MEMS microphone package

1. A micro-electro-mechanical system (MEMS) microphone package comprising:

a multiple layer substrate;

an upper acoustic port formed through a plurality of upper layers of the multiple layer substrate and exposing an upper surface of a membrane portion;

a lower acoustic port formed through a plurality of lower layers of the multiple layer substrate and exposing a lower surface of the membrane portion;

a ring trench formed through at least one of the plurality of upper layers and exposing a metal ring;

a MEMS die located above the ring trench;

a copper pillar ring extending between the metal ring and the MEMS die; and

a solder pillar ring positioned on a first surface of the copper pillar ring, the copper pillar ring and solder pillar ring attaching the MEMS die to the metal ring.

2. The MEMS microphone package of claim 1 , wherein the membrane portion comprises a water resistant membrane.

3. The MEMS microphone package of claim 1 , wherein the first surface is a lower surface of the copper pillar ring.

4. The MEMS microphone package of claim 1 , further comprising:

a back cavity defined within the MEMS die and enclosed on an upper end portion by a cap positioned on an upper surface of the MEMS die.

5. The MEMS microphone package of claim 1 , wherein:

the plurality of upper layers includes a first upper metal layer and an upper solder mask on an upper surface of the first upper metal layer; and

a plastic overmold is positioned on an upper surface of the upper solder mask encasing the MEMS die.

6. The MEMS microphone package of claim 5 , wherein:

the plastic overmold extends within the ring trench.

7. The MEMS microphone package of claim 5 , further comprising:

at least one well extending through the upper solder mask; and

at least one input/output post extending downwardly from the MEMS die into the at least one well, the at least one input/output post including an upper copper post portion soldered within the at least one well using a solder post portion positioned on a lower surface of the upper copper post portion.

8. The MEMS microphone package of claim 7 , wherein:

the plurality of upper layers comprises a middle Pre-preg organic layer, and a lower metal layer;

the middle Pre-preg organic layer is located between the upper metal layer and the lower metal layer;

a respective contact pad formed in the upper metal layer is located within each of the at least one wells; and

the at least one input/output post is soldered to the respective contact pad.

9. The MEMS microphone package of claim 8 , further comprising:

a metal acoustic seal ring positioned in the lower acoustic port.

10. A method of forming a micro-electro-mechanical system (MEMS) microphone package comprising:

forming an upper acoustic port through a plurality of upper layers of a multiple layer substrate to expose an upper surface of a membrane portion;

forming a lower acoustic port through a plurality of lower layers of the multiple layer substrate to expose a lower surface of the membrane portion;

forming a ring trench through at least one of the plurality of upper Pre-preg layers to expose a metal ring;

positioning a MEMS die above the ring trench; and

attaching the MEMS die to the metal ring using a copper pillar ring extending between the metal ring and the MEMS die, and using a solder pillar ring positioned on a first surface of the copper pillar ring.

11. The method of claim 10 , wherein forming the upper acoustic port comprises:

forming the upper acoustic port through the plurality of upper layers of the multiple layer substrate to expose an upper surface of a water resistant membrane portion.

12. The method of claim 10 , further comprising:

inserting the solder pillar ring into the ring trench; and

reflowing the solder pillar ring.

13. The method of claim 10 , further comprising:

defining a back cavity within the MEMS die; and

enclosing an upper end portion of the back cavity with a cap.

14. The method of claim 10 , further comprising:

providing the multiple layer substrate with a first upper metal layer and an upper solder mask on an upper surface of the first upper metal layer; and

forming a plastic overmold on an upper surface of the upper solder mask thereby encasing the MEMS die.

15. The method of claim 14 , wherein forming the plastic overmold comprises:

flowing the plastic overmold within the ring trench.

16. The method of claim 15 , further comprising:

forming at least one well through the upper solder mask; and

positioning at least one input/output post extending downwardly from the MEMS die into the at least one well, the at least one input/output post including an upper copper post portion and a lower solder post portion; and

reflowing the lower solder post portion within the at least one well.

17. The method of claim 16 , further comprising:

forming at least one pad within the upper metal layer, wherein forming the at least one well comprises:

exposing the at least one pad.

18. The method of claim 17 , wherein providing the multiple layer substrate further comprises:

providing a multiple layer substrate with a middle Pre-preg organic layer, and a lower metal layer, the middle Pre-preg organic layer located between the upper metal layer and the lower metal layer.

19. The method of claim 18 , wherein forming a lower acoustic port comprises:

exposing a metal acoustic seal ring positioned on a lower pre-preg organic layer.