Signal block and double-faced cooling power module using the same
A signal block and a double-faced cooling power module that uses the signal block is provided. The signal block includes a plurality of signal clips that are formed in a ribbon shape to connect a first signal pad formed on a semiconductor chip and a second signal pad formed on a signal lead frame. An insulator fixes the position of the plurality of signal clips while spacing the signal clips apart from each other.
1. A signal block for a power module, comprising:
a plurality of signal clips formed in a ribbon shape that connect first signal pads formed on a semiconductor chip and second signal pads formed on a lead frame; and
an insulator that fixes the position of the plurality of signal clips while spacing the signal clips apart from each other,
wherein the insulator covers central portions of the plurality of signal clips and exposes opposite ends of each of the signal clips, and
wherein the insulator does not contact the semiconductor chip and the lead frame.
2. The signal block of claim 1 , wherein each of the signal clips is formed in a copper ribbon and spaced apart from a board connected to the semiconductor chip.
3. The signal block of claim 2 , wherein the insulator has a width greater than a sum of widths of the plurality of signal clips and has a greater thickness than each of the signal clips, to prevent contact of the plurality of signal clips with the board.
4. The signal block of claim 3 , wherein the insulator is coupled to the board.
5. A double-faced cooling power module with a semiconductor chip disposed between first and second boards, comprising:
a signal block including:
a plurality of signal clips formed in a ribbon shape that connect first signal pads formed on a semiconductor chip and second signal pads formed on a lead frame;
an insulator that fixes the position of the plurality of signal clips while spacing the signal clips apart from each other; and
a power clip coupled to the semiconductor chip and configured to supply electric power,
wherein the insulator covers central portions of the plurality of signal clips and exposes opposite ends of each of the signal clips, and
wherein the insulator does not contact the semiconductor chip and the lead frame.
6. The power module of claim 5 , wherein the signal clip is formed in a copper ribbon and is spaced apart from the first and second boards.
7. The power module of claim 5 , wherein:
the signal clip includes:
a plurality of signal clips, wherein a first end of each of the signal clips is coupled to the semiconductor chip and a second end of each of the signal clips is coupled to the lead frame, and
the signal block includes an insulator that fixes the position of the plurality of signal clips while spacing the signal clips apart from each other.
8. The power module of claim 7 , wherein the insulator has a width greater than a sum of widths of the plurality of signal clips, and has a thickness greater than each of the signal clips, and is disposed to prevent contact of the plurality of signal clips with the first and second boards.
9. The power module of claim 7 , wherein the semiconductor chip includes:
a plurality of first signal pads disposed on a first side of a flat surface; and
a power pad disposed on a second side of the flat surface.
10. The power module of claim 8 , wherein the insulator is coupled to either or both of the first and second boards.
11. The power module of claim 9 , wherein: the lead frame includes: a plurality of second signal pads on a surface thereof, wherein the semiconductor chip is coupled to a flat surface of the first board, the power clip is coupled to the power pad, and the second board is coupled to a flat surface of the power clip, and
wherein the plurality of signal clips connects the plurality of first signal pads and the plurality of second signal pads to each other, respectively.