Physical vapor deposition (PVD) target having low friction pads
Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.
1. A target assembly for a substrate processing chamber, comprising:
a plate comprising a first side including a central portion and a support portion, wherein the central portion is configured to support target source material; a plurality of recesses formed in the support portion; and
a plurality of pads partially disposed in the plurality of recesses, wherein each of the plurality of pads is secured to the support portion via a fastener disposed through the pad, wherein each of the plurality of pads includes a bearing surface, a countersunk recess having a first diameter that extends partially into a body of the pad, and a through hole having a second diameter that is smaller than the first diameter, and wherein a head of the fastener is disposed within the countersunk recess of the pad below the bearing surface.
2. The target assembly of claim 1 , wherein the plurality of recesses are circumferentially spaced around the plate.
3. The target assembly of claim 1 , wherein the plurality of recesses are similarly sized.
4. The target assembly of claim 1 , wherein the fastener is disposed in the countersunk recess and through hole.
5. The target assembly of claim 4 , wherein a shaft of the fastener is disposed through the through hole to secure the pad to the plate.
6. The target assembly of claim 1 , wherein each of the plurality of pads comprise a seating surface and a bearing surface, wherein, when the seating surface is supported on a bottom surface of a recess, the bearing surface is spaced above the first side of the plate.
7. The target assembly of claim 6 , wherein the bearing surface is spaced about 0.05 mm to about 1 mm above the first side.
8. The target assembly of claim 1 , wherein the plate includes a groove separating the support portion into an atmospheric side radially outward from the groove and a vacuum side radially inward from the groove.
9. The target assembly of claim 8 , wherein the plurality of recesses are formed in the atmospheric side.
10. The target assembly of claim 1 , wherein the plurality of pads are replaceable pads.
11. The target assembly of claim 1 , wherein the plurality of pads are formed from one or more of ultra-high-molecular-weight polyethylene or polyether ether ketone.
12. A target assembly for a substrate processing chamber, comprising:
a plate comprising a first side including a central portion and a support portion, wherein the central portion is configured to support target source material;
a groove formed in the plate separating the support portion into an atmospheric side radially outward from the groove and a vacuum side radially inward from the groove;
a plurality of recesses formed in the atmospheric side of the support portion and circumferentially spaced about the plate; and
a plurality of friction reducing pads partially disposed in the plurality of recesses such that a bearing surface is spaced above the first side of the plate, wherein each of the plurality of friction reducing pads is secured to the support portion via a fastener disposed through the pad, wherein each of the plurality of friction reducing pads includes a bearing surface, a countersunk recess having a first diameter that extends partially into a body of the pad, and a through hole having a second diameter that is smaller than the first diameter, and wherein a head of the fastener is disposed within the countersunk recess of the pad below the bearing surface.
13. The target assembly of claim 12 , wherein the groove is configured to retain a sealing element to facilitate formation of a seal between the atmospheric side and vacuum side.