IP Library Granted Patent US 9,932,676
Granted Patent B2
US 9,932,676 · App. 15/122,548 · Granted Apr 3, 2018

Pretreatment solution for electroless plating and electroless plating method

Inventors: Masahiro Ito (Hiratsuka, JP); Yuichi Adachi (Hiratsuka, JP)
Assignee: ELECTROPLATING ENGINEERS OF JAPAN LIMITED
C23C18/18C23C18/1608C23C18/1612C23C18/1633C23C18/182C23C18/1841C23C18/1868C23C18/1889C23C18/30C23C18/31C23C18/32C23C18/42C23C18/44
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Quick Facts
Patent No.
US 9,932,676
App. No.
15/122,548
Granted
Apr 3, 2018
Kind
B2
Abstract

The pretreatment solution for electroless plating of the present invention is composed of noble metal colloidal nanoparticles, a sugar alcohol, and water. The colloidal nanoparticles are gold, platinum, or palladium, have an average particle diameter of 5 to 80 nm, and are contained in the pretreatment solution in an amount of 0.01 to 10 g/L as metal mass. The sugar alcohol is at least one selected from the group consisting of tritol, tetritol, pentitol, hexitol, heptitol, octitol, inositol, quercitol, or pentaerythritol and is contained in the pretreatment solution in an amount of 0.01 to 200 g/L in total. The electroless plating method of the present invention uses the pretreatment solution and performs the electroless plating in an electroless plating bath.

Claims (12)

1. A pretreatment solution for electroless plating, comprising noble metal colloidal nanoparticles, a sugar alcohol, and water,

wherein the colloidal nanoparticles are platinum nanoparticles, and have an average particle diameter of 5 to 80 nm, and are contained in the pretreatment solution in an amount of 0.01 to 10 g/L as metal mass;

the sugar alcohol is at least one selected from the group consisting of glycerin, erythritol, xylitol, inositol, or pentaerythritol and is contained in the pretreatment solution in an amount of 0.01 to 200 g/L in total; and

the remainder is water.

2. A pretreatment solution for electroless plating, comprising noble metal colloidal nanoparticles, a sugar alcohol, and water,

wherein the colloidal nanoparticles are palladium, and have an average particle diameter of 5 to 80 nm, and are contained in the pretreatment solution in an amount of 0.01 to 10 g/L as metal mass;

the sugar alcohol is at least one selected from the group consisting of glycerin, erythritol, xylitol, or mannitol and is contained in the pretreatment solution in an amount of 0.01 to 200 g/L in total; and

the remainder is water.

3. A pretreatment solution for electroless plating, comprising noble metal colloidal nanoparticles, a sugar alcohol, and water,

wherein the colloidal nanoparticles are gold, and have an average particle diameter of 5 to 80 nm, and are contained in the pretreatment solution in an amount of 0.01 to 10 g/L as metal mass;

the sugar alcohol is at least one selected from the group consisting of glycerin, erythritol, xylitol, mannitol, or pentaerythritol and is contained in the pretreatment solution in an amount of 0.01 to 200 g/L in total; and

the remainder is water.

Assignments (2)
CHANGE OF NAME Recorded Aug 31, 2022
From: ELECTROPLATING ENGINEERS OF JAPAN LIMITED
To: EEJA LTD.
Reel/Frame 061364/0853 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2016
From: ITO, MASAHIRO; ADACHI, YUICHI
To: ELECTROPLATING ENGINEERS OF JAPAN LIMITED
Reel/Frame 039587/0147 →
Priority Claims (1)
JP 2014-146991 · Jul 17, 2014 · national
Continuity (1)
Related Publication 20170067164A1 · Mar 9, 2017