Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component
A multilayer ceramic electronic component includes a multilayer body including ceramic layers and inner electrode layers, the inner electrode layers being disposed on interfaces between the ceramic layers, and an outer electrode on an external surface of the multilayer body and electrically connected to first end portions of the inner electrode layers exposed to the external surface of the multilayer body. Each of the ceramic layers includes a thin portion with a continuously reducing thickness near the first end portion. Each inner electrode layer includes a thick portion near a connection with the outer electrode, the thick portion having a thickness continuously increasing toward the connection on a first side in accordance with a shape of the thin portion in the ceramic layer. A distance between a second end portion in the inner electrode layer not joined to the outer electrode, and the thick portion adjacent to the second end portion is equal to or longer than an interlayer distance between the inner electrode layers.
1. A multilayer ceramic electronic component comprising:
a multilayer body in which a plurality of ceramic layers and a plurality of first and second inner electrode layers are laminated, the plurality of first and second inner electrode layers being disposed on a plurality of interfaces between the ceramic layers; and
first and second outer electrodes disposed on external surfaces of the multilayer body and electrically connected to first end portions of the first and second inner electrode layers, respectively, the first end portions being exposed to the external surfaces of the multilayer body; wherein
each of the ceramic layers includes a thin portion with a thickness in a vicinity of a respective one of the first end portions that continuously reduces toward the first end portion;
each of the first inner electrode layers includes a first thick portion connected to the first outer electrode in a vicinity of a connection portion with the first outer electrode, the first thick portion having a thickness that continuously increases toward the connection portion on a first side in accordance with a shape of the thin portion in the ceramic layer;
each of the second inner electrode layers includes a second thick portion connected to the second outer electrode in a vicinity of a connection portion with the second outer electrode, the second thick portion having a thickness that continuously increases toward the connection portion on a first side in accordance with a shape of the thin portion in the ceramic layer;
in each of the second inner electrode layers, a distance between a second end portion of the second inner electrode layer, the second end portion not being joined to the second outer electrode, and the first thick portion of the first inner electrode adjacent to the second end portion of the second inner electrode is equal to or longer than an interlayer distance between the first inner electrode layers and the second inner electrode layers; and
in each of the first inner electrode layers, a distance between a second end portion of the first inner electrode layer, the second end portion not being joined to the first outer electrode, and the second thick portion of the second inner electrode adjacent to the second end portion of the first inner electrode is equal to or longer than an interlayer distance between the first inner electrode layers and the second inner electrode layers.
2. The multilayer ceramic electronic component according to claim 1 , wherein the first and second outer electrodes are integral with the first and second inner electrode layers such that the thick portions exposed to the external surfaces of the multilayer body of the plurality of first and second inner electrode layers are united together.
3. The multilayer ceramic electronic component according to claim 1 , wherein each of the ceramic layers includes two thin portions at end portions thereof.
4. The multilayer ceramic electronic component according to claim 1 , wherein each of the ceramic layers is made of ceramic ink.
5. The multilayer ceramic electronic component according to claim 1 , wherein each of the first and second inner electrode layers include redundant portions extending over the first end portions in the ceramic layer.
6. The multilayer ceramic electronic component according to claim 1 , wherein each of the first and second inner electrode layers is made of conductive ink.
7. A method for manufacturing a multilayer ceramic electronic component, the multilayer ceramic electronic component including a multilayer body in which a plurality of ceramic layers and a plurality of first and second inner electrode layers are laminated, the plurality of first and second inner electrode layers being disposed on a plurality of interfaces between the ceramic layers, and first and second outer electrodes disposed on external surfaces of the multilayer body and electrically connected to first end portions of the first and second inner electrode layers, respectively, the first end portions being exposed to the external surfaces of the multilayer body, the method comprising:
a step of forming each of the ceramic layers such that the ceramic layer includes a thin portion with a thickness in a vicinity of a respective one of the first end portions that continuously reduces toward the first end portion;
a step of forming each of the first and second inner electrode layers on the ceramic layers such that each of the first inner electrode layers includes a first thick portion that covers the thin portion, which is formed in the vicinity of the respective one of the first end portions, in the ceramic layers and that has a thickness continuously increasing on a first side in accordance with a shape of the thin portion, and each of the second inner electrode layers includes a second thick portion that covers the thin portion, which is formed in the vicinity of the respective one of the first end portions, in the ceramic layers and that has a thickness continuously increasing on a first side in accordance with a shape of the thin portion;
a step of producing the multilayer body by alternately laminating the ceramic layers and the first and second inner electrode layers such that the first and second thick portions of the first and second inner electrode layers are exposed to the external surfaces, a distance between a second end portion of each of the second inner electrode layers and the first thick portion of the first inner electrode adjacent to the second end portion of the second inner electrode layer is equal to or longer than an interlayer distance between the first inner electrode layers and the second inner electrode layers, and a distance between a second end portion of each of the first inner electrode layers and the second thick portion of the second inner electrode adjacent to the second end portion of the first inner electrode is equal to or longer than an interlayer distance between the first inner electrode layers and the second inner electrode layers; and
a step of forming the first and second outer electrodes to be electrically connected to the thick portions of the first and second inner electrode layers, the thick portions being exposed to the external surfaces of the multilayer body.
8. The method for manufacturing the multilayer ceramic electronic component according to claim 7 , wherein
the first and second inner electrode layers including redundant portions extending over the first end portions in the ceramic layers are formed in the step of forming each of the first and second inner electrode layers;
the redundant portions of the first and second inner electrode layers are united together in the step of producing the multilayer body such that the thick portions of the plurality of first and second inner electrode layers are united together to form the first and second outer electrodes in the step of forming the first and second outer electrodes.
9. The method for manufacturing the multilayer ceramic electronic component according to claim 7 , wherein the ceramic layers and the first and second inner electrode layers are formed by an inkjet technique.
10. The method for manufacturing the multilayer ceramic electronic component according to claim 7 , wherein the first and second outer electrodes are integral with the first and second inner electrode layers such that the first and second thick portions exposed to the external surfaces of the multilayer body of the plurality of first and second inner electrode layers are united together.
11. The method for manufacturing the multilayer ceramic electronic component according to claim 7 , wherein each of the ceramic layers includes two thin portions at end portions thereof.
12. The method for manufacturing the multilayer ceramic electronic component according to claim 7 , wherein each of the ceramic layers is made of ceramic ink.
13. The method for manufacturing the multilayer ceramic electronic component according to claim 7 , wherein each of the first and second inner electrode layers include redundant portions extending over the first end portions in the ceramic layers.
14. The method for manufacturing the multilayer ceramic electronic component according to claim 7 , wherein each of the first and second inner electrode layers is made of conductive ink.