Multilayer ceramic electronic component
A multilayer ceramic capacitor includes a ceramic element body including internal electrodes therein. External electrodes are provided on end surfaces of the ceramic element body and electrically connected to exposed portions of respective ones of the internal electrodes. Each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer. In a cross section including a first interface between the sintered metal layer and the conductive resin layer, the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer, each of the recesses having a shape in which a dimension of the inner portion is larger than a dimension of the inlet measured along the first interface, and in a cross section including a second interface between the conductive resin layer and the plating layer, a number of the metal particles exposed from the conductive resin layer in a portion of the second interface with a length of about 1 mm is 50 to 250.
1. A multilayer ceramic electronic component comprising:
a ceramic element body in which internal electrodes are provided and which includes a first main surface, a second main surface facing the first main surface, a first side surface connected to the first main surface and the second main surface, a second side surface facing the first side surface, a first end surface connected to the first main surface, the second main surface, the first side surface, and the second side surface, and a second end surface facing the first end surface; and
external electrodes arranged on at least the first and second end surfaces and at least a portion of the first main surface or the second main surface of the ceramic element body so as to be electrically connected to respective ones of the internal electrodes; wherein
each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer which are arranged in that order from the ceramic element body;
the conductive resin layer includes resin and metal particles;
the sintered metal layer includes glass and metal;
the plating layer includes a Ni plating layer;
when a cross section including a first interface between the sintered metal layer and the conductive resin layer is viewed from any one of the first main surface, the second main surface, the first side surface, and the second side surface, the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer, each of the recesses having a shape in which a dimension of the inner portion is larger than a dimension of the inlet measured along the first interface; and
when a cross section including a second interface between the conductive resin layer and the plating layer is viewed from any one of the first main surface, the second main surface, the first side surface, and the second side surface, a number of the metal particles exposed from the conductive resin layer in a portion of the second interface with a length of about 1 mm is 50 to 250.
2. The multilayer ceramic electronic component according to claim 1 , wherein the metal of the sintered metal layer includes Cu.
3. The multilayer ceramic electronic component according to claim 2 , wherein the metal particles of the conductive resin layer includes Cu and/or Ag.
4. A multilayer ceramic electronic component comprising:
a ceramic element body in which internal electrodes are provided and which includes a first main surface, a second main surface facing the first main surface, a first side surface connected to the first main surface and the second main surface, a second side surface facing the first side surface, a first end surface connected to the first main surface, the second main surface, the first side surface, and the second side surface, and a second end surface facing the first end surface; and
external electrodes arranged on at least the first and second end surfaces and at least a portion of the first main surface or the second main surface of the ceramic element body so as to be electrically connected to respective ones of the internal electrodes; wherein
each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer which are arranged in that order from the ceramic element body;
the conductive resin layer includes resin and metal particles;
the sintered metal layer includes glass and metal;
when a cross section including a first interface between the sintered metal layer and the conductive resin layer is viewed from any one of the first main surface, the second main surface, the first side surface, and the second side surface, the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer, each of the recesses having a shape in which a dimension of the inner portion is larger than a dimension of the inlet measured along the first interface;
when a cross section including a second interface between the conductive resin layer and the plating layer is viewed from any one of the first main surface, the second main surface, the first side surface, and the second side surface, a number of the metal particles exposed from the conductive resin layer in a portion of the second interface with a length of about 1 mm is 50 to 250;
at least some of the metal particles of the conductive resin layer are disposed in at least some of the recesses; and
at least some of the resin of the conductive resin layer is disposed in the at least some of the recesses.
5. The multilayer ceramic electronic component according to claim 4 , wherein the metal of the sintered metal layer includes Cu.
6. The multilayer ceramic electronic component according to claim 5 , wherein the metal particles of the conductive resin layer includes Cu and/or Ag.
7. The multilayer ceramic electronic component according to claim 6 , wherein the plating layer includes a Ni plating layer.
8. A multilayer ceramic electronic component comprising:
a ceramic element body in which internal electrodes are provided and which includes a first main surface, a second main surface facing the first main surface, a first side surface connected to the first main surface and the second main surface, a second side surface facing the first side surface, a first end surface connected to the first main surface, the second main surface, the first side surface, and the second side surface, and a second end surface facing the first end surface; and
external electrodes arranged on at least the first and second end surfaces and at least a portion of the first main surface or the second main surface of the ceramic element body so as to be electrically connected to respective ones of the internal electrodes; wherein
each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer which are arranged in that order from the ceramic element body;
the conductive resin layer includes resin and metal particles;
the sintered metal layer includes glass and metal;
when a cross section including a first interface between the sintered metal layer and the conductive resin layer is viewed from any one of the first main surface, the second main surface,
the first side surface, and the second side surface, the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer, each of the recesses having a shape in which a dimension of the inner portion is larger than a dimension of the inlet measured along the first interface;
when a cross section including a second interface between the conductive resin layer and the plating layer is viewed from any one of the first main surface, the second main surface, the first side surface, and the second side surface, a number of the metal particles exposed from the conductive resin layer in a portion of the second interface with a length of about 1 mm is 50 to 250;
a material of the conductive resin layer is disposed in at least some of the recesses; and
the metal particles include first particles and second particles with shapes that are different from the first particles.
9. The multilayer ceramic capacitor according to claim 8 , wherein
a ratio of a number of the second particles to a number of the first particles is about 3/7 to about 7/3; and
the first particles have spherical or substantially spherical shapes, and the second particles have flat or substantially flat shapes.
10. The multilayer ceramic capacitor according to claim 9 , wherein at least some of the metal particles of the conductive resin layer are disposed in the at least some of the recesses.
11. The multilayer ceramic electronic component according to claim 10 , wherein
the metal of the sintered metal layer includes Cu;
the metal particles of the conductive resin layer includes Cu and/or Ag; and
the plating layer includes Ni plating layer.
12. The multilayer ceramic capacitor according to claim 8 , wherein
a ratio of a number of the second particles to a number of the first particles is about 3/7 to about 7/3;
the first particles are configured such that a ratio of a long side to a short side is about 5/1 or more in a cross section of the metal particles; and
the second particles are configured such that a ratio of a long side to a short side is less than about 5/1 in a cross section of the metal particles.
13. The multilayer ceramic capacitor according to claim 12 , wherein at least some of the metal particles of the conductive resin layer are disposed in the at least some of the recesses.
14. The multilayer ceramic electronic component according to claim 13 , wherein
the metal of the sintered metal layer includes Cu;
the metal particles of the conductive resin layer includes Cu and/or Ag; and
the plating layer includes Ni plating layer.