Semiconductor device including oxide semiconductor film containing indium
A highly reliable semiconductor device having stable electric characteristics is provided by suppressing, in a transistor including an oxide semiconductor film, diffusion of indium into an insulating film in contact with the oxide semiconductor film and improving the characteristics of the interface between the oxide semiconductor film and the insulating film. In an oxide semiconductor film containing indium, the indium concentration at a surface is decreased, thereby preventing diffusion of indium into an insulating film on and in contact with the oxide semiconductor film. By decreasing the indium concentration at the surface of the oxide semiconductor film, a layer which does not substantially contain indium can be formed at the surface. By using this layer as part of the insulating film, the characteristics of the interface between the oxide semiconductor film and the insulating film in contact with the oxide semiconductor film are improved.
1. A semiconductor device comprising:
a first insulating film over a substrate;
an oxide semiconductor film containing indium over the first insulating film;
a source electrode and a drain electrode over the oxide semiconductor film; and
a second insulating film over the source electrode and the drain electrode,
wherein the first insulating film is in contact with a first region of the oxide semiconductor film,
wherein the second insulating film is in contact with a second region of the oxide semiconductor film,
wherein one of the source electrode and the drain electrode is in contact with a third region of the oxide semiconductor film, the third region including a top surface of the oxide semiconductor film,
wherein a concentration of indium in the second region is lower than a concentration of indium in the first region, and
wherein the concentration of indium in the second region is lower than a concentration of indium in the third region.
2. The semiconductor device according to claim 1 , wherein the oxide semiconductor film further contains at least one element selected from the group consisting of Ga, Sn, and Zn.
3. The semiconductor device according to claim 1 , wherein the concentration of indium in the first region is higher than or equal to 10 at. % and lower than or equal to 25 at. %.
4. The semiconductor device according to claim 1 , wherein the concentration of indium in the second region is higher than or equal to 0 at. % and lower than 13 at. %.
5. The semiconductor device according to claim 1 , wherein the second region does not substantially contain indium.
6. The semiconductor device according to claim 1 , wherein the second region overlaps with neither the source electrode nor the drain electrode.
7. The semiconductor device according to claim 1 , wherein the oxide semiconductor film comprises a crystal, a c-axis of the crystal being parallel to a normal vector of a surface of the oxide semiconductor film.
8. A semiconductor device comprising:
a first insulating film over a substrate;
a source electrode and a drain electrode over the first insulating film;
an oxide semiconductor film containing indium over the source electrode and the drain electrode; and
a second insulating film over the oxide semiconductor film,
wherein the first insulating film is in contact with a first region of the oxide semiconductor film,
wherein the second insulating film is in contact with a second region of the oxide semiconductor film,
wherein a concentration of indium in the second region is lower than a concentration of indium in the first region, and
wherein the oxide semiconductor film comprises a crystal, a c-axis of the crystal being parallel to a normal vector of a surface of the oxide semiconductor film.
9. The semiconductor device according to claim 8 , wherein the oxide semiconductor film further contains at least one element selected from the group consisting of Ga, Sn, and Zn.
10. The semiconductor device according to claim 8 , wherein the concentration of indium in the first region is higher than or equal to 10 at. % and lower than or equal to 25 at. %.
11. The semiconductor device according to claim 8 , wherein the second region does not substantially contain indium.
12. The semiconductor device according to claim 8 , wherein the concentration of indium in the second region is higher than or equal to 0 at. % and lower than 13 at. %.
13. A semiconductor device comprising:
a gate electrode over a substrate;
a gate insulating film over covering the gate electrode;
an oxide semiconductor film containing indium over the gate insulating film; and
an insulating film over the oxide semiconductor film,
wherein the gate insulating film is in contact with a first region of the oxide semiconductor film,
wherein the insulating film is in contact with a second region of the oxide semiconductor film,
wherein a concentration of indium in the second region is lower than a concentration of indium in the first region, and
wherein the oxide semiconductor film comprises a crystal, a c-axis of the crystal being parallel to a normal vector of a surface of the oxide semiconductor film.
14. The semiconductor device according to claim 13 , wherein the oxide semiconductor film further contains at least one element selected from the group consisting of Ga, Sn, and Zn.
15. The semiconductor device according to claim 13 , wherein the concentration of indium in the first region is higher than or equal to 10 at. % and lower than or equal to 25 at. %.
16. The semiconductor device according to claim 13 , wherein the second region does not substantially contain indium.
17. The semiconductor device according to claim 13 , wherein the concentration of indium in the second region is higher than or equal to 0 at. % and lower than 13 at. %.
18. A semiconductor device comprising:
an insulating film over a substrate;
an oxide semiconductor film containing indium over the insulating film;
a gate insulating film over the oxide semiconductor film;
a gate electrode over the gate insulating film; and
a wiring over and in contact with the oxide semiconductor film through an opening of the gate insulating film,
wherein the insulating film is in contact with a first region of the oxide semiconductor film,
wherein the gate insulating film is in contact with a second region of the oxide semiconductor film,
wherein a concentration of indium in the second region is lower than a concentration of indium in the first region, and
wherein the oxide semiconductor film comprises a crystal, a c-axis of the crystal being parallel to a normal vector of a surface of the oxide semiconductor film.
19. The semiconductor device according to claim 18 , wherein the second region does not substantially contain indium.
20. The semiconductor device according to claim 18 , wherein the oxide semiconductor film further contains at least one element selected from the group consisting of Ga, Sn, and Zn.
21. The semiconductor device according to claim 18 , wherein the concentration of indium in the first region is higher than or equal to 10 at. % and lower than or equal to 25 at. %.
22. The semiconductor device according to claim 18 , wherein the concentration of indium in the second region is higher than or equal to 0 at. % and lower than 13 at. %.
23. A semiconductor device comprising:
a gate electrode over a substrate;
a gate insulating film over the gate electrode;
an oxide semiconductor film containing indium over the gate insulating film; and
an insulating film over the oxide semiconductor film,
wherein the gate insulating film is in contact with a first region of the oxide semiconductor film,
wherein the insulating film is in contact with a second region of the oxide semiconductor film,
wherein a concentration of indium in the second region is lower than a concentration of indium in the first region, and
wherein at least a region of the oxide semiconductor film comprises crystals, wherein c-axis of each crystal is substantially parallel to a normal vector of a surface of the oxide semiconductor film at a location of the crystal.
24. The semiconductor device according to claim 23 , wherein the oxide semiconductor film further contains at least one element selected from the group consisting of Ga, Sn, and Zn.
25. The semiconductor device according to claim 23 , wherein the concentration of indium in the first region is higher than or equal to 10 at. % and lower than or equal to 25 at. %.
26. The semiconductor device according to claim 23 , wherein the second region does not substantially contain indium.
27. The semiconductor device according to claim 23 , wherein the concentration of indium in the second region is higher than or equal to 0 at. % and lower than 13 at. %.