Antenna structures with molded and coated substrates
Electronic devices may be provided with antenna structures. The antenna structures may be used in wirelessly transmitting and receiving radio-frequency signals. Antenna structures may be formed from molded dielectric substrates. Patterned conductive material may be formed on the dielectric substrates. The dielectric substrates may be formed from molded materials such as glass or ceramic. Sheets of dielectric or dielectric powder may be compressed to form a dielectric substrate of a desired shape. The patterned conductive material may be formed from metallic paint or other conductors. A hollow antenna chamber may be formed by joining molded dielectric structures. An antenna such as an indirectly-fed loop antenna or other antennas may be formed from the molded dielectric substrates and patterned conductors.
1. A method, comprising:
molding a first dielectric structure in heated molding equipment;
molding a second dielectric structure in heated molding equipment, wherein the first and second dielectric structures comprise dielectric material selected from the group consisting of glass and ceramic;
applying a patterned conductive layer to the molded first and second dielectric structures to form a first loop antenna structure and a second loop antenna structure, wherein the first and second loop antenna structures form an indirectly-fed loop antenna, wherein applying the patterned conductive layer to the molded first and second dielectric structures to form the first loop antenna structure and the second loop antenna structure comprises:
applying the patterned conductive layer to the molded first and second dielectric structures to form a loop antenna and a loop-shaped feeding conductor that is configured to indirectly feed the loop antenna;
attaching the molded first dielectric structure to the molded second dielectric structure using conductive material to form a carrier for the indirectly-fed loop antenna.
2. The method defined in claim 1 , wherein the loop antenna is formed along at least three sides of the carrier.
3. The method defined in claim 2 , wherein the loop-shaped feeding conductor is formed along at least two sides of the carrier.