IP Library › Granted Patent US 9,924,592
Granted Patent B2
US 9,924,592 · App. 15/240,062 · Granted Mar 20, 2018

Three-dimensional laminated circuit board, electronic device, information processing system, and information network system

Inventors: Shigenobu Sekine (Tokyo, JP); Hiroaki Ikeda (Tokyo, JP)
Assignee: Napra Co., Ltd.
H05K1/0275H01L23/49822H01L23/49827H01L23/49838H01L23/573H01L27/0688H05K1/0298H05K1/115
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Quick Facts
Patent No.
US 9,924,592
App. No.
15/240,062
Granted
Mar 20, 2018
Kind
B2
Abstract

Aiming at providing a three-dimensional laminated circuit board which can be confirmed, in an easy and exact manner, to be an authentic product having been manufactured and packaged honestly; and at providing an electronic device, an information processing system, and an information network system using the same, disclosed is a three-dimensional laminated circuit board that includes a substrate, interconnects, and an authentication pattern; the interconnects being provided in the thickness direction of the substrate; wherein the authentication pattern is provided on the substrate, and is characterized by material, shape, layout, structure or size discriminable from those of the interconnects and the substrate.

Claims (11)

1. A three-dimensional laminated circuit board comprising

a substrate,

an interconnect, and

an authentication pattern,

the interconnect being provided to the substrate so as to be electrically insulated therefrom,

the authentication pattern being provided on the substrate, and being characterized by material, shape, layout, structure or size which are discriminable from those of the interconnect and the substrate by external observation,

the interconnect comprising a conductor that is supported by an electric insulation part and extends in the thickness direction of the substrate, and

the electric insulation part of the authentication pattern being configured by using an insulation particle as an aggregate that is surrounded by Si—O bonds resulted from a reaction between an Si particle and an organosilicon compound.

2. An electronic device comprising a three-dimensional laminated circuit board, the three-dimensional laminated circuit board comprising the three-dimensional laminated circuit board described in claim 1 .

3. An information processing system comprising an electronic device, the electronic device comprising the electronic device described in claim 2 .

4. An information network system comprising an electronic device, the electronic device comprising the electronic device described in claim 2 .

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST NAME OF THE SECOND INVENTOR PREVIOUSLY RECORDED AT REEL: 039493 FRAME: 0976. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Aug 23, 2016
From: SEKINE, SHIGENOBU; IKEDA, HIROAKI
To: NAPRA CO., LTD.
Reel/Frame 039784/0816 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2016
From: SEKINE, SHIGENOBU; IKEDA, HRIOAKI
To: NAPRA CO., LTD.
Reel/Frame 039493/0976 →
Continuity (1)
Related Publication 20180054887A1 · Feb 22, 2018