is smaller than that of the second module.
9. The heat conversion device of claim 4 , wherein a ratio of a volume of the first module to a volume of the second module is 1:1˜10.
10. The heat conversion device of claim 1 , further comprising resistance patterns formed on a surface of the flow path pattern to protrude from a surface of the substrate.
11. The heat conversion device of claim 10 , further comprising flow grooves connected to each end of the resistance patterns.
12. The heat conversion device of claim 1 , wherein the flow path pattern has a structure in which a curvature pattern having a regular pitch is implemented in a longitudinal direction of the substrate.
13. The heat conversion device of claim 12 , wherein a ratio of a pitch of a curvature pattern formed at the heat conversion member of the first module to a pitch of a curvature pattern formed at the heat conversion member of the second module is 1˜1.4:1.
14. The heat conversion device of claim 12 , wherein the first module and the second module are configured such that at least two first heat conversion members and at least two second heat conversion members are laminated.
15. The heat conversion device of claim 1 , wherein at least any one of the first heat conversion member and the second heat conversion member includes a plurality of radiant heat pins formed on a radiant heat substrate to protrude in the one side direction.
16. The heat conversion device of claim 15 , wherein the thermoelectric module includes a unit thermoelectric element in which a thermoelectric semiconductor element is disposed between substrates facing each other.
17. The heat conversion device of claim 16 , wherein the first module is a cooling module connected to a heat absorption part of the thermoelectric module, and the second module is a heating module connected to a heat emission part of the thermoelectric module.