IP Library Granted Patent US 9,909,005
Granted Patent B2
US 9,909,005 · App. 14/420,562 · Granted Mar 6, 2018

Resin composition and resin molded object

Inventors: Atsushi Yamada (Kanagawa, JP); Kenji Ueda (Kanagawa, JP); Takahiro Ohe (Tokyo, JP); Yasuhito Inagaki (Kanagawa, JP)
Assignee: SONY CORPORATION
C08L69/00C08L2201/02
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,909,005
App. No.
14/420,562
Granted
Mar 6, 2018
Kind
B2
Abstract

A halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products. The resin component includes a component A which is a polycarbonate resin, a component B including organic sulfonic acid or organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight, a component C which is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight, and a component D which is a silicone compound, whose content is 0.1% or more and 2.0% or less by weight. Among hydrogen atoms in the silicone compound and the proportion of hydrogen atoms in phenyl groups is 51% or more.

Claims (44)

1. A resin composition that consists of:

a component A which is a resin that is free of halogens;

a component B which is an organic sulfonic acid or an organic sulfonic acid metal salt, the content of the component B being 0.05% or more and 2.0% or less by weight of the composition;

a component C which is a drip inhibit or, the content of the component C being 0.05% or more and 1.0% or less by weight of the composition;

a component D which is a silicone compound; and

a component E which is talc,

wherein,

component A consists only of a polycarbonate resin or a mixture of polycarbonate resins,

each polycarbonate resin in Component A has an average molecular weight in polystyrene equivalent of 36000 or more and 58000 or less as may be obtained by GPC (Gel Permeation Chromatography) measurement using a chloroform solvent and with a polystyrene molecular weight standard substance as a reference,

among hydrogen atoms in component D, (a) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups is 22% or more, or (b) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in hydrogen groups is 22% or more, or (c) a proportion of the hydrogen atoms in hydrogen groups is 22% or more and the proportion of the hydrogen atoms in methyl groups is 50% or more, and

the content of the component D is 0.1% or more by weight and 2.0% or less by weight of the composition.

2. The resin composition according to claim 1 , wherein, among hydrogen atoms in component D, a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups in component D is 29% or more.

3. The resin composition according to claim 1 , wherein the component D is a polyorganosiloxane.

4. The resin composition according to claim 1 , wherein the component E which is talc has particles with an average median diameter of 4.6 μm or more and 6.0 μm or less.

5. The resin composition according to claim 1 , wherein the component B is a sulfonic acid of a high molecular polymer having an aromatic ring or a sulfonic acid metal salt of a high molecular polymer having an aromatic ring.

6. The resin composition according to claim 1 , wherein the component C is a polytetrafluoroethylene having fibril-forming abilities.

7. A resin composition that consists of:

a component A which is a resin that is free of halogens;

a component B which is an organic sulfonic acid or an organic sulfonic acid metal salt;

a component C which is a drip inhibitor; and

a component D which is a silicone compound,

wherein,

component A consists only of a polycarbonate resin or a mixture of polycarbonate resins,

each polycarbonate resin in Component A has an average molecular weight in polystyrene equivalent of 36000 or more and 58000 or less as may be obtained by GPC (Gel Permeation Chromatography) measurement using a chloroform solvent and with a polystyrene molecular weight standard substance as a reference, among hydrogen atoms in component D, (a) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups is 22% or more, (b) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in hydrogen groups is 22% or more, or (c) a proportion of the hydrogen atoms in hydrogen groups is 22% or more and the proportion of the hydrogen atoms in methyl groups is 50% or more.

8. A resin molded object comprising a composition that consists of:

a component A which is a resin that is free of halogens;

a component B which is an organic sulfonic acid or an organic sulfonic acid metal salt, the content of the component B being 0.05% or more and 2.0% or less by weight of the composition;

a component C which is a drip inhibitor, the content of the component C being 0.05% or more and 1.0% or less by weight of the composition; and

a component D which is a silicone compound,

wherein,

component A consists only of a polycarbonate resin or a mixture of polycarbonate resins,

each polycarbonate resin in Component A has an average molecular weight in polystyrene equivalent of 36000 or more and 58000 or less as may be obtained by GPC (Gel Permeation Chromatography) measurement using a chloroform solvent and with a polystyrene molecular weight standard substance as a reference,

among hydrogen atoms in component D, (a) (a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups is 22% or more, (b) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in hydrogen groups is 22% or more, or (c) a proportion of the hydrogen atoms in hydrogen groups is 22% or more and the proportion of the hydrogen atoms in methyl groups is 50% or more, and

the content of the component D is 0.1% or more and 2.0% or less by weight of the composition.

9. A resin composition that consists of:

a component A which is a polycarbonate resin that is free of halogens;

a component B which is an organic sulfonic acid or an organic sulfonic acid metal salt;

a component C which is a drip inhibitor;

a component D which is a silicone compound; and

a component E which is talc,

wherein,

component A consists only of a polycarbonate resin or a mixture of polycarbonate resins,

each polycarbonate resin in Component A has an average molecular weight in polystyrene equivalent of 36000 or more and 58000 or less as may be obtained by GPC (Gel Permeation Chromatography) measurement using a chloroform solvent and with a polystyrene molecular weight standard substance as a reference,

among hydrogen atoms in component D, (a) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in methyl groups is 22% or more, (b) a proportion of the hydrogen atoms in phenyl groups is 51% or more and a proportion of the hydrogen atoms in hydrogen groups is 22% or more, or (c) a proportion of the hydrogen atoms in hydrogen groups is 22% or more and the proportion of the hydrogen atoms in methyl groups is 50% or more.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2015
From: YAMADA, ATSUSHI; UEDA, KENJI; OHE, TAKAHIRO; INAGAKI, YASUHITO
To: SONY CORPORATION
Reel/Frame 034924/0473 →
Priority Claims (1)
JP 2012-192684 · Aug 31, 2012 · national
Continuity (1)
Related Publication 20150210850A1 · Jul 30, 2015