IP Library Granted Patent US 9,947,835
Granted Patent B2
US 9,947,835 · App. 15/319,633 · Granted Apr 17, 2018

Light-emitting element and light-emitting package comprising same

Inventors: Jae Won Seo (Seoul, KR); Seok Beom Choi (Seoul, KR)
Assignee: LG INNOTEK CO., LTD.
H01L33/46H01L27/153H01L33/06H01L33/30H01L33/32H01L33/405H01L33/42H01L33/62F21K9/232F21Y2115/10G02B6/0073
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,947,835
App. No.
15/319,633
Granted
Apr 17, 2018
Kind
B2
Abstract

A light emitting device includes a substrate; a plurality of light emitting cells disposed on the substrate to be spaced apart from one another, the light emitting cell having a via hole passing through the second conductive type semiconductor layer, the active layer and a part of the first conductive type semiconductor layer; a first electrode layer electrically connected to the first conductive type semiconductor layer at a bottom of the via hole; a second electrode layer disposed on the second conductive type semiconductor layer; and a first passivation layer, electrically separating the first electrode layer from the second electrode layer, wherein the first electrode layer of one light emitting cell is electrically connected to the second electrode layer of another light emitting cell adjacent to the one light emitting cell.

Claims (39)

1. A light emitting device comprising:

a substrate;

a plurality of Light emitting structures disposed on the substrate, each light emitting structure comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, the light emitting structure having a recess passing through the second conductive type semiconductor layer, the active layer and a part of the first conductive type semiconductor layer;

a first electrode layer electrically connected to the first conductive type semiconductor layer at a bottom of an inside of the recess;

a second electrode layer electrically connected the second conductive type semiconductor layer;

a first passivation layer disposed from an upper surface of the first conductive type semiconductor layer to the inside of the recess; and

a second passivation layer disposed on the first electrode layer,

wherein the first passivation layer includes a first portion and a second portion each provided on an upper surface of the second conductive type semiconductor layer, the first portion is provided around an opening of the recess, has a curved edge, and covers the recess, and the second portion has a non-curved edge.

2. The light emitting device according to claim 1 , wherein each of the light emitting structures has a plurality of recesses including the recess, and the first passivation layer is disposed across the light emitting structures and connects the plurality of recesses.

3. The light emitting device according to claim 2 , wherein the first passivation layer directly contacts the substrate between the adjacent light emitting structures.

4. The light emitting device according to claim 1 , wherein the second passivation layer is disposed at entire regions surfaces of the light emitting structures, and the second passivation layer includes opened regions which expose at least one of the first electrode layers and the second electrode layers.

5. The light emitting device according to claim 4 , wherein the second passivation layer includes at least one of Si, N, Ti and O.

6. The light emitting device according to claim 1 , wherein each of the first electrode layers is an ohmic electrode including at least one of Al and Ag, and each of the second electrode layers includes a transparent electrode layer and a reflective layer.

7. The light emitting device according to claim 1 , wherein the first passivation layer has a reflective layer structure, in which a plurality of layers is stacked.

8. The light emitting device according to claim 7 , wherein the reflective layer structure including the stacked layers includes a distributed Bragg reflector.

9. A light emitting device comprising:

a substrate;

a plurality of light emitting, structures disposed on the substrate, each light emitting structure comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, the light emitting structure having a recess passing through the second conductive type semiconductor layer, the active layer and a part of the first conductive type semiconductor layer;

a first electrode layer electrically connected to the first conductive type semiconductor layer at a bottom of an inside of the recess;

a second electrode layer electrically connected to the second conductive type semiconductor layer;

a first passivation layer disposed from an upper surface of the first conductive type semiconductor layer to the inside of the recess; and

a second passivation layer arranged above the first electrode layer,

wherein a width of the first passivation layer at a first region around the recess is wider than a width of the first passivation layer at a second region, the second region partially provided around the first electrode, and

wherein an interface of the first passivation layer with the second conductive type semiconductor layer at a region adjacent to the recess has a curve.

10. The light emitting device according to claim 9 , wherein the first passivation layer is disposed between the second electrode layer, a sidewall of the recess, and a sidewall of the light emitting structure.

11. The light emitting device according to claim 10 , wherein the first passivation layer is further disposed at the substrate between adjacent light emitting structures.

12. The light emitting device according to claim 9 , wherein the second passivation layer is disposed at entire regions of surfaces of the light emitting structures, and

the second passivation layer includes opened regions which expose at least one of the first electrode layers and the second electrode layers.

13. The light emitting device according to claim 12 , wherein the second passivation layer includes at least one of Si, N, Ti and O.

14. The light emitting device according to claim 9 , wherein each of the first electrode layers is an ohmic electrode including at least one of Al and Ag, and each of the second electrode layers includes a transparent electrode layer and a reflective layer.

15. The light emitting device according to claim 9 , wherein the first passivation layer has a reflective layer structure, in which a plurality of layers is stacked.

16. A light emitting device comprising:

a substrate;

a plurality of light emitting structures disposed on the substrate, each light emitting structure comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, the light emitting structure having a recess passing through the second conductive type semiconductor layer, the active layer and a part of the first conductive type semiconductor layer;

a first electrode layer electrically connected to the first conductive type semiconductor layer at a bottom of an inside of the recess;

a second electrode layer electrically connected to the second conductive type semiconductor layer; and

a first passivation layer electrically separating the first electrode layer from the second electrode layer,

wherein the first passivation layer includes a first portion and a second portion each disposed on an upper surface of the second conductive type semiconductor layer, the first is portion is provided around an opening of the recess and has a curved edge and covering the recess, and the second portion has a non-curved edge,

wherein a plurality of the recesses is provided in each of the light emitting structure, and the first passivation layer is disposed across the light emitting structures and connects the plurality of the recesses.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 23, 2016
From: SEO, JAE WON; CHOI, SEOK BEOM
To: LG INNOTEK CO., LTD.
Reel/Frame 041187/0581 →
Priority Claims (1)
KR 10-2014-0072659 · Jun 16, 2014 · national
Continuity (1)
Related Publication 20170236979A1 · Aug 17, 2017