Semiconductor devices and inverter having the same
Disclosed are CMOS device and CMOS inverter. The CMOS device includes a substrate having active lines extending in a first direction and defined by a device isolation layer, the substrate being divided into an NMOS area, a PMOS area and a boundary area interposed between the NMOS and the PMOS areas and having the device isolation layer without the active line, a gate line extending in a second direction across the active lines and having a first gate structure on the active line in the first area, a second gate structure on the active line in the second and a third gate structure on the device isolation layer in the third area. The electrical resistance and parasitic capacitance of the third gate structure are smaller than those of the NMOS and the PMOS gate structures. Accordingly, better AC and DC performance of the CMOS device can be obtained.
1. A semiconductor device comprising:
a substrate divided into first and second areas and having a plurality of active lines that extends in a first direction, the plurality of active lines being defined by a device isolation layer, and
a gate line extending in a second direction across the plurality of active lines, the gate line including a first gate structure on a first active line in the first area of the substrate, a second gate structure on a second active line in the second area of the substrate, and a third gate structure on the device isolation layer in a third area of the substrate that is interposed between the first and the second areas and has no active lines,
wherein a composition of the third gate structure is different from those of the first and the second gate structures, and
wherein the first gate structure comprises a first dielectric layer and a first metal gate on the first dielectric layer;
the second gate structure comprises a second dielectric layer and a second metal gate on the second dielectric layer; and
the third gate structure comprises a barrier metal layer and a third metal gate on the barrier metal layer.
2. The semiconductor device of claim 1 , wherein a composition of the third metal gate is different from those of the first and the second metal gates.
3. The semiconductor device of claim 2 , wherein the first metal gate has a composition the same as that of the second metal gate.
4. The semiconductor device of claim 1 , wherein the third metal gate has a layer structure different from those of the first and the second metal gates.
5. The semiconductor device of claim 1 , wherein the third gate structure directly contacts with the first gate structure and the second gate structure in the second direction.
6. The semiconductor device of claim 1 , wherein the first and the second areas of the substrate have different conductivity type.
7. A semiconductor device comprising:
a substrate divided into first and second areas and having a plurality of active lines that extend in a first direction, the plurality of active lines being defined by a device isolation layer; and
a gate line extending in a second direction across the plurality of active lines, the gate line including a first gate structure on a first active line in the first area of the substrate, a second gate structure on a second active line in the second area of the substrate, and a third gate structure on the device isolation layer in a third area of the substrate that is interposed between the first and the second areas and has no active lines,
wherein the third gate structure directly contacts with the first gate structure and the second gate structure, and
wherein the first gate structure comprises a first dielectric layer and a first metal gate on the first dielectric layer;
the second gate structure comprises a second dielectric layer and a second metal gate on the second dielectric layer; and
the third gate structure comprises a barrier metal layer and a third metal gate on the barrier metal layer.
8. The semiconductor device of claim 7 , wherein a composition of the third metal gate is different from those of the first and the second metal gates.
9. The semiconductor device of claim 8 , wherein the first metal gate has a composition the same as that of the second metal gate.
10. The semiconductor device of claim 7 , wherein sidewalls of the third gate structure directly contact with sidewalls of the first and the second gate structures, respectively, in the second direction and a bottom surface of the third gate structure makes no contact with the first and the second gate structures.
11. A semiconductor device comprising:
a substrate divided into first and second areas and having a plurality of active fin lines that extend in a first direction, the plurality of active fin lines being defined by a device isolation layer, and
a gate line extending in a second direction across the plurality of active fin lines, the gate line including a first gate structure on a first active fin line in the first area of the substrate, a second gate structure on a second active fin line in the second area of the substrate, and a third gate structure on the device isolation layer in a third area of the substrate that is interposed between the first and the second areas and has no active fin lines,
wherein a composition of the third gate structure is different from those of the first and the second gate structures, and
wherein the first gate structure comprises a first dielectric layer and a first metal gate on the first dielectric layer;
the second gate structure comprises a second dielectric layer and a second metal gate on the second dielectric layer; and
the third gate structure comprises a barrier metal layer and a third metal gate on the barrier metal layer.
12. The semiconductor device of claim 11 , wherein a composition of the third metal gate is different from those of the first and the second metal gates.
13. The semiconductor device of claim 12 , wherein the first metal gate has a composition the same as that of the second metal gate.
14. The semiconductor device of claim 11 , wherein the third metal gate has a layer structure different from those of the first and the second metal gates.
15. The semiconductor device of claim 11 , wherein the third gate structure directly contacts with the first gate structure and the second gate structure in the second direction.
16. The semiconductor device of claim 11 , wherein the first and the second areas of the substrate have different conductivity type.