Organic light emitting display device and method of fabricating the same
The present disclosure relates to an organic light emitting display device including a substrate having an outer part and a display part, a driving thin film transistor on each of a plurality of pixel regions within the display part of the substrate, a pixel electrode on each pixel region of the display part, an organic light emitting unit on each pixel region of the display part to emit light, a common electrode on the organic light emitting unit and a bank layer to apply a signal to the organic light emitting layer, and a first passivation layer, an organic insulating layer and a second passivation layer on the outer part and the display part, wherein the first passivation layer and the second passivation layer are removed from the outermost region of the outer part, so that the substrate is exposed to the outside.
1. A method for fabricating an organic light emitting display device comprising:
providing a mother substrate having a plurality of panel regions;
attaching a substrate onto each panel region of the mother substrate, the substrate having a display part and an outer part;
forming an organic light emitting structure on the display part of the substrate;
forming a first passivation layer on the display part of the substrate and a partial region of the outer part;
forming an organic layer on the first passivation layer;
forming a second passivation layer on the display part on the organic layer and the partial region of the outer part, wherein the first passivation layer and the second passivation layer are absent at an outermost region of the outer part of each panel region; and
dividing the mother substrate into the plurality of panel regions by cutting the mother substrate between adjacent ones of the plurality of panel regions of the mother substrate where the first passivation layer and the second passivation layer are absent.
2. The method of claim 1 , wherein the organic light emitting structure is formed on a plurality of pixel regions of the display part of the substrate, and the forming of the organic light emitting structure comprises:
forming a thin film transistor on each pixel region;
forming a first electrode on each pixel region;
forming an organic light emitting unit on the first electrode, the organic light emitting unit emitting light; and
forming a second electrode on the organic light emitting unit.
3. The method of claim 1 , wherein the substrate is a flexible substrate.
4. The method of claim 1 , wherein the cutting of the mother substrate comprises cutting the mother substrate using a cutting wheel.
5. The method of claim 1 , wherein the cutting of the mother substrate comprises cutting the mother substrate by irradiating laser beams.
6. The method of claim 1 , wherein the mother substrate is a glass substrate.
7. The method of claim 1 , wherein after forming the second passivation layer, the mother substrate is exposed to an outside of the organic light emitting display device between the adjacent ones of the plurality of panel regions.
8. The method of claim 1 , further comprising:
separating the mother substrate from the substrate.
9. The method of claim 8 , wherein the separating the mother substrate from the substrate comprises irradiating laser beams from a rear surface of the mother substrate.
10. The method of claim 1 , wherein the first passivation layer and the second passivation layer are both made of a same material.
11. The method of claim 10 , wherein the first passivation layer and the second passivation layer are both made of SiO 2 or SiN x .