IP Library › Granted Patent US 9,964,451
Granted Patent B2
US 9,964,451 · App. 14/389,089 · Granted May 8, 2018

Temperature sensor

Inventors: Hiroshi Tanaka (Naka, JP); Hitoshi Inaba (Naka, JP); Kazuta Takeshima (Naka, JP); Noriaki Nagatomo (Naka, JP)
Assignee: MITSUBISHI MATERIALS CORPORATION
G01K7/226G01K7/22H01C7/008H01C7/04
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Quick Facts
Patent No.
US 9,964,451
App. No.
14/389,089
Granted
May 8, 2018
Kind
B2
Abstract

Provided is a temperature sensor which does not easily cause a crack in a Ti—Al—N-based thermistor material layer when the film is bent, can be directly deposited on a film or the like without firing, and has a high reliability with a high heat resistance. The temperature sensor includes an insulating film 2 , a thin film thermistor portion 3 made of a Ti—Al—N-based thermistor material formed on the insulating film, a pair of pattern electrodes 4 formed on the insulating film with a pair of opposed electrode portions 4 a being arranged so as to be opposed to each other on the thin film thermistor portion, wherein the pair of opposed electrode portions covers the entire surface of thin film thermistor portion excluding the region between the opposed electrode portions.

Claims (7)

1. A temperature sensor comprising:

an insulating film;

a thin film thermistor made of a Ti—Al—N-based thermistor material on the insulating film; and

a pair of pattern electrodes formed on the insulating film with a pair of opposed electrode portions being arranged so as to be opposed to each other on the thin film thermistor,

wherein the pair of the opposed electrode portions covers the entire surface of the thin film thermistor excluding the region between the opposed electrode portions.

2. The temperature sensor according to claim 1 , wherein the pair of opposed electrode portions further expands to the outside of an outer border of the thin film thermistor, and covers the surroundings of the thin film thermistor.

3. The temperature sensor according to claim 1 , wherein the thin film thermistor consists of a metal nitride represented by the general formula: Ti x Al y N z (where 0.70≤y/(x+y)≤0.95, 0.4≤z≤0.5, and x+y+z=1), wherein the crystal structure thereof is a hexagonal wurtzite-type single phase.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2014
From: TANAKA, HIROSHI; INABA, HITOSHI; TAKESHIMA, KAZUTA; NAGATOMO, NORIAKI
To: MITSUBISHI MATERIALS CORPORATION
Reel/Frame 033920/0216 →
Priority Claims (1)
JP 2012-081109 · Mar 30, 2012 · national
Continuity (1)
Related Publication 20150085898A1 · Mar 26, 2015