Light emitting device with phosphor layer

1. A light emitting device, comprising:

a board including a mounting portion;

a light emitting element mounted on the mounting portion of the board;

a phosphor layer in a substantially uniform thickness composed of a plurality of layers formed on a surface of the light emitting element; and

a cover layer that contains light reflecting material at a place on the board where the light emitting element is not mounted, the cover layer covering the phosphor layer, wherein

the board defines a groove disposed adjacent to an outer periphery of the mounting portion.

2. The light emitting device according to claim 1 , wherein the thickness of the phosphor layer is from 10 μm to 200 μm.

3. The light emitting device according to claim 1 , wherein the number of each layer in the plurality of layers of the phosphor layer is 1 to 20.

4. The light emitting device according to claim 1 , wherein the thickness of each layer in the plurality of layers of the phosphor layer is from 5 μm to 20 μm.

5. The light emitting device according to claim 1 , wherein the thickness of the cover layer is from 10 μm to 30 μm.

6. The light emitting device according to claim 1 , wherein the cover layer is formed as a single member, or as multiple layers.

7. The light emitting device according to claim 1 , wherein the cover layer further contains a binder, a color fixative, a light diffusing agent, or a filler in addition to the light reflecting material.

8. The light emitting device according to claim 1 , wherein the light emitting element, the phosphor layer, and the cover layer are sealed with a transmissive resin or other such sealing member.

9. The light emitting device according to claim 8 , wherein the transmissive resin is a hemispherical shape.

10. The light emitting device according to claim 8 , wherein the transmissive resin is in a shape that combines a substantially cuboid shape, a hemispherical shape, and a plurality of hemispheres.

11. A light emitting device, comprising:

a board including a mounting portion;

a light emitting element mounted on the mounting portion of the board;

a cover layer that contains light reflecting material at a place on the board where the light emitting element is not mounted, an upper surface of the cover layer being disposed closer to the board than an upper surface of the light emitting element; and

a phosphor layer in a substantially uniform thickness composed of a plurality of layers formed on a surface of the light emitting element, wherein

the board defines a groove disposed adjacent to an outer periphery of the mounting portion.

12. The light emitting device according to claim 11 , wherein the thickness of the phosphor layer is from 10 μm to 200 μm.

13. The light emitting device according to claim 11 , wherein the number of each layer in the plurality of layers of the phosphor layer is 1 to 20.

14. The light emitting device according to claim 11 , wherein the thickness of each layer in the plurality of layers of the phosphor layer is from 5 μm to 20 μm.

15. The light emitting device according to claim 11 , wherein the thickness of the cover layer is from 10 μm to 30 μm.

16. The light emitting device according to claim 11 , wherein the cover layer is formed as a single member, or as multiple layers.

17. The light emitting device according to claim 11 , wherein the cover layer further contains a binder, a color fixative, a light diffusing agent, or a filler in addition to the light reflecting material.

18. The light emitting device according to claim 11 , wherein the light emitting element, the phosphor layer, and the cover layer are sealed with a transmissive resin or other such sealing member.

19. The light emitting device according to claim 18 , wherein the transmissive resin is a hemispherical shape.

20. The light emitting device according to claim 18 , wherein the transmissive resin is in a shape that combines a substantially cuboid shape, a hemispherical shape, and a plurality of hemispheres.