This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
1. An LED assembly, comprising:
a transparent mount comprising a top surface and a bottom surface opposite to the top surface;
an LED chip arranged on the top surface;
an electrode plate arranged on an edge of the top surface and electrically connected to the LED chip;
a first phosphor layer, comprising a first phosphor, and covering the LED chip, the top surface and a portion of the electrode plate; and
a second phosphor layer comprising a second phosphor, covering the bottom surface,
wherein the transparent mount and the electrode plate substantially have a same width.
2. The LED assembly of claim 1 , wherein the first phosphor layer and the second phosphor layer have different thicknesses.
3. The LED assembly of claim 1 , wherein the first phosphor layer is thicker than the second phosphor layer.
4. The LED assembly of claim 1 , wherein the first phosphor is identical to the second phosphor in chemical composition.
5. The LED assembly of claim 1 , wherein the second phosphor layer extends to a position right beneath the electrode plate.
6. The LED assembly of claim 1 , wherein the electrode plate has a first portion arranged between the first phosphor layer and the second phosphor layer, and a second portion not covered by either the first phosphor layer or the second phosphor layer.
7. The LED assembly of claim 1 , further comprising a circuit arranged on the top surface.
8. The LED assembly of claim 7 , wherein the LED chip is flipped on the circuit.
9. The LED assembly of claim 7 , wherein the first phosphor layer covering the circuit.
10. The LED assembly of claim 1 , further comprising a bonding wire electrically connected to the LED chip and the electrode plate.
11. The LED assembly of claim 1 , wherein the LED chip comprises a plurality of LED cells formed on a common substrate.
12. The LED assembly of claim 1 , wherein the transparent mount further comprises a mounting trench for mounting the LED chip thereon.
13. An LED bulb, comprising:
an LED assembly comprising:
a transparent mount comprising a top surface and a bottom surface opposite the top surface;
an LED chip arranged on the top surface;
an electrode plate arranged near an edge of the top surface, and electrically connected to the LED chip;
a first phosphor layer covering the LED chip and the top surface; and
a second phosphor layer covering the bottom surface;
a holding element physically connected to the first electrode plate; and
a transparent cover covering the LED assembly,
wherein the transparent mount and the electrode plate substantially have a same width.
14. The LED bulb of claim 13 , wherein the holding element comprises a clamp configured to fasten the LED assembly.
15. The LED bulb of claim 13 , wherein the holding element comprises a solid strip.
16. The LED bulb of claim 15 , wherein the solid strip comprises a notch.
17. The LED bulb of claim 13 , wherein the holding element is electrically connected to the electrode plate.
18. The LED bulb of claim 13 , wherein the LED bulb is configured to produce an omnidirectional light.
19. The LED bulb of claim 13 , wherein the first phosphor layer and the second phosphor layer have different thicknesses.
20. The LED bulb of claim 13 , wherein the second phosphor layer extends to a position right beneath the electrode plate.