Jet impingement cooling apparatuses having non-uniform jet orifice sizes

1. A cooling apparatus comprising:

at least one fluid inlet channel;

at least one fluid outlet channel;

a target surface; and

a jet orifice surface that is offset from the target surface and comprising an array of jet orifices fluidly coupled to the at least one fluid inlet channel, wherein:

each individual jet orifice of the array of jet orifices has an area corresponding to a distance of the individual jet orifice to the at least one fluid outlet channel such that individual jet orifices closer to the at least one fluid outlet channel have an area that is smaller than individual jet orifices further from the at least one fluid outlet channel, and

the area of the individual jet orifices of the array of jet orifices increases radially from a central region of the array of jet orifices.

2. The cooling apparatus of claim 1 , wherein the array of jet orifices are configured such that coolant fluid within the fluid inlet channel flows through the array of jet orifices as an array of impingement jets comprising individual impingement jets that impinge the target surface at substantially equal fluid velocity.

3. The cooling apparatus of claim 2 , wherein the individual jet orifices of the array of jet orifices are sized such that each individual impingement jet of the array of impingement jets orthogonally impinge the target surface.

4. The cooling apparatus of claim 1 , wherein the fluid outlet channel is centrally located with respect to the target surface.

5. The cooling apparatus of claim 1 , wherein the target surface is a thermally conductive target plate.

6. The cooling apparatus of claim 1 , wherein the target surface is thermally coupled to a heat generating device.

7. The cooling apparatus of claim 1 , wherein each individual jet orifice of the array of jet orifices is circular.

8. The cooling apparatus of claim 1 , further comprising an insulation assembly and a semiconductor device coupled to the insulation assembly and the target surface.

9. The cooling apparatus of claim 1 , wherein the array of jet orifices comprises five rows of jet orifices and five columns of jet orifices defining a central jet orifice having a first area, a first ring of jet orifices surrounding the central jet orifice with each individual jet orifice of the first ring of jet orifices having a second area, and a second ring of jet orifices surrounding the first ring of jet orifices with each individual jet orifice of the second ring of jet orifices having a third area, and wherein the second area is greater than the third area and the first area is greater than the second area.

10. A cooling apparatus comprising:

at least one fluid inlet channel;

at least one fluid outlet channel;

a target surface; and

a jet orifice surface that is offset from the target surface and comprising an array of jet orifices fluidly coupled to the at least one fluid inlet channel, wherein:

the target surface and the jet orifice surface at least in part define an impingement chamber having at least one region of relatively high pressure and at least one region of relatively low pressure having a pressure that is lower than a pressure at the region of relatively high pressure when the coolant fluid flows through the array of jet orifices;

each individual jet orifice of the array of jet orifices has an area such that individual jet orifices proximate the at least one region of relatively low pressure have an area that is smaller than individual jet orifices proximate the at least one region of relatively high pressure; and

the area of each individual jet orifice of the array of jet orifices increases radially from a central region of the array of jet orifices.

11. The cooling apparatus of claim 10 , wherein the array of jet orifices are configured such that coolant fluid within the fluid inlet channel flows through the array of jet orifices as an array of impingement jets comprising individual impingement jets that impinge the target surface at substantially equal fluid velocity.

12. The cooling apparatus of claim 10 , wherein the fluid outlet channel is centrally located with respect to the target surface.

13. The cooling apparatus of claim 10 , wherein the target surface is a thermally conductive target plate.

14. The cooling apparatus of claim 10 , wherein the target surface is thermally coupled to a heat generating device.

15. The cooling apparatus of claim 10 , wherein the array of jet orifices comprises five rows of jet orifices and five columns of jet orifices defining a central jet orifice having a first area, a first ring of jet orifices surrounding the central jet orifice with each individual jet orifice of the first ring of jet orifices having a second area, and a second ring of jet orifices surrounding the first ring of jet orifices with each individual jet orifice of the second ring of jet orifices having a third area, wherein the second area is greater than the third area and the first area is greater than the second area.

16. A cooling apparatus comprising:

at least one fluid inlet channel;

a target surface;

four fluid outlet channels positioned above the target surface and about a perimeter of the cooling apparatus;

a jet orifice surface that is offset from the target surface and comprising an array of jet orifices fluidly coupled to the at least one fluid inlet channel, wherein each individual jet orifice of the array of jet orifices has an area corresponding to a distance of the individual jet orifice to the four fluid outlet channels such that the area of the individual jet orifices decreases radially from a central region of the array of jet orifices; and

an insulation assembly thermally coupled to the target surface.

17. The cooling apparatus of claim 16 , wherein the array of jet orifices are configured such that coolant fluid within the fluid inlet channel flows through the array of jet orifices as an array of impingement jets comprising individual impingement jets that impinge the target surface at substantially equal fluid velocity.

18. The cooling apparatus of claim 17 , wherein the individual jet orifices of the array of jet orifices are sized such that each individual impingement jet of the array of impingement jets orthogonally impinge the target surface.

19. The cooling apparatus of claim 16 , wherein each individual jet orifice of the array of jet orifices is circular.

20. The cooling apparatus of claim 16 , further comprising a semiconductor device thermally coupled to the insulation assembly and the target surface.