Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same

1. A semiconductor device package, comprising:

a carrier having a top surface and a bottom surface;

a grounding element;

a plurality of electrical connections extending between the top surface of the carrier and the bottom surface of the carrier;

a first electronic component disposed on the carrier;

a second electronic component disposed on a pad of the carrier and is electrically connected to at least one of the electrical connections;

a package body disposed on the carrier and encapsulating the first electronic component and the second electronic component;

a shield disposed on the package body, wherein the shield covers at least a top surface and a lateral surface of the package body, wherein the shield comprises a plurality of non-magnetic conductive layers, a plurality of insulating layers and a plurality of magnetic conductive layers, and wherein at least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer; wherein the plurality of electrical connections includes a first electrical connection that electrically connects the shield to the grounding element; and

an interconnection electrically connecting at least one of the non-magnetic conductive layers of the shield to at least one of the magnetic conductive layers of the shield.

2. The semiconductor device package of claim 1 , wherein the grounding element is disposed at a peripheral edge of the carrier, and wherein the shield electrically connects the grounding element through the first electrical connection.

3. The semiconductor device package of claim 1 , further comprising:

a plurality of first conductive elements disposed on the carrier;

a magnetic insulating layer disposed on the shield; and

a patterned conductive layer disposed on the magnetic insulating layer;

wherein each of the first conductive elements electrically connects the patterned conductive layer to at least one of the first electronic component and the second electronic component; and

wherein the package body encapsulates a portion of each of the first conductive elements.

4. The semiconductor device package of claim 3 , wherein the patterned conductive layer is disposed in a pattern to couple to an external magnetic field, and the pattern includes multiple overlapping patterns.

5. The semiconductor device package of claim 3 , wherein the magnetic insulating layer comprises a ferromagnetic material.

6. The semiconductor device package of claim 3 , further comprising a redistribution layer disposed on the carrier, wherein the first conductive elements electrically connect the patterned conductive layer to the redistribution layer.

7. The semiconductor device package of claim 3 , wherein the shield defines a hole, and the hole exposes a top portion of at least one of the first conductive elements at a top surface of the shield, and the semiconductor device package further comprises a second conductive element electrically connecting the patterned conductive layer to the top portion of the at least one of the first conductive elements exposed in the hole.

8. The semiconductor device package of claim 7 , further comprising an insulation material covering the second conductive element.

9. The semiconductor device package of claim 7 , wherein the second conductive element comprises a bonding wire, a conductive stud or a conductive pillar.

10. The semiconductor device package of claim 3 , wherein a portion of the package body exposes a top portion of at least one of the first conductive elements.

11. The semiconductor device package of claim 10 , wherein the top portion of the at least one of the first conductive elements is substantially coplanar with a top surface of the shield.

12. The semiconductor device package of claim 10 , wherein the magnetic insulating layer is disposed above the package body.

13. A semiconductor device package, comprising:

a carrier;

a plurality of electrical connections extending through the carrier;

an electronic component disposed on the carrier;

a package body disposed on the carrier and encapsulating the electronic component;

a shield disposed on the package body and contacting at least one of the electrical connections, wherein the shield covers at least a top surface and a lateral surface of the package body, wherein the shield comprises a plurality of non-magnetic conductive layers, a plurality of magnetic conductive layers and a plurality of insulating layers, at least one of the insulating layers is disposed between at least one of the non-magnetic conductive layers and at least one of the magnetic conductive layers, at least one of the non-magnetic conductive layers is electrically connected to at least one of the magnetic conductive layers;

an interconnection electrically connected to at least one of the non-magnetic conductive layers and at least one of the magnetic conductive layers; and

a ground pad disposed at a periphery of the carrier, wherein the interconnection is electrically coupled to the ground pad.

14. A semiconductor device package, comprising:

a carrier;

an electronic component disposed on the carrier;

a plurality of first conductive elements disposed on the carrier;

a package body disposed on the carrier, wherein the package body encapsulates the electronic component and a portion of each of the first conductive elements;

a shield disposed on the package body, wherein the shield covers at least a top surface and a lateral surface of the package body, wherein the shield comprises a plurality of non-magnetic conductive layers, a plurality of insulating layers and a plurality of magnetic conductive layers, and wherein at least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer;

an interconnection electrically connecting the non-magnetic conductive layers and the magnetic conductive layers;

a magnetic insulating layer disposed on the shield; and

a patterned conductive layer disposed on the magnetic insulating layer, wherein each of the first conductive elements electrically connects the patterned conductive layer to the electronic component.

15. A semiconductor device package, comprising:

a carrier;

an electronic component disposed on the carrier;

a plurality of first conductive elements disposed on the carrier;

a package body disposed on the carrier, wherein the package body encapsulates the electronic component and a portion of each of the first conductive elements;

a shield disposed on the package body, wherein the shield comprises a plurality of non-magnetic conductive layers, a plurality of insulating layers and a plurality of magnetic conductive layers, wherein at least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer, and wherein the shield defines a hole, and the hole exposes a top portion of at least one of the first conductive elements at a top surface of the shield;

an interconnection electrically connecting the non-magnetic conductive layers and the magnetic conductive layers;

a magnetic insulating layer disposed on the shield;

a patterned conductive layer disposed on the magnetic insulating layer, wherein each of the first conductive elements electrically connects the patterned conductive layer to the electronic component; and

a second conductive element electrically connecting the patterned conductive layer to the top portion of the at least one of the first conductive elements exposed in the hole.