Micro-hoses for integrated circuit and device level cooling

1. A heat-dissipating device comprising:

at least one heat-dissipating surface, and

a cooling channel formed directly on the at least one heat-dissipating surface;

wherein the cooling channel includes at least one fluid supply path and at least one fluid return path that extend over the at least-one heat-dissipating surface and carry a cooling medium, the at least one fluid supply path and the at least one fluid return path extending along a common plane that is adjacent and parallel to the one heat-dissipating surface, and

wherein the cooling channel is fluidly sealed to the at least one heat-dissipating surface, the cooling medium being in thermal contact directly with the heat-dissipating surface.

2. The heat-dissipating device of claim 1 , wherein the at least one fluid supply path and the at least one fluid return path are parallel to one another.

3. The heat-dissipating device of claim 1 , wherein the at least one fluid supply path and the at least one fluid return path are configured to overlap without mixing the cooling medium of each of the at least one fluid supply path and the at least one fluid return path.

4. The heat-dissipating device of claim 1 , wherein the cooling channel includes at least one additively manufactured micro-hose, the at least one fluid supply path being formed by a fluid supply micro-hose and the at least one fluid return path being formed by a fluid return micro-hose.

5. The heat-dissipating device of claim 4 , wherein the at least one micro-hose is formed of polyimide, epoxy, ultem, benzocyclobutene, nylon, polyetheretherketone, acrylonitrile-butadiene-styrene, acryl-based polymer, or polylactic acid.

6. The heat-dissipating device of claim 1 , wherein the heat-dissipating device includes a first heat-dissipating surface and a second heat-dissipating surface arranged on the first heat-dissipating surface, the at least one fluid passage being arranged over the first heat-dissipating surface and the second heat-dissipating surface.

7. The heat-dissipating device of claim 6 , wherein each of the first heat-dissipating surface and the second heat-dissipating surface includes a horizontal portion and a vertical portion, the cooling channel extending along the horizontal portion and the vertical portion of each of the first heat-dissipating surface and the second heat-dissipating surface, the cooling channel wrapping around the heat-dissipating device.

8. The heat-dissipating device of claim 1 , wherein each of the at least one fluid supply path and the at least one fluid return path has at least one exterior wall that defines the path, the exterior wall having a shape that is a triangle, pentagon, diamond, circle, or hemi-circle.

9. The heat-dissipating device of claim 8 , wherein the cooling channel has a shape that is complementary to the shape of the at least one fluid supply path and the at least one fluid return path.

10. The heat-dissipating device of claim 1 , wherein the heat-dissipating device includes at least one pumped coolant source that is in communication with the heat-dissipating surface via the cooling channel.

11. The heat-dissipating device of claim 1 , wherein the heat-dissipating device includes:

at least one surface to be heated; and

a heating mechanism formed directly on the at least one surface to be heated;

wherein the heating mechanism includes at least one fluid passage for carrying a heating medium, and

wherein the heating mechanism is fluidly sealed to the at least one surface, the heating medium being in thermal contact directly with the at least one surface.

12. The heat-dissipating device of claim 1 , wherein the at least one fluid supply path and the at least one fluid return path have a common shape.

13. A printed circuit board having at least one active or passive circuit, the printed circuit board comprising:

a printed wire board;

a cooling medium source; and

a cooling channel printed directly to the printed wire board, the cooling channel containing a fluid supply micro-hose and a fluid return micro-hose that are in fluid communication between the cooling medium source and the printed wire board, the fluid supply micro-hose delivering a cooling medium directly to the printed wire board,

wherein the fluid supply micro-hose and the fluid return micro-hose extend along a common plane that is adjacent and parallel to the printed wire board.

14. The printed circuit board of claim 13 , further including a monolithic microwave integrated circuit arranged on the printed wire board, wherein the cooling channel has a serpentine path that extends over the printed wire board and the monolithic integrated circuit.

15. A method of forming a heat-dissipating device comprising:

using an additive manufacturing process to form a cooling channel directly on a heat-dissipating surface of the heat-dissipating device,

wherein the cooling channel includes at least one fluid supply path and at least one fluid return path that extend over the at least-one heat-dissipating surface and carry a cooling medium to the heat-dissipating surface, the at least one fluid supply path and the at least one fluid return path extending along a common plane that is adjacent and parallel to the one heat-dissipating surface, and

wherein the cooling mechanism is fluidly sealed to the at least one heat-dissipating surface for direct thermal contact between the cooling medium and the at least one heat-dissipating surface.

16. The method of claim 15 , wherein using the additive manufacturing process includes at least one of 3D printing, dispensing, lithography, atomic layer deposition, stencil or screen printing, fused or vapor deposition, stamp transfer, sintering, and lamination.

17. The method of claim 15 , wherein forming the cooling channel includes forming a fluid supply micro-hose and a fluid return micro-hose, the fluid supply micro-hose configured to deliver the cooling medium to the at least one heat-dissipating surface.

18. The method of claim 17 , wherein forming the channel includes forming the fluid supply micro-hose and the fluid return micro-hose to be parallel with one another.

19. The method of claim 15 , wherein forming the heat-dissipating device includes forming a printed circuit board assembly.

20. The method of claim 19 , further including:

printing the cooling channel onto a printed wire board of the circuit board; and

printing the cooling channel onto a second circuit device arranged on the printed wire board,

wherein the cooling channel is in simultaneous thermal contact with the printed wire board and the second circuit device.