IP Library › Granted Patent US 9,982,144
Granted Patent B2
US 9,982,144 · App. 15/100,588 · Granted May 29, 2018

Silver-coated conductive particles, conductive paste and conductive film

Inventor: Kensuke Kageyama (Akita, JP)
Assignee: MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD.
C09D5/24C08J3/128C08K9/10C09D7/40C09D7/63C09D7/65C09D7/69C09D7/70C09D11/52C09D163/00C09J7/00C09J9/02C09J11/00C09J11/04C09J11/06C09J11/08C09J201/00C23C18/16C23C18/165C23C18/1633C23C18/1641C23C18/31C23C18/42C23C18/44C23C18/52H01B1/02H01B1/22C08J2325/06C08J2333/00C08J2361/06C08K2201/001C09J2203/318
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Quick Facts
Patent No.
US 9,982,144
App. No.
15/100,588
Granted
May 29, 2018
Kind
B2
Abstract

Provided are highly reliable silver-coated conductive particles, which are prevented from an occurrence of migration, the silver-coated conductive particles in which: a tin layer is formed on a surface of each spherical base particle, and a silver plating layer is formed on a surface of the tin layer, and a surface of the silver plating layer is coated with a water repellent layer: the water repellent layer includes an organic sulfur compound that is mainly composed of a sulfide compound or a surfactant such as polyoxyethylene ethers: and a molded body that is formed by pressing the silver-coated conductive particles at a pressure of 14.7 MPa has a contact angle with water of 125 degree or more.

Claims (13)

1. Silver-coated conductive particles comprising:

spherical base particles, wherein

a tin layer is formed on a surface of each of the spherical base particles,

a silver plating layer is formed on a surface of the tin layer, and

a water repellent layer is coated on a surface of the silver plating layer, said water repellent layer comprising an organic sulfur compound or a surfactant.

2. The silver-coated conductive particles according to claim 1 , wherein the silver-coated conductive particles are formed as a molded body by being pressed at a pressure of 14.7 MPa, said molded body having a contact angle with water of 125 degree or more.

3. The silver-coated conductive particles according to claim 1 , wherein the organic sulfur compound includes a sulfide compound.

4. The silver-coated conductive particles according to claim 3 , wherein the sulfide compound is dialkyl sulfide.

5. The silver-coated conductive particles according to claim 1 , wherein the surfactant is polyoxyethylene ethers.

6. The silver-coated conductive particles according to claim 1 , wherein each of the conductive particles has a diameter that is 0.5 μm or more and 30 μm or less.

7. The silver-coated conductive particles according to claim 1 , wherein the base particles are made of a material selected from the group consisting of acrylic resin, urethane resin, styrene resin, phenolic resin, silica, and alumina.

8. A conductive paste comprising the silver-coated conductive particles according to claim 1 .

9. A conductive film comprising the silver-coated conductive particles according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2016
From: KAGEYAMA, KENSUKE
To: MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD.
Reel/Frame 038753/0777 →
Priority Claims (1)
JP 2013-264691 · Dec 20, 2013 · national
Continuity (1)
Related Publication 20160304728A1 · Oct 20, 2016