IP Library › Granted Patent US 9,930,781
Granted Patent B2
US 9,930,781 · App. 15/387,941 · Granted Mar 27, 2018

Receptacle assembly and module assembly

Inventors: Yosuke Takai (Tokyo, JP); Toshiyasu Ito (Tokyo, JP)
Assignee: Yamaichi Electronics Co., Ltd.
H05K1/141G02B6/4277H01R12/7076H04Q1/14H05K1/0203H05K7/1461H05K7/20545H05K9/0015H05K9/0062G02B6/4284H05K2201/10189
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,930,781
App. No.
15/387,941
Granted
Mar 27, 2018
Kind
B2
Abstract

In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector. The receptacle assembly includes a guide member provided on the periphery of the opening of the wiring board and configured to form a module accommodation portion to detachably accommodate the module comprising a module board and to guide the module, a connector unit provided on the wiring board and configured to electrically connect the module board of the module to the wiring board, a first EMI gasket sealing a gap between a lower end portion of a connector cover covering the connector unit and the wiring board, and a second EMI gasket sealing a gap between a connecting end portion of the module and the periphery of an opening of the connector unit.

Claims (9)

1. A receptacle assembly comprising:

a guide member provided on the periphery of an opening of a wiring board which has the opening, and configured to form a module accommodation portion to detachably accommodate a module comprising a module board, and configured to guide the module;

a connector unit provided on the wiring board at a position adjacent to the module accommodation portion, and configured to electrically connect the module board of the module to the wiring board;

a first EMI gasket sealing a gap between a lower end portion of a connector cover covering the connector unit and the wiring board; and

a second EMI gasket sealing a gap between a connecting end portion of the module and the periphery of an opening of the connector unit when the module is placed to the module accommodation portion through the opening of the connector unit, wherein when the module is accommodated by the module accommodation portion, a position of a lower end portion of the module is positioned at a position lower than a position of the wiring board through an opening of the wiring board,

wherein the connector cover covering the connector unit is electrically connected to a ground line of the wiring board through a third EMI gasket and a fourth EMI gasket which are conductive and which are provided between the connector cover and a ground line contact pad formed on a surface of the wiring board.

2. The receptacle assembly according to claim 1 , wherein the third EMI gasket is pressed to a first ground line contact pad which is electrically connected to the ground line of the wiring board and the fourth EMI gasket is pressed to a second ground line contact pad which is electrically connected to the ground line of the wiring board.

3. The receptacle assembly according to claim 2 , wherein the first ground line contact pad is formed on the periphery of the connector unit at a surface of a connector support portion of the wiring board and an inner peripheral surface forming a part of the opening of the wiring board.

4. The receptacle assembly according to claim 2 , wherein the second ground line contact pad is formed on the periphery of the connector unit at a back side of a connector support portion of the wiring board.

Priority Claims (1)
JP 2014-158998 · Aug 4, 2014 · national
Continuity (2)
Continuation In Part 14816391 · Aug 3, 2015
Related Publication 20170099735A1 · Apr 6, 2017