IP Library › Granted Patent US 9,972,919
Granted Patent B2
US 9,972,919 · App. 14/915,026 · Granted May 15, 2018

Antenna apparatus and electronic device having same

Inventors: Won-Bin Hong (Seoul, KR); Kwang-Hyun Baek (Anseong-si, KR); Yoon-Geon Kim (Busan, KR)
Assignee: Samsung Electronics Co., Ltd.
H01Q21/293H01Q1/38H01Q1/521H01Q9/0407H01Q15/0086
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Quick Facts
Patent No.
US 9,972,919
App. No.
14/915,026
Granted
May 15, 2018
Kind
B2
Abstract

According to embodiments of the present invention, an antenna apparatus and an electronic device having the same are provided with a circuit board comprising a plurality of layers; and a plurality of via-holes formed in the plurality of layers, wherein the plurality of via-holes in one layer are arranged in one direction (“horizontal direction”) and the plurality of via-holes respectively line up with a plurality of via-holes in another layer, thereby forming a grid-type radiation member. The antenna apparatus and the electronic device having the same according to the present invention can be realized through various different embodiments.

Claims (39)

1. An antenna apparatus comprising:

a circuit board constituted by a plurality of layers;

a plurality of first via holes formed in each of the layers;

a plurality of radiating members disposed on the circuit board; and

an isolation element provided between the plurality of radiating members, respectively, the isolation element including a plurality of second via holes being formed in each of the layers,

wherein the via holes arranged in a first layer in a first horizontal direction are aligned with the first via holes formed in another layer to form a grid pattern patch type radiating member, and

wherein the second via holes are arranged in the first layer in a perpendicular second horizontal direction to that in which the first via holes are arranged.

2. The antenna apparatus of claim 1 , further comprising:

via pads provided between the first layer and a second layer adjacent thereto,

wherein the via pads connect the first via holes formed in the first layer and the first via holes formed in the second layer.

3. The antenna apparatus of claim 1 , further comprising:

a feed line provided on the circuit board,

wherein the feed line is connected to one of the first via holes.

4. The antenna apparatus of claim 3 ,

wherein the feed line is connected to a location spaced a distance of 0.07λ to 0.12λ apart from one end of the arrangement of the first via holes in the horizontal direction, and

wherein ‘λ’ denotes the resonant frequency of the radiating member.

5. The antenna apparatus of claim 1 , wherein at least one of a feed line or a ground part is provided to a layer that is located on the surface of the circuit board among the layers.

6. The antenna apparatus of claim 1 , wherein the radiating members are arranged along an edge of the circuit board.

7. The antenna apparatus of claim 1 , wherein the radiating members receive a feed signal with a phase difference, respectively.

8. The antenna apparatus of claim 1 ,

wherein the second via holes formed in one layer are aligned with the second via holes formed in another layer to form a grid type isolation element.

9. The antenna apparatus of claim 8 , wherein the isolation element further comprises second via pads provided between a first layer among the layers and a second layer adjacent to the first layer, and the second via pads connect the second via holes formed in the first layer and the second via holes formed in the second layer.

10. The antenna apparatus of claim 9 , wherein the isolation element further comprises at least one slot formed in each of the second via pads.

11. The antenna apparatus of claim 9 , wherein the isolation element further comprises:

at least one slot formed in each of the second via pads; and

a line portion provided in the slot.

12. The antenna apparatus of claim 1 , wherein the isolation element includes an artificial magnetic conductor (AMC) element.

13. An electronic device equipped with an antenna apparatus, comprising:

a housing:

at least one circuit board accommodated in the housing and comprised of a plurality of layers;

a plurality of first via holes formed in each of the layers;

a plurality of radiating members disposed on the circuit board; and

an isolation element provided between the plurality of radiating members, respectively, the isolation element including a plurality of second via holes being formed in each of the layers,

wherein the first via holes arranged in one layer in a horizontal direction are aligned with the first via holes formed in another layer to form a grid pattern patch type radiating member of the antenna apparatus, and

wherein the second via holes are arranged in the first layer in a perpendicular second horizontal direction to that in which the first via holes are arranged.

14. The electronic device of claim 13 , wherein the radiating member is disposed on an edge of the circuit board so as to be located adjacent to one end portion of the housing.

15. The electronic device of claim 13 , wherein the plurality of radiating members are arranged along an edge of the circuit board so as to be located adjacent to one end portion of the housing.

16. The electronic device of claim 15 , wherein the electronic device provides power supply with a phase difference to the radiating members.

17. The electronic device of claim 13 , wherein the isolation element includes an artificial magnetic conductor (AMC) element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2016
From: HONG, WON-BIN; BAEK, KWANG-HYUN; KIM, YOON-GEON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 037842/0553 →
Priority Claims (1)
KR 10-2013-0112353 · Sep 23, 2013 · national
Continuity (1)
Related Publication 20160211586A1 · Jul 21, 2016