Curved wafer processing method and apparatus
An apparatus for and a method of forming a semiconductor structure is provided. The apparatus includes a substrate holder that maintains a substrate such that the processing surface is curved, such as a convex or a concave shape. The substrate is held in place using point contacts, a plurality of continuous contacts extending partially around the substrate, and/or a continuous ring extending completely around the substrate. The processing may include, for example, forming source/drain regions, channel regions, silicides, stress memorization layers, or the like.
1. A substrate holder comprising:
one or more wafer support surfaces, the one or more wafer support surfaces configured to collectively provide a non-planar wafer support surface; and
one or more connectors configured to hold a wafer on the wafer support surfaces.
2. The substrate holder of claim 1 , further comprising a vacuum port exposed to the non-planar wafer support surface.
3. The substrate holder of claim 1 , wherein the one or more connectors comprise a continuous ring around a periphery of the one or more wafer support surfaces.
4. The substrate holder of claim 1 , wherein the one or more connectors comprise a plurality of point contacts.
5. The substrate holder of claim 1 , wherein the one or more wafer support surfaces form a convex surface.
6. The substrate holder of claim 1 , wherein the one or more wafer support surfaces form a concave surface.
7. A substrate holder comprising:
a plurality of wafer contact points, at least one of the plurality of wafer contact points being non-planar with remaining ones of the plurality of wafer contact points, the plurality of wafer contact points collectively form a non-planar contact surface configured to simultaneously contact a single major surface of a wafer; and
one or more clamps along a perimeter of the plurality of wafer contact points, the one or more clamps configured to secure a wafer on the plurality of wafer contact points.
8. The substrate holder of claim 7 , wherein the non-planar contact surface having a non-linear surface along a first axis and a linear surface along a second axis.
9. The substrate holder of claim 8 , wherein the second axis intersects a center of the non-planar contact surface.
10. The substrate holder of claim 9 , wherein the center is higher than a periphery of the non-planar contact surface along an axis perpendicular to the second axis and intersecting the center.
11. The substrate holder of claim 9 , wherein the center is lower than a periphery of the non-planar contact surface along an axis perpendicular to the second axis and intersecting the center.
12. The substrate holder of claim 7 , wherein the non-planar contact surface having a peripheral region in a single plane and a central region non-planar with the peripheral region.
13. The substrate holder of claim 12 , wherein the central region is higher than the peripheral region.
14. The substrate holder of claim 12 , wherein the central region is lower than the peripheral region.
15. A substrate holder comprising:
a plurality of wafer contact points, the plurality of wafer contact points collectively forming a non-planar contact surface, each of the plurality of wafer contact points configured to contact a same side of a wafer; and
one or more clamps along a perimeter of the non-planar contact surface, the one or more clamps configured to secure a wafer to the non-planar contact surface.
16. The substrate holder of claim 15 , wherein a periphery of the non-planar contact surface is planar.
17. The substrate holder of claim 15 , wherein a periphery of the non-planar contact surface is non-planar.
18. The substrate holder of claim 15 , wherein the one or more clamps comprise a first clamp and a second clamp, the first clamp being on an opposing side of the non-planar contact surface from the second clamp, the substrate holder being free of other clamps.
19. The substrate holder of claim 15 , wherein the one or more clamps comprise a first clamp, a second clamp, a third clamp, and a fourth clamp, the first clamp being on an opposing side of the non-planar contact surface from the second clamp, the third clamp being on an opposing side of the non-planar contact surface from the fourth clamp, the substrate holder being free of other clamps.
20. The substrate holder of claim 15 , wherein the one or more clamps comprise more than four clamps arranged around a periphery of the non-planar contact surface.